NASA NTRS · 19780000126
Match-mold process for foam insulation
Abstract
Process, using fast-setting putty-type thixotropic epoxy material, eliminates need for leakproof enclosures. Method reduces cure time from 15 to 4 hours. Epoxy masters are stronger and do not require special coating for storage. Manufacturers of form-fitted insulation or packaging forms will find this process to be of interest.
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Rumenapp, H. E., Liskay, G. G., Wang, D. S.. 1978-06-01. Match-mold process for foam insulation. https://ntrs.nasa.gov/citations/19780000126
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