NASA NTRS · 19780009262
Polyimide adhesives
Abstract
A process was developed for preparing aromatic polyamide acids for use as adhesives by reacting an aromatic dianhydride to an approximately equimolar amount of an aromatic diamine in a water or lower alkanol miscible ether solvent. The polyamide acids are converted to polyimides by heating to the temperature range of 200 - 300 C. The polyimides are thermally stable and insoluble in ethers and other organic solvents.
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Progar, D. J., Bell, V. L., Stclair, T. L.. 1977-12-27. Polyimide adhesives. https://ntrs.nasa.gov/citations/19780009262
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