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Saint Clair, T. L.

Publications and source records attributed to Saint Clair, T. L..

11 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Improved melt flow and physical properties of Mitsui Toatsu's LARC-TPI 1500 series polyimide

The basic thermal properties and melt behavior of an improved form of LARC-TPI polyimide, LARC-TPI 1500, are investigated and compared with those of LARC-TPI 1000 and 2000. The LARC-TPI 1500 powders are thermally stable and melt processable. The absolute molecular weight of the polymer varies from 20,000 to 30,000, indicating recurring unit numbers of about 40-60. The melt flow properties of LARC-TPI 1500 are comparable to those of other engineering plastics, such as PEEK, PSU, and PES. The flexural modulus of injection molded parts of LARC-TPI 1500 is the highest among commercial thermoplastic polymers.

Ohta, Masahiro↗
NASA NTRS1988

Characterization of a semicrystalline polyimidesulfone powder

A semicrystalline polyimidesulfone (PISO2) material has been synthesized and characterized. Characterization methods include thermal analysis by DSC and measurements of inherent viscosities, wide-angle X-ray diffraction, and viscoelasticity. The melt flow properties of both amorphous and semicrystalline samples were also investigated by means of a parallel plate plastometer. This material was found to be not readily recrystallizable at temperatures above its initial peak melting point of 225 C, when compared to other crystalline thermoplastics. This semicrystalline PISO2 demonstrated a flow about 5 times greater than the amorphous one as characterized by the plastometer. Such enhanced melt flow properties could be of great benefit in the adhesive and composite lamination processes.

Hou, T. H.↗
NASA NTRS1982

Addition polyimide adhesives containing various end groups

Addition polyimode oligomers have been synthesized from 3,3 prime, 4,4 prime-benzophenone tetracarboxylic acid dianhydride and 3,3 prime-methylenedianiline using a variety of latent crosslinking groups as end-caps. The nominal 1300 molecular weight imide prepolymers were isolated and characterized for solubility in amide, chlorinated and ether solvents, melt-flow and cure properties, glass transition temperature, and thermal stability on heating in an air atmosphere. Adhesive strengths of the polyimides were obtained both at ambient and elevated temperatures before and after aging at 232 C. Properties of the novel addition polyimides were compared to a known nadic end-capped adhesive, LARC-13.

Saint Clair, A. K.↗
NASA NTRS1981

A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber is also discussed.

Saint Clair, A. K.↗
NASA NTRS1981

Addition polyimide adhesives containing ATBN and silicone elastomers

A study was conducted to determine the effects of added elastomers on the thermal stability, adhesive strength, and fracture toughness of LARC-13, a high-temperature addition polyimide adhesive. Various butadiene/acrylonitrile and silicon elastomers were incorporated into the polyimide resin either as physical polyblends, or by chemically reacting the elastomers with the polyimide backbone. Adhesive single lap-shear and T-peel strengths were measured before and after ageing at elevated temperature. A tapered double-cantilever beam specimen was used to determine the fracture toughness of the elastomer-modified polyimide adhesives.

Saint Clair, A. K.↗
NASA NTRS1981

A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber will also be discussed.

Saint Clair, A. K.↗
NASA NTRS1980

Elastomer-toughened polyimide adhesives

A study has been conducted to determine the effects of added elastomers on the Tg, thermal stability, adhesive strength, and fracture toughness of LARC-13, a high-temperature addition polyimide adhesive. Various butadiene/acrylonitrile and silicone elastomers were incorporated into the polyimide resin (1) as physical polyblends, and (2) by chemically reacting the elastomers with the polyimide backbone. Adhesive single lap-shear and T-peel strengths were measured before and after aging at elevated temperature. A tapered double-cantilever beam specimen was used to determine the fracture toughness of the elastomer-modified polyimide adhesives.

Saint Clair, A. K.↗
NASA NTRS1979

LARC-13 polyimide adhesive bonding

The development of an addition-curing polyimide adhesive suitable for low pressure bonding without the generation of volatiles during cure is reported. LARC-13 is designed for bonding of polyimide matrix composites and of titanium to be used above 500 F, and is based on an oligomeric bis-nadimide which allows its processing at 50 psi or less, making it suitable for the bonding of fragile honeycomb sandwich structures. Few volatiles are evolved during its cure allowing large enclosed structures to be bonded, and it has high room and elevated temperature strengths and good strength retention after short terms up to 1100 F. LARC-13 was successfully used to bond the outer and inner skins of a polyimide/graphite wing shear panel for 500 F use, and for a short-term exposure up to 1100 F. Preparation of the adhesive, bonding, aging, and testing of lap shear and honeycomb samples are discussed.

Saint Clair, T. L.↗
NASA NTRS1978

High temperature adhesives for bonding Kapton

Experimental polyimide resins have been developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of 'Kapton'/'Kapton' bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575K (575 F) in vacuum. Glass transition temperatures of the polyimide/'Kapton' bondlines were monitored by thermomechanical analysis.

Saint Clair, A. K.↗
NASA NTRS1977

Crystalline polyimides containing 4,4'-bis/3,4-dicarboxyphenoxy/diphenyl sulfide dianhydride

A high degree of crystallinity has been found in unoriented polymer films formed from 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride (BDSDA) and p-phenylenediamine (PDA). Partial crystallinity for a polymer containing BDSDA and benzidine is also reported. A study of the thermal properties of the crystalline polyimides shows crystalline melting points of 426 C and 483 C respectively for the BDSDA-PDA and the BDSDA-benzidine polymers.

Saint Clair, T. L.↗