Low-temperature electroplating of zirconium: Ionic mixture methods

Abstract

Non-aqueous ionic mixture electroplating allows for room-temperature or near-room-temperature applications of thin metal films, typically metals for which aqueous solvents cannot be used. While there are many methods of plating zirconium, each has disadvantages that ionic liquid plating could correct. However, ionic liquid plating requires further research and development, as a new class of solvents were only developed a few years ago. Current ionic liquids cost several thousand dollars per liter, yet produce films with less than 90% surface coverage as well as deposition of salt species that enable interdiffusion through the Zr. Film coverage needs to be increased while maintaining approximate room temperatures and lower solvent costs. Current ionic liquid technology has suffered from poor surface wetting and limited Zr diffusivity leading to dendrite formation which inhibits total surface coverage. Zr electroplating can be improved by application of room-temperature ionic mixtures as the plating medium. We have successfully demonstrated the capability to plate high-quality metallic zirconium layers using deep eutectic solvents (DES) and DES-ionic liquid (IL) mixtures. Plating thicknesses of up to 6 microns have been achieved, and the coatings are conformal to the substrate and not dendritic, with low contamination from the plating solution. Our current method uses the DES ethaline (a 1:2 ratio of choline chloride and ethylene glycol) to complex zirconium (IV) ions (present via the addition of ZrF4). We pulse plate the Zr from a bath with an overabundance of LiF, in accordance with prior literature. We have also had success in mixing the DES with ILs, such as Triethylsulfonium bis(trifluoromethylsulfonyl)imide, 1-Butyl-3-methylpyridinium bis(trifluormethylsulfonyl)imide, Methyl-trioctylammonium bis(trifluoromethylsulfonyl)imide, and Diethylmethyl(2-methoxyethyl)ammonium bis(trifluoromethylsulfonyl)imide.