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Thermal systems

Find NASA NTRS and DOE OSTI research on heat transfer and thermal systems. Search heat pipes, cooling and thermal management in report titles and abstracts.

At least 1,171 records · Page 65

Geothermal district energy systems coupled with seasonal underground thermal energy storage: a U.S. techno-economic screening by climate and geology

In the United States, cooling-dominated commercial building loads can cause geothermal heat pump-based district energy systems to accumulate a long-term subsurface thermal imbalance, motivating the incorporation of seasonal underground thermal energy storage. We developed a transferable workflow to evaluate geothermal district systems that pair ground heat exchangers with seasonal underground thermal energy storage. Using standardized hourly loads for seven commercial buildings and a uniform cost framework, we simulated ten U.S. cities with a physics-based ground heat exchanger model, subsurface storage simulations, and economic assessment to isolate the roles of climate and hydrogeology. In cooling-dominated cities, underground thermal energy storage supplied the majority of annual cooling, cutting electricity use and summer peaks substantially while achieving levelized costs comparable to or below conventional chiller-boiler plants. In cooler climates, the storage share shrunk, required borefield size and costs rose, and levelized cost of energy increased nearly linearly with declining underground thermal energy storage fraction, indicating storage fraction as the primary economic lever. Sensitivity analysis showed capital risk dominated by borefield drilling and surface heating, ventilation, and air-conditioning and piping, with underground thermal energy storage costs secondary. This workflow provides a transparent foundation for site-specific design and screening of next-generation geothermal district energy systems.

25 ENERGY STORAGE↗

Demonstration and characterization of insertable passive thermal switches for dynamic building envelopes

A dynamic building envelope integrated with thermal energy storage, such as phase change material (PCM), is an emerging technology that offers a promising solution to improve the energy efficiency of buildings. This study reports the development of insertable thermal switches, which modulate thermal resistance, thereby making building envelopes dynamic and enhancing the use of free ambient heating and cooling. The reported thermal switches are passive, meaning they work solely based on indoor and outdoor temperatures. A single switch when inserted into 10 × 10-in (0.064-m 2 ) XPS foam board insulation demonstrates effective thermal conductivity of 0.050 W/m-K in the resistive state and 0.285 W/m-K in the conductive state. Thermal switches exhibit an effective switching ratio of 5.7, with no noticeable degradation in performance over 770 cycles. Additionally, when integrated into a wall sample containing a PCM layer, switches significantly reduce the PCM solidification time by 43.2% during the cooling process.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Influence of pre-existing defects on thermal transport in nuclear graphite

Nuclear graphite is a critical material in high-temperature nuclear reactors due to its superior thermal and mechanical properties. The manufacturing process leaves multi-scale ‘pre-existing’ defects that can affect thermal transport characteristics. Because these defects are remnant of graphitization temperature, they cannot be thermally annealed. This study employs a non-thermal electron wind force (EWF) annealing technique to avoid this obstacle. 2 min of EWF treatment of the as-received graphite IG-110 at temperatures below 100 °C led up to 67% increase in thermal diffusivity and ~ 35% decrease in electrical resistivity in average. Differential scanning calorimetry also showed similar outcome for specific heat. X-ray diffraction characterization was performed by fitting a bi-modal crystallite size distribution model to reveal the enhancement in crystallinity after the EWF treatment. The findings emphasize the potential of EWF annealing for optimizing thermal performance in nuclear graphite and its implications for reactor efficiency and safety.

Annealing↗

Dynamic Thermal Performance Analysis of PCM Products Used for Energy Efficiency and Internal Climate Control in Buildings

PCMs are attractive for the future generation of buildings, where energy efficiency targets and thermal comfort expectations are increasingly prioritized. Experimental analysis of local thermal processes in these dynamic components and whole-building energy consumption predictions are essential for the proper implementation of PCMs in buildings. This paper discusses the experimental analysis of the thermophysical characteristics of both a latent heat storage material (PCM) and a product containing this PCM. The prototype product under investigation is a panelized PCM technology containing inorganic, salt-hydrate-based PCM. The thermal analysis includes studies of melting and freezing temperatures, enthalpy changes during phase change processes, nucleation intensity, sub-cooling effects, and PCM stability. The PCM’s stability is also investigated, as is the ability of PCM products to control local temperatures and peak load transmission times. Two inorganic PCM formulations based on calcium chloride hexahydrate (CaCl 2 .6H 2 O) were prepared and tested in laboratory conditions. Material-scale testing results were compared with outcomes from the system-scale analysis, using both laboratory test methods as well as field exposure in test huts. This work demonstrates that PCM technologies used in buildings can effectively control both the magnitude of thermal storage capacity as well as the time of the peak thermal load. It was found that commonly used material-scale testing methods may not always be beneficial in assessing the dynamic thermal performance characteristics of building technologies containing PCMs.

42 ENGINEERING↗

Extending Our Understanding of Compliant Thermal Barrier Performance

Thermal barriers and seals are integral components in the thermal protection systems (TPS) of nearly all aerospace vehicles. They are used to minimize the flow of hot gases through interfaces and protect underlying temperature-sensitive components and systems. Although thermal barriers have been used extensively on many aerospace vehicles, the factors affecting their thermal and mechanical performance are not well-understood. Because of this, vehicle TPS designers are often left with little guidance on how to properly design and optimize these barriers. An ongoing effort to better understand thermal barrier performance and develop models and design tools is in progress at the NASA Glenn Research Center. Testing has been conducted to understand the degree to which insulation density influences structural performance and permeability. In addition, the development of both thermal and mechanical models is ongoing with the goal of providing an improved ability to design and implement these critical TPS components.

high temperature↗

The Generation and Application of Paylaod Thermal Environments for a Lunar Lander Mission

In today’s space industry many organizations develop payloads or other components that will fly on a vehicle or lander developed by a different organization. This creates a challenge for the payload developers of knowing the thermal environment, including effects from the spacecraft, of their instrument because the payload engineers will not have continuous access to an up-to-date thermal model of the spacecraft. To circumvent the vehicle developer having to provide a thermal model of the spacecraft to payload developers for detailed thermal analysis, the vehicle developer can provide environmental data to the payload engineers to apply to their payload model, instead. This data must include the boundary temperatures where the payload is mounted, sink temperatures, and both incident solar and infrared thermal flux. This paper will describe the method used to generate thermal environments for payloads on the Astrobotic Lunar Lander and how those environments were applied to an example payload, the Neutron Measurement at the Lunar Surface (NMLS) instrument. This work is unique because a standard method for generating and delivering payload environments does not exist. Benefits and drawbacks of using this method will also be discussed.

Thermal Environments↗

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

thermal analysis↗

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

xEMU↗

Ultralow Thermal Conductivity in Nanoporous Crystalline Fe 3 O 4

While there is no known fundamental lower limit to the thermal conductivity of a material, the lowest thermal conductivities are typically found in amorphous and strongly disordered materials, not highly crystalline materials. Here, we demonstrate a surprising nanostructuring route to ultralow thermal conductivity in a large-unit-cell oxide crystal (Fe 3 O 4 ) containing close-packed nanoscale pores. The electrical conductivity of this material reduces by a factor of 5 relative to dense v, independent of pore size. In contrast, thermal conductivity has a strong dependence on pore size with a factor of 40 of suppression relative to dense Fe 3 O 4 for 40 nm pores vs a factor of 5 for 500 nm pores. The matrix thermal conductivity of Fe 3 O 4 containing 40 nm pores falls below the predicted minimum thermal conductivity by a factor of 3. Finally, we attribute this to strong acoustic phonon scattering and intrinsically limited contributions to thermal conductivity from optical phonons with small dispersion.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Frequency-domain hot-wire sensor and 3D model for thermal conductivity measurements of reactive and corrosive materials at high temperatures

High temperature solids and liquids are becoming increasingly important in next-generation energy and manufacturing systems that seek higher efficiencies and lower emissions. Accurate measurements of thermal conductivity at high temperatures are required for the modeling and design of these systems, but commonly employed time-domain measurements can have errors from convection, corrosion, and ambient temperature fluctuations. Here, we describe the development of a frequency-domain hot-wire technique capable of accurately measuring the thermal conductivity of solid and molten compounds from room temperature up to 800 °C. Therefore, by operating in the frequency-domain, we can lock into the harmonic thermal response of the material and reject the influence of ambient temperature fluctuations, and we can keep the probed volume below 1 µl to minimize convection. The design of the microfabricated hot-wire sensor, electrical systems, and insulating wire coating to protect against corrosion is covered in detail. Furthermore, we discuss the development of a full three-dimensional multilayer thermal model that accounts for both radial conduction into the sample and axial conduction along the wire and the effect of wire coatings. The 3D, multilayer model facilitates the measurement of small sample volumes important for material development. A sensitivity analysis and an error propagation calculation of the frequency-domain thermal model are performed to demonstrate what factors are most important for thermal conductivity measurements. Finally, we show thermal conductivity measurements including model data fitting on gas (argon), solid (sulfur), and molten substances over a range of temperatures.

47 OTHER INSTRUMENTATION↗

Thermal diffusivity of diamond films using a laser pulse technique

Polycrystalline diamond films were deposited using a microwave plasma-enhanced chemical vapor deposition process. A laser pulse technique was developed to measure the thermal diffusivity of diamond films deposited on a silicon substrate. The effective thermal diffusivity of a diamond film on silicon was measured by observing the phase and amplitude of the cyclic thermal waves generated by laser pulses. An analytical model is presented to calculate the effective in-plane (face-parallel) diffusivity of a two-layer system. The model is used to reduce the effective thermal diffusivity of the diamonds/silicon sample to a value for the thermal diffusivity and conductivity of the diamond film. The average effective diffusivity values are 1.47 + or - 0.03 and 1.83 + or - 0.10 yielding thermal diffusivity values of 7.46 + or - 0.90 and 7.33 + or - 0.70 sq cm/s respectively, for the two samples; the calculated thermal con ductivity values are 13.50 and 13.28 W/cmK, which are better than that of type 1a natural diamond. The phase and amplitude measurements give similar results.

Albin, Sacharia↗

Thermal shock testing for assuring reliability of glass-sealed microelectronic packages

Tests were performed to determine if thermal shocking is destructive to glass-to-metal seal microelectronic packages and if thermal shock step stressing can compare package reliabilities. Thermal shocking was shown to be not destructive to highly reliable glass seals. Pin-pull tests used to compare the interfacial pin glass strengths showed no differences between thermal shocked and not-thermal shocked headers. A 'critical stress resistance temperature' was not exhibited by the 14 pin Dual In-line Package (DIP) headers evaluated. Headers manufactured in cryogenic nitrogen based and exothermically generated atmospheres showed differences in as-received leak rates, residual oxide depths and pin glass interfacial strengths; these were caused by the different manufacturing methods, in particular, by the chemically etched pins used by one manufacturer. Both header types passed thermal shock tests to temperature differentials of 646 C. The sensitivity of helium leak rate measurements was improved up to 70 percent by baking headers for two hours at 200 C after thermal shocking.

Thomas, Walter B., III↗

Materials and light thermal structures research for advanced space exploration

The Light Thermal Structures Center at the University of Virginia sponsors educational and research programs focused on the development of reliable, lightweight structures to function in hostile thermal environments. Technology advances in materials and design methodology for light thermal structures will contribute to improved space vehicle design concepts with attendant weight savings. This paper highlights current research activities in three areas relevant to space exploration: low density, high temperature aluminum alloys, composite materials, and structures with thermal gradients. Advances in the development of new aluminum-lithium alloys and mechanically alloyed aluminum alloys are described. Material properties and design features of advanced composites are highlighted. Research studies in thermal structures with temperature gradients include inelastic panel buckling and thermally induced unstable oscillations. Current and future research is focused on the integration of new materials with applications to structural components with thermal gradients.

Thornton, Earl A.↗

Experimental design for the evaluation of high-T(sub c) superconductive thermal bridges in a sensor satellite

Infrared sensor satellites, which consist of cryogenic infrared sensor detectors, electrical instrumentation, and data acquisition systems, are used to monitor the conditions of the earth's upper atmosphere in order to evaluate its present and future changes. Currently, the electrical connections (instrumentation), which act as thermal bridges between the cryogenic infrared sensor and the significantly warmer data acquisition unit of the sensor satellite system, constitute a significant portion of the heat load on the cryogen. As a part of extending the mission life of the sensor satellite system, the researchers at the National Aeronautics and Space Administration's Langley Research Center (NASA-LaRC) are evaluating the effectiveness of replacing the currently used manganin wires with high-temperature superconductive (HTS) materials as the electrical connections (thermal bridges). In conjunction with the study being conducted at NASA-LaRC, the proposed research is to design a space experiment to determine the thermal savings on a cryogenic subsystem when manganin leads are replaced by HTS leads printed onto a substrate with a low thermal conductivity, and to determine the thermal conductivities of HTS materials. The experiment is designed to compare manganin wires with two different types of superconductors on substrates by determining the heat loss by the thermal bridges and providing temperature measurements for the estimation of thermal conductivity. A conductive mathematical model has been developed and used as a key tool in the design process and subsequent analysis.

Scott, Elaine P.↗

Thermal Conductance of Pressed Bimetal Contact Pairs at Liquid Nitrogen Temperatures

Large Dewars often use aluminum radiation shields and stainless steel vent lines. A simple, low cost method of making thermal contact between the shield and the line is to deform the shield around the line. A knowledge of the thermal conductance of such a joint is needed to thermally analyze the system. The thermal conductance of pressed metal contacts consisting of one aluminum and one stainless steel contact has been measured at 77 K, with applied forces from 8.9 N to 267 N. Both 5052 or 5083 aluminum were used as the upper contact. The lower contact was 304L stainless steel. The thermal conductance was found to be linear in temperature over the narrow temperature range of measurement. As the force was increased, the thermal conductance ranged from roughly 9 to 21 mW/K within a range of errors from 3% to 8%. Within the range of error no difference could be found between the using either of the aluminum alloys as the upper contact. Extrapolating the data to zero applied force does not result in zero thermal conductance. Possible causes of this anomalous effect are discussed.

Kittle, Peter↗

Fossilization Processes in Thermal Springs

To create a comparative framework for the study of ancient examples, we have been carrying out parallel studies of the microbial biosedimentology, taphonomy and geochemistry of modem and sub-Recent thermal spring deposits. One goal of the research is the development of integrated litho- and taphofacies models for siliceous and travertline sinters. Thermal springs are regarded as important environments for the origin and early evolution of life on Earth, and we seek to utilize information from the fossil record to reconstruct the evolution of high temperature ecosystems. Microbial contributions to the fabric of thermal spring sinters occur when population growth rates keep pace with, or exceed rates of inorganic precipitation, allowing for the development of continuous biofilms or mats. In siliceous thermal springs, microorganisms are typically entombed while viable. Modes of preservation reflect the balance between rates of organic matter degradation, silica precipitation and secondary infilling. Subaerial sinters are initially quite porous and permeable and at temperatures higher than about 20 C, organic materials are usually degraded prior to secondary infilling of sinter frameworks. Thus, organically-preserved microfossils are rare and fossil information consists of characteristic biofabrics formed by the encrustation and underplating of microbial mat surfaces. This probably accounts for the typically low total organic carbon values observed in thermal spring deposits. In mid-temperature, (approx. 35 - 59 C) ponds and outflows, the surface morphology of tufted Phormidium mats is preserved through mat underplating by thin siliceous: crusts. Microbial taxes lead to clumping of ceils and/or preferred filament orientations that together define higher order composite fabrics in thermal spring stromatolites (e.g. network, coniform, and palisade). At lower temperatures (less than 35 C), Calothrix mats cover shallow terracette pools forming flat carpets or pustular surfaces that produce palisade and "shrub" fabrics, respectively. At finer scales, composite fabrics are seen to consist distinctive associations of microstructures formed by the encrustation of individual cells and filaments. Composite fabrics survive the diagenetic transitions from primary opaline silica to quartz and are known from subaerial thermal spring deposits as old as Lower Carboniferous. However, fossil microorganisms tend to be rare in older deposits, and are usually preserved only where cells or sheaths have been stained by iron oxides. In subaqueous mineralizing springs at lower temperatures, early infilling leads to a more rapid and complete reduction in porosity and permeability. This process, along with the slower rates of microbial degradation at lower temperatures, creates a more favorable situation for organic matter preservation. Application of this taphonomic model to the Rhynie Chert, previously interpreted as subaerial, suggest it was probably deposited in a subaqueous spring setting at lower temperatures.

Farmer, Jack D.↗

Thermal Residual Stress in Environmental Barrier Coated Silicon Nitride - Modeled

When exposed to combustion environments containing moisture both un-reinforced and fiber reinforced silicon based ceramic materials tend to undergo surface recession. To avoid surface recession environmental barrier coating systems are required. However, due to differences in the elastic and thermal properties of the substrate and the environmental barrier coating, thermal residual stresses can be generated in the coated substrate. Depending on their magnitude and nature thermal residual stresses can have significant influence on the strength and fracture behavior of coated substrates. To determine the maximum residual stresses developed during deposition of the coatings, a finite element model (FEM) was developed. Using this model, the thermal residual stresses were predicted in silicon nitride substrates coated with three environmental coating systems namely barium strontium aluminum silicate (BSAS), rare earth mono silicate (REMS) and earth mono di-silicate (REDS). A parametric study was also conducted to determine the influence of coating layer thickness and material parameters on thermal residual stress. Results indicate that z-direction stresses in all three systems are small and negligible, but maximum in-plane stresses can be significant depending on the composition of the constituent layer and the distance from the substrate. The BSAS and REDS systems show much lower thermal residual stresses than REMS system. Parametric analysis indicates that in each system, the thermal residual stresses can be decreased with decreasing the modulus and thickness of the coating.

Ali, Abdul-Aziz↗

Effects of Long-Term Thermal Exposure on Commercially Pure Titanium Grade 2 Elevated-Temperature Tensile Properties

Elevated-temperature tensile testing of commercially pure titanium (CP Ti) Grade 2 was conducted for as-received commercially produced sheet and following thermal exposure at 550 and 650 K (531 and 711 F) for times up to 5000 h. The tensile testing revealed some statistical differences between the 11 thermal treatments, but most thermal treatments were statistically equivalent. Previous data from room temperature tensile testing was combined with the new data to allow regression and development of mathematical models relating tensile properties to temperature and thermal exposure. The results indicate that thermal exposure temperature has a very small effect, whereas the thermal exposure duration has no statistically significant effects on the tensile properties. These results indicate that CP Ti Grade 2 will be thermally stable and suitable for long-duration space missions.

Ellis, David L.↗