Lee, Sanboh | Engineering Papers

NASA NTRS1992

Asymmetric tip morphology of creep microcracks growing along bimaterial interfaces

The asymmetric tip morphology of a creep microcrack propagating along a bimaterial interface is presented based on the assumptions that the near-tip shapes are developed from surface diffusion controlled crack growth and that a steady state prevails. A single master curve still can adequately describe the near-tip shapes to within 6 percent accuracy, but four cases of crack-tip morphology emerge depending on the ratios of surface to interfacial free energy and diffusivity of the adjoining phases. For fixed ratios of the two surface diffusivities, crack tip morphology maps in the space of specific surface energies are constructed with which areas associated with each individual case are indicated. Predicted cases on a set of bimaterial systems are tabulated and discussed.

Chuang, Tze-Jer↗

NASA NTRS1992

Diffusive crack growth at a bimaterial interface

The diffusional microcrack growth behavior in a bimaterial system is investigated with an aim at estimating service life of advanced ceramic composites under creep-rupture conditions. The crack is assumed to grow via a coupled surface and grain-boundary diffusion under steady state conditions. The tensile stress distribution along the interface ahead of the moving crack tip is solved, and it is found that a new length parameter exists as a scaling factor for which the solution becomes identical to the single phase case when plotted on the nondimensional physical plane. In contrast to the elastic stress solution which shows singularity at the tip, together with oscillatory character away from the tip, the creep stresses have a peak value away from the tip due to a wedging effect and interfacial sliding eliminates stress oscillation resulting in a decoupling between mode I and mode II loading. This solution ties the far-field loading parameter to the crack tip conditions in terms of the unknown crack velocity to give a specific V-K(1) relationship. It is shown that an exponent of 12 in the conventional crack growth power law emerges at the higher applied stress range.

Chuang, Tze-Jer↗