@misc{indiciaedc792729b85c,
  title = {High Density Chip Interconnect Technology Using High Density Glass Interposers},
  author = {Fahim, Farah},
  year = {2019},
  doi = {10.2172/1569232},
  url = {https://www.osti.gov/biblio/1569232},
  note = {Source identifier: 1569232}
}