Engineering topics

Progar, D. J.

Publications and source records attributed to Progar, D. J..

At least 19 records

NASA NTRS1994

Preliminary evaluation of hybrid titanium composite laminates

In this study, the mechanical response of hybrid titanium composite laminates (HTCL) was evaluated at room and elevated temperatures. Also, the use of an elastic-plastic laminate analysis program for predicting the tensile response from constituent properties was verified. The improvement in mechanical properties achieved by the laminates was assessed by comparing the results of static strength and constant amplitude fatigue tests to those for monolithic titanium sheet. Two HTCL were fabricated with different fiber volume fractions, resin layer thicknesses, and resins. One panel was thicker and was more poorly bonded in comparison to other. Consequently, the former had a lower tensile strength, while fewer cracks grew in this panel and at a slower rate. Both panels showed an improvement in fatigue life of almost two orders of magnitude. The model predictions were also in good agreement with the experimental results for both HTCL panels.

Miller, J. L.↗

NASA NTRS1988

Adhesive evaluation of water-soluble LARC-TPI

The water-soluble polyimide, identified as TPI(MTC)/H2O, was evaluated as a high temperature thermoplastic adhesive for bonding Ti-6Al-4V and comparing those results primarily with results reported in earlier work with the polyamic-acid/diglyme material. The lap shear strength test was the primary test performed to evaluate the adhesive before (controls) and after thermal exposure in air at 204 C for up to 5000 hours and after a 72 hour water-boil exposure. Lap shear strengths were determined at RT, 177, 204, and 232 C. The adhesive was also characterized after fracture by determining the glass transition temperature as well as defining the mode of failure by visual observation. In general, the results indicate that the TPI(MTC)/H2O retains high lap shear strengths after thermal exposure but had reduced strengths after the water-boil exposure. All failures were cohesive. The TPI(MTC)/H2O compared very well with previous data reported for the standard polyamic-acid/diglyme LARC-TPI results, and therefore, shows promise as a water-soluble adhesive for use in various applications.

Progar, D. J.↗

NASA NTRS1988

SEM/XPS analysis of fractured adhesively bonded graphite fibre surface resin-rich/graphite fibre composites

Samples of graphite fiber-reinforced polyimide were fabricated allowing the resin to accumulate at the composite surface. These surface resin-rich composites were then bonded together and tested for lap shear strength both before and after thermal aging. Lap shear strength did not appear to show a significant improvement over that previously recorded for resin-poor samples and was shown to decrease with increasing aging time and temperature.

Devilbiss, T. A.↗

NASA NTRS1987

Sodium hydroxide anodization of Ti-Al-4V adherends

The use of sodium hydroxide anodization (SHA) for Ti-6Al-4V adherends is examined. The SHA surface is evaluated using SEM, X-ray photoelectron spectroscopy, and Auger electron spectroscopy. The SHA procedures of Kennedy et al. (1983) were employed in this experiment. The photomicrographs of the SHA (sandblasted) and PSHA (sandblasted and pickled) oxide surface reveal that the two surfaces differ. The PSHA is patchy and similar to a chromic acid anodization surface and the porosity of the PSHA is more uniform than the SHA surface. The compositions of the surfaces are studied. It is noted that SHA is an effective pretreatment for Ti-6Al-4V adherends.

Filbey, Jennifer A.↗

NASA NTRS1986

Evaluation of Ti-6Al-4V surface treatments for use with a polyphenylquinoxaline adhesive

Three surface treatments for Ti-6Al-4V adherends were evaluated using a thermoplastic polymer monoether polyphenylquinoxaline, MEPPQ, which had been shown in previous studies to have good potential as a high temperature adhesive for aerospace applications. Initial results based on long term thermal exposure at 232 C (450 F) using the phosphate-fluoride (PF) and chromic acid anodized (CAA) treatments with MEPPQ adhesive were not encouraging. A significant improvement in strength retention and a change in failure mode (cohesive) at 232 C (450F) was found for the SHA treated specimens compared to the PF and CAA treatments. Although an improvement in long term thermal durability was obtained with the SHA treatment of Ti-6Al-4V, an improved surface treatment with better long term durability is still required for aerospace applications.

Progar, D. J.↗

NASA NTRS1986

Adhesive evaluation of thin films of LARC-TPI and LARC-TPI with 5 mol % ODA

A commercially available LARC-TPI film and an experimentally prepared film of LARC-TPI with 5 mol % of 4,4'-oxydianiline (ODA), designated as LARC-TPI/ODA in the report, supplied by Mitsui Toatsu Chemicals, Incorporated (MTCI), Japan, were evaluated as thermoplastic adhesive films for bonding Ti-6Al-4V. The LARC-TPI/ODA had been shown by MTCI to possess more flow than thermoplastic LARC-TPI and was, therefore, evaluated and compared to the LARC-TPI. Lap shear strength was used to evaluate the materials as adhesives. They were characterized after fracture by determining the glass transition temperature, Tg. The mode of failure was also reported. Thermal exposure at 204C for 500 and 1000 hrs and a 72-hour water-boil were conducted on lap shear specimens prepared with the two adhesive films. Lap shear tests were conducted at RT, 177C, 204C, and 232C before and after exposures.

Progar, D. J.↗

NASA NTRS1986

Adhesive evaluation of LARC-TPI and a water-soluble version of LARC-TPI

The results of a study to evaluate two Langley Research Center thermoplastic polimide (TPI) materials, identified as TPI/MTC for the material from Mitsui Toatsu Chemicals Inc. and TPI/H2O for the material from United Technologies Research Center, as high temperature thermoplastic adhesives and primers for bonding titanium (6AL-4V) adherends are discussed. A limited characterization of the materials was performed using a Diffuse Reflectance-Fourier Transform Infrared Spectroscopy (DR-FTIR) technique. Thermomechanical Analysis (TMA) and torsional braid techniques were used to determine glass transition temperature. The adhesive's strength, as determined by simple lap shear tests, was used to evaluate the effects of long term thermal exposure (up to 1000 hrs) at 204 deg C and a 72-hour water-boil.

Progar, D. J.↗

NASA NTRS1986

Evaluation of a novel thermoplastic polyimide for bonding titanium

A novel hot-melt processable polyimide has been synthesized and characterized as an adhesive for a titanium alloy. This system shows potential for applications with service temperatures near 200 C. A bonding cycle was developed from preliminary processing studies. The bonded specimens were tested at room temperature, 177 C and 204 C both before and after aging in air at 204 C for times up to 1000 hours. There was no appreciable change in strength after aging. Bonded specimens were exposed to boiling water continuously for a 72 hour period. These specimens exhibited some loss in strength due to this rather severe exposure.

Progar, D. J.↗

NASA NTRS1985

A thermoplastic copolyimide

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4,4'-benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗

NASA NTRS1985

Synthesis and Characterization of Copolyimides with Varying Flexibilizing Groups

A series of polyimides and copolyimides with varying flexibilizing groups in their backbone were prepared. They were characterized in order to evaluate the effect of these groups on their rheological, mechanical, adhesive, and thermal properties. A copolymer with equimolar amounts of m-PDA and 4,4'-ODA exhibited the lowest viscosity at all strain rates studied. Since this particular polymer exhibited the best flow properties, it was also evaluated as an adhesive and was found to have exceptional characteristics for this application.

Burks, H. D.↗

NASA NTRS1985

STPI/LARC: A 200 deg C polyimide adhesive

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4'benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗

NASA NTRS1985

SEM/XPS analysis of fractured adhesively bonded graphite fibre-reinforced polyimide composites

The surfaces of the graphite fiber-reinforced polyimide composites presently pretreated prior to bonding with polyimide adhesive contained variable amounts of a fluoropolymer, as determined by X-ray photoelectron spectroscopy. Lap shear strengths were determined for unaged samples and for those aged over 500- and 1000-hour periods at 177 and 232 C. Unaged sample lap strengths, which were the highest obtained, exhibited no variation with surface pretreatment, but a significant decrease is noted with increasing aging temperature. These thermally aged samples, however, had increased surface fluorine concentration, while a minimal concentration was found in unaged samples. SEM demonstrated a progressive shift from cohesive to adhesive failure for elevated temperature-aged composites.

Devilbiss, T. A.↗

NASA NTRS1985

Adhesive evaluation of LARC-TPI and a water-soluble version of LARC-TPI

The results of a study to evaluate two Langley Research Center thermoplastic polimide (TPI) materials, identified as TPI/MTC for the material from Mitsui Toatsu Chemicals Inc. and TPI/H2O for the material from United Technologies Research Center, as high temperature thermoplastic adhesives and primers for bonding titanium (6AL-4V) adherends are discussed. A limited characterization of the materials was performed using a Diffuse Reflectance-Fourier Transform Infrared Spectroscopy (DR-FTIR) technique. Thermomechanical Analysis (TMA) and torsional braid techniques were used to determine glass transition temperature. The adhesive's strength, as determined by simple lap shear tests, as used to evaluate the effects of long term thermal exposure (up to 1000 hrs) at 204 deg C and a 72-hour water-boil.

Progar, D. J.↗

NASA NTRS1984

Hot melt adhesive attachment pad

A hot melt adhesive attachment pad for releasably securing distinct elements together is described which is particularly useful in the construction industry or a spatial vacuum environment. The attachment pad consists primarily of a cloth selectively impregnated with a charge of hot melt adhesive, a thermo-foil heater, and a thermo-cooler. These components are securely mounted in a mounting assembly. In operation, the operator activates the heating cycle transforming the hot melt adhesive to a substantially liquid state, positions the pad against the attachment surface, and activates the cooling cycle solidifying the adhesive and forming a strong, releasable bond.

Fox, R. L.↗

NASA NTRS1984

Processing study of a high temperature adhesive

An adhesive-bonding process cycle study was performed for a polyimidesulphone. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are presented. These include the tape preparation, the use of a primer and press and simulated autoclave processing conditions. The polymer was characterized using Fourier transform infrared spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The lap shear strength of the adhesive was used to evaluate the effects of the bonding process variations.

Progar, D. J.↗

NASA NTRS1984

Hot melt adhesive pad surface attachment assembly concept for on-orbit operations

The use of a hot melt adhesive concept to develop a Surface Attachment Assembly (SAA) for on-orbit attachment and detachment operations for the Manned Maneuvering Unit (MMU) was investigated. The concept involved impregnation of the hot melt adhesive into a fiberglass covered pad which contained electrical heating and thermoelectric cooling devices. The polyamide hot melt adhesive selected can be repeatedly heated to its melting point in a vacuum and provide good adhesion to various surfaces, i.e., reusable surface insulation tiles, metals, and composites, when cooled. After a series of adhesive screening tests, Jet-Melt 3746 was selected from a group of commercially available thermoplastic adhesive candidates which met or exceeded many of the criteria established for the SAA system. The SAA system was designed and fabricted with the goal of proving the concept with a working model rather than attempting to optimize all facets of the system. This system evolved by investigating alternate attachment concepts, designing and fabricating electronic systems to heat and cool the adhesive, and then fabricating electronic systems to heat and cool the adhesive, and then fabricating and testing two prototype full-size units.

Progar, D. J.↗

NASA NTRS1984

Processing study of a polyimidesulfone adhesive

An adhesive bonding process cycle study was performed for a polyimidesulfone (PISO2) recently developed as a promising structural adhesive. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are detailed. These include the tape preparation, the use of a primer, and press and simulated autoclave processing conditions. The polymer was characterized using Fourier Transform Infrared Spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The adhesive's strength determined by lap shear strength tests was used to evaluate the effects of the bonding process variations. Higher lap shear strengths were obtained at room temperature when a primer (PISO2) was used; however, the results were the same at 232 C (450 F) with or without a primer. The use of a vacuum (simulated autoclave cycle) during titanium bonding produced similar lap shear strengths to those specimens bonded without a vacuum.

Progar, D. J.↗

NASA NTRS1983

Hot melt recharge system

A package assembly is described for pecisely positioning a charge of hot melt adhesive onto an attachment pad or point of use. The adhesive is heated to softening or melt temperature (280 F to 325 F) and thereafter cooled to resolidifying temperature. A single sided pressure sensitive polyimide film tape serves with another film strip to protect a sandwiched adhesive strip until use and to hold the adhesive in precise position until thermally bonded to its point of use. Tab ends serve as aids in stripping tapes and from the adhesive charge.

Progar, D. J.↗