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Gaudiano, S.

Publications and source records attributed to Gaudiano, S..

Coating Circuit Boards With Silicone

Techniques appropriate to boards containing CMOS circuits detailed. Document presents procedure for applying thin conformal coating to such electronic assemblies as printed-circuit boards and wire-wrapped boards. Coating is from 1 to 7 mils (25 to 178 micrometers) thick and composed of room-temperature-vulcanizing (RTV) silicone. Specifies materials, equipment, spraying method, and quality requirements. Takes into account special needs of circuits made with complementary metal-oxide/semiconductor (CMOS) devices on circuit boards. Special attention given to preventing damage by electrostatic discharge, to which CMOS circuits especially sensitive.

Gaudiano, S.

Calibration standards for PIND tests

Calibrated set of microcircuit packages containing tiny particles with known masses can be used as reference standards for Particle-Impact Noise-Detection (PIND) tests.

Gaudiano, S.

Piggy-back mounting would increase microcircuit packaging density

Piggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit.

Gaudiano, S.