Engineering topics

St. Clair, Terry L.

Publications and source records attributed to St. Clair, Terry L..

At least 37 records · Page 2

NASA NTRS1993

Polyimides Made From 4,4'-Isophthaloyldiphthalic Anhydride

High-performance, thermoplastic, amorphous, and semicrystalline materials obtained. In experiments, twelve high-temperature, high-performance polyimide compositions based on 4,4'-isophthaloyldiphthalic anhydride (IDPA) prepared and characterized. Tough, film-forming, polyimides insoluble in organic solvents obtained in most cases. Three materials semicrystalline. Materials offer potential for development of semicrystalline polyimides having enhanced resistances to solvents and caustic chemicals, higher tensile strengths and moduli, enhanced thermo-oxidative stabilities below their melting temperatures, and enhanced melt processability, especially when heated to melting temperatures. Several exhibited excellent long-term thermo-oxidative stability when subjected to isothermal thermogravimetric analysis (ITGA) at temperatures of 300 degrees C and 350 degrees C in air. One area of application, manufacturing of lighter and stronger aircraft and spacecraft structures.

Pratt, J. Richard↗

NASA NTRS1992

Slow-Positron Generator For Studying Polymer Films

Aspects of molecular structures probed by positron-annihilation spectroscopy (PAS). Slow-positron-beam generator suitable for PAS measurements in thin polymer films. Includes Na22 source of positrons and two moderators made of well-annealed tungsten foil. With proper choice of voltage, positrons emitted by inward-facing surfaces of moderators made to stop in polymer films tested.

Singh, Jag J.↗

NASA NTRS1992

Aromatic polyimides containing a dimethylsilane-linked dianhydride

A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.

St. Clair, Anne K.↗

NASA NTRS1991

New Polyimide Has Many Uses

Low-toxicity and low-mutogenicity monomer key to new high-performance polyimide. LaRC-IA is thermoplastic polyimide made from 3-4'-oxydianiline and 4,4'-oxydiphthalic anhydride. Good processing characteristics, low toxicity, and no mutagenicity. Adhesives, composite matrix resins, heat resin moldings, and coating films made of new polymer found to exhibit properties identical or superior to commercially available polyimides. Potential applications wide ranging. With and without end capping, employed to prepare unfilled moldings, coatings and free films, adhesive tape, adhesively bonded substrates, prepregs, and composites.

St. Clair, Terry L.↗

NASA NTRS1991

Low energy positron flux generator for lifetime studies in thin films

A slow positron flux generator for positron annihilation spectroscopic measurements in thin polymer films is described. The advantages of this generator include operability at room temperature and atmospheric pressure without special test film preparaton requirements.

Singh, Jag J.↗

NASA NTRS1991

Vacuum bag bonding with a high temperature adhesive

A novel controlled molecular weight form of LARC-TPI polymide that exhibits an exceptionally high degree of melt flow in the 340-360 C temperature range has been developed. This material has been evaluated as a high-temperature adhesive, and because of its flow, cost-effective vacuum bag/oven processing can be used. Comparison of adhesive performance with higher molecular weight forms bonded at higher pressures shows this novel material to be equal in mechanical strength.

Progar, Donald J.↗

NASA NTRS1990

LARC-I-TPI: A New Thermoplastic Polyimide

"LARC-I-TPI" denotes improved version of LARC-TPI class of thermoplastic polyimides: high-performance polymers developed for manufacture of strong, lightweight aircraft structures. Melt-flow and adhesive properties of new polymers make them attractive for use as matrix resins for composites, molding powders, adhesives, and coating films. Less toxic, improved LARC-I-TPI polymers formulated without 3, 3'-diaminobenzophenone, which is mutagenic and commercially unavailable.

St. Clair, Terry L.↗

NASA NTRS1990

Isomeric Trisaryloxycyclotriphosphazene Polymer Precursors

Substances useful for making heat-and fire-resistant polymers. Cyclotriphosphazene-based monomers and polymer precursors led to development of high-temperature materials. Cyclotriphosphazene-derived monomers, polymer precursors, and polymers becoming important from both industrial and scientific points of view. Presence of phosphazene moiety in cyclotriphosphazene-based monomers and polymer precursors expected to impact special properties in desired high-performance materials containing inorganic backbones for aerospace applications. Useful for obtaining heat-and fire-resistant polymers for composites, adhesives, molding powders, and coating laminates. Also used in structures (e.g. secondary structures in aircraft), in construction of spacecraft, and in electronics and computer industries.

St. Clair, Terry L.↗

NASA NTRS1989

Additives Lower Pickup Of Moisture By Polyimides

Series of new polyimide-processing additives decrease free volume and pickup of moisture in new 422 copolyimide. Physical properties of several copolyimides synthesized from linear BDSDA/ODA/MPD homopolymers investigated previously, by positron-annihilation spectroscopy, with results indicating copolyimides have unique transition molecular structure characterized by higher electron densities and stronger bonds. Transition structure permits both physical and chemical entry of water molecules into it.

St. Clair, Terry L.↗

NASA NTRS1989

Soluble Aromatic Polyimides For Film Coating

Because of toughness, flexibility, and remarkable thermal stability, linear all-aromatic polyimides excellent candidate film and coating materials for advanced electronic circuitry and wires. Study determined effects on solubility of changing isomeric points of attachment of phenoxy units in diamine portions of several all-aromatic polyimides. Tough, flexible, transparent films produced by thermally converting polyamic acids to polyimides at 300 degree C in air. Potential for electronic applications excellent.

St. Clair, Anne K.↗

NASA NTRS1989

Low-Dielectric Polyimides

New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.

St. Clair, Anne K.↗

NASA NTRS1989

Flexible backbone aromatic polyimide adhesives

Continuing research at Langley Research Center on the synthesis and development of new inexpensive flexible aromatic polyimides as adhesives has resulted in a material identified as LARC-F-SO2 with similarities to polyimidesulfone, PISO2, and other flexible backbone polyimides recently reported by Progar and St. Clair. Also prepared and evaluated was an endcapped version of PISO2. These two polymers were compared with LARC-TPI and LARC-STPI, polyimides research in our laboratory and reported in the literature. The adhesive evaluation, primarily based on lap shear strength (LSS) tests at RT, 177 C and 204 C, involved preparing adhesive tapes, conducting bonding studies and exposing lap shear specimens to 204 C air for up to 1000 hrs and to a 72-hour water boil. The type of adhesive failure as well as the Tg was determined for the fractured specimens. The results indicate that LARC-TPI provides the highest LSSs. LARC-F-SO2, LARC-TPI and LARC-STPI all retain their strengths after thermal exposure for 1000 hrs and PISO2 retains greater than 80 percent of its control strengths. After a 72-hr water boil exposure, most of the four adhesive systems showed reduced strengths for all test temperatures although still retaining a high percentage of their original strength (greater than 60 percent) except for one case. The predominant failure type was cohesive with no significant change in the Tgs.

Progar, Donald J.↗

NASA NTRS1989

Polyimide matrix composites - Polyimidesulfone/LARC-TPI (1:1) blend

Polyimide matrix composites were fabricated from unidirectional unsized AS-4 carbon fiber and a doped 1:1 blend of two polyimides: PISO2 and LARC-TPI. To enhance melt flow properties, the molecular weight of the PISO2 was controlled by end-capping with phthalic anhydride and addition of 5 percent by weight p-phenylenediamine-phthalic anhydride bisamic acid dopant. Prepreg was drum-wound using a diglyme slurry comprised of the soluble polyamideacid of PISO2, the soluble bisamideacid of the dopant, and the insoluble imidized LARC-TPI powder. Melt flow studies with a rotary rheometer and parallel plate plastometer on neat resin and prepreg helped develop an optimum cure cycle. Composite mechanical properties at room and elevated temperatures, dry and moisture-saturated, were evaluated, including short beam shear strength and flexure, tensile, shear, and compression properties. Two 18 x 24-inch skin-stringer panels were fabricated, one of which was tested in compression to failure.

Johnston, Norman J.↗

NASA NTRS1988

Additives Improve Processing Of Polyimides

Melt-processable polyimides maintain desirable polymer properties prepared by adding small amounts of certain low-molecular-weight, thermally stable additives. Useful in preparing void-free polyimide composites from higher flow resins that wet out fibers at lower processing temperatures. Applied to preparing high-temperature polyimide adhesives allowing enhanced wetting of adherends and ultimately better adhesion. Improvement to processing polyimides and potential application for production of films, coatings, adhesives, and composites.

St. Clair, Terry L.↗

NASA NTRS1988

Processable Aromatic Polyimide Thermoplastic Blends

Method developed for preparing readily-processable thermoplastic polyimides by blending linear, high-molecular-weight, polyimic acid solutions in ether solvents with ultrafine, semicrystalline, thermoplastic polyimide powders. Slurries formed used to make prepregs. Consolidation of prepregs into finsihed composites characterized by excellent melt flow during processing. Applied to film, fiber, fabric, metal, polymer, or composite surfaces. Used to make various stable slurries from which prepregs prepared.

Baucom, Robert M↗

NASA NTRS1988

Developing Crystallinity In Linear Aromatic Polyimides

New technique improves melt flow of polyimide. Uses chemical imidization or cyclodehydration techniques that do not cause significant decrease in molecular weight. Process involves dissolution of polyamide acid in amide solvent or mixture of ether and amide solvent at low percentage of solids followed by treatment of this solution with aprotic organic base, such as triethylamine or pyridine, for period of time prior to treatment with organic dehydrating agent. Latter treatments facilitates formation of polyimide. Useful for production of polyimide molding materials. Expected to have widespread application in preparation of easily processed adhesives, molding powders, and matrix resins.

St. Clair, Terry L.↗

NASA NTRS1988

Annealing Reduces Free Volumes In Thermoplastics

Investigation conducted to determine free volumes and water-absorption characteristics of two types of thermoplastic polymide as functions of annealing histories. Reductions reach asymptotic values after several annealing cycles. High-temperature thermoplastics excellent candidates for use in aerospace applications. Graphite-fiber composites containing thermoplastic matrices have wide applicability.

Singh, Jag J.↗

NASA NTRS1987

Poly(carbonate-imide) polymer

A novel series of polymers and copolymers based on a polyimide backbone with the incorporation of carbonate moieties along the backbone. The process for preparing these polymers and copolymers is also disclosed as is a novel series of dinitrodiphenyl carbonates and diaminodiphenyl carbonates. The novel polymers and copolymers exhibit high temperature capability and because of the carbonate unit, many exhibit a high degree of order and/or crystallinity.

St. Clair, Terry L.↗