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DOE OSTI · 2574889

AI‐Driven Defect Engineering for Advanced Thermoelectric Materials

Abstract

Thermoelectric materials offer a promising pathway to directly convert waste heat to electricity. However, achieving high performance remains challenging due to intrinsic trade-offs between electrical conductivity, the Seebeck coefficient, and thermal conductivity, which are further complicated by the presence of defects. This review explores how artificial intelligence (AI) and machine learning (ML) are transforming thermoelectric materials design. Advanced ML approaches including deep neural networks, graph-based models, and transformer architectures, integrated with high-throughput simulations and growing databases, effectively capture structure-property relationships in a complex multiscale defect space and overcome the “curse of dimensionality”. This review discusses AI-enhanced defect engineering strategies such as composition optimization, entropy and dislocation engineering, and grain boundary design, along with emerging inverse design techniques for generating materials with targeted properties. Finally, it outlines future opportunities in novel physics mechanisms and sustainability, highlighting the critical role of AI in accelerating the discovery of thermoelectric materials.

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Fu, Chu‐Liang [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)], Cheng, Mouyang [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)], Hung, Nguyen Tuan [Tohoku University, Sendai (Japan)], Rha, Eunbi [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)], Chen, Zhantao [SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States); Stanford University, CA (United States)], Okabe, Ryotaro [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)], Carrizales, Denisse Córdova [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)], Mandal, Manasi [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)], Cheng, Yongqiang [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)], Li, Mingda [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)] (ORCID:0000000270556368). 2025-06-23. AI‐Driven Defect Engineering for Advanced Thermoelectric Materials. https://doi.org/10.1002/adma.202505642

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36 MATERIALS SCIENCE