Match-mold process for foam insulation
Process, using fast-setting putty-type thixotropic epoxy material, eliminates need for leakproof enclosures. Method reduces cure time from 15 to 4 hours. Epoxy masters are stronger and do not require special coating for storage. Manufacturers of form-fitted insulation or packaging forms will find this process to be of interest.
Rumenapp, H. E.↗