ID wafering technology

Abstract

Improvements in ID saws leading to lower costs for producing silicon wafers for solar cells are described. The relationships between crystal size and blade size and between the length of time it takes to slice a wafer and wafer thickness are discussed. The influence of ingot production methods on wafering performance is considered. A cost sensitivity analysis of slicing a 10 cm square ingot and economic analyses of slicing a four inch and a six inch ingot are presented. A wafering cost model based on the IPEG 2 is given.