Diffusive crack growth at a bimaterial interface

Abstract

The diffusional microcrack growth behavior in a bimaterial system is investigated with an aim at estimating service life of advanced ceramic composites under creep-rupture conditions. The crack is assumed to grow via a coupled surface and grain-boundary diffusion under steady state conditions. The tensile stress distribution along the interface ahead of the moving crack tip is solved, and it is found that a new length parameter exists as a scaling factor for which the solution becomes identical to the single phase case when plotted on the nondimensional physical plane. In contrast to the elastic stress solution which shows singularity at the tip, together with oscillatory character away from the tip, the creep stresses have a peak value away from the tip due to a wedging effect and interfacial sliding eliminates stress oscillation resulting in a decoupling between mode I and mode II loading. This solution ties the far-field loading parameter to the crack tip conditions in terms of the unknown crack velocity to give a specific V-K(1) relationship. It is shown that an exponent of 12 in the conventional crack growth power law emerges at the higher applied stress range.