Engineering topics

St. Clair, Terry L.

Publications and source records attributed to St. Clair, Terry L..

At least 19 records

NASA NTRS2011

Wholly aromatic liquid crystalline polyetherimide (LC-PEI) resins

The benefits of liquid crystal polymers and polyetherimides are combined in an all-aromatic thermoplastic liquid crystalline polyetherimide. Because of the unique molecular structure, all-aromatic thermotropic liquid crystal polymers exhibit outstanding processing properties, excellent barrier properties, low solubilities and low coefficients of thermal expansion in the processing direction. These characteristics are combined with the strength, thermal, and radiation stability of polyetherimides.

Weiser, Erik S.↗

NASA NTRS2009

Liquid Crystalline Thermosets from Ester, Ester-imide, and Ester-amide Oligomers

Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystaloligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oli-gomers are stable forup to an hour in the melt phase. They are highly processable by a variety of melt process shape forming and blending techniques. Once processed and shaped, the end-capped liquid crystal oigomers were heated to further polymerize and form liquid crystalline thermosets (LCT). The fully cured products are rubbers above their glass transition temperatures.

Dingemans, Theodorus J.↗

NASA NTRS2006

Wholly Aromatic Ether-Imides as n-Type Semiconductors

Some wholly aromatic ether-imides consisting of rod-shaped, relatively-low-mass molecules that can form liquid crystals have been investigated for potential utility as electron-donor-type (ntype) organic semiconductors. It is envisioned that after further research to improve understanding of their physical and chemical properties, compounds of this type would be used to make thin film semiconductor devices (e.g., photovoltaic cells and field-effect transistors) on flexible electronic-circuit substrates. This investigation was inspired by several prior developments: Poly(ether-imides) [PEIs] are a class of engineering plastics that have been used extensively in the form of films in a variety of electronic applications, including insulating layers, circuit boards, and low-permittivity coatings. Wholly aromatic PEIs containing naphthalene and perylene moieties have been shown to be useful as electrochromic polymers. More recently, low-molecular-weight imides comprising naphthalene-based molecules with terminal fluorinated tails were shown to be useful as n-type organic semiconductors in such devices as field-effect transistors and Schottky diodes. Poly(etherimide)s as structural resins have been extensively investigated at NASA Langley Research Center for over 30 years. More recently, the need for multi-functional materials has become increasingly important. This n-type semiconductor illustrates the scope of current work towards new families of PEIs that not only can be used as structural resins for carbon-fiber reinforced composites, but also can function as sensors. Such a multi-functional material would permit so-called in-situ health monitoring of composite structures during service. The work presented here demonstrates that parts of the PEI backbone can be used as an n-type semiconductor with such materials being sensitive to damage, temperature, stress, and pressure. In the near future, multi-functional or "smart" composite structures are envisioned to be able to communicate such important parameters to the flight crew and provide vital information with respect to the operational status of their aircraft.

Weiser, Erik↗

NASA NTRS2006

Thermally Stable Piezoelectric and Pyroelectric Polymers

A class of thermally stable piezoelectric and pyroelectric polymers, and an improved method of making them, have been invented. These polymers can be used as substrates for a wide variety of electromechanical transducers, sensors, and actuators.

Simpson, Joycelyn O.↗

NASA NTRS2005

Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers

Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and were end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The resulting reactive end-capped liquid crystal oligomers exhibit a variety of improved and preferred physical properties. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystal oligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oligomers are stable for up to an hour in the melt phase. These properties make the end-capped liquid crystal oligomers highly processable by a variety of melt process shape forming and blending techniques including film extrusion, fiber spinning, reactive injection molding (RIM), resin transfer molding (RTM), resin film injection (RFI), powder molding, pultrusion, injection molding, blow molding, plasma spraying and thermo-forming. Once processed and shaped, the end-capped liquid crystal oligomers were heated to further polymerize and form liquid crystalline thermosets (LCT). The fully cured products are rubbers above their glass transition temperatures. The resulting thermosets display many properties that are superior to their non-end-capped high molecular weight analogs.

Dingemans, Theodorous J.↗

NASA NTRS2004

Polymeric blends for sensor and actuation dual functionality

The invention described herein supplies a new class of electroactive polymeric blend materials which offer both sensing and actuation dual functionality. The blend comprises two components, one component having a sensing capability and the other component having an actuating capability. These components should be co-processable and coexisting in a phase separated blend system. Specifically, the materials are blends of a sensing component selected from the group consisting of ferroelectric, piezoelectric, pyroelectric and photoelectric polymers and an actuating component that responds to an electric field in terms of dimensional change. Said actuating component includes, but is not limited to, electrostrictive graft elastomers, dielectric electroactive elastomers, liquid crystal electroactive elastomers and field responsive polymeric gels. The sensor functionality and actuation functionality are designed by tailoring the relative fraction of the two components. The temperature dependence of the piezoelectric response and the mechanical toughness of the dual functional blends are also tailored by the composition adjustment.

St. Clair, Terry L.↗

NASA NTRS1996

Copolyimides prepared from ODPA, BTDA and 3,4'-ODA

A copolyimide was prepared by reacting 3,4'-oxydianiline (3,4'-ODA) with a dianhydride blend comprising, based on the total amount of the dianhydride blend, about 67 to 80 mole percent of 4,4'-oxydiphthalic anhydride (ODPA) and about 20 to 33 mole percent of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA). The copolyimide may be endcapped with up to about 10 mole percent of a monofunctional aromatic anhydride and has unbalanced stoichiometry such that a molar deficit in the dianhydride blend is compensated with twice the molar amount of the monofunctional aromatic anhydride. The copolyimide was used to prepare composites, films and adhesives. The film and adhesive properties were significantly better than those of LaRC.TM.-IA.

Chang, Alice C.↗

NASA NTRS1996

Polyimides That Contain Pendent Siloxane Groups

Polyimides containing pendent siloxane groups (PISOXs) synthesized from polyimides containing hydroxy groups (PIOHs) according to either of two alternative approaches. Addition of pendent siloxane groups to polyimide decreases dielectric constant, and decreases absorption of moisture: these changes in properties advantageous in some electronic applications. Also enhance resistance to atomic oxygen in that they undergo slight degradation to form thin protective silicon oxide coats when exposed to atomic oxygen.

Connell, John W.↗

NASA NTRS1995

Solvent resistant copolyimide

A solvent resistant copolyimide was prepared by reacting 4,4'-oxydiphthalic anhydride with a diaimine blend comprising, based on the total amount of the diamine blend, about 75 to 90 mole percent of 3,4'-oxydianiline and about 10 to 25 mole percent p-phenylene diamine. The solvent resistant copolyimide had a higher glass transition temperature when cured at 350.degree. , 371.degree. and 400.degree. C. than LaRC.TM.-IA. The composite prepared from the copolyimide had similar mechanical properties to LaRC.TM.-IA. Films prepared from the copolyimide were resistant to immediate breakage when exposed to solvents such as dimethylacetamide and chloroform. The adhesive properties of the copolyimide were maintained even after testing at 23.degree., 150.degree., 177.degree. and 204.degree. C.

Chang, Alice C.↗

NASA NTRS1995

Direct process for preparing semi-crystalline polyimides

The invention is a direct process for preparing semi-crystalline polyimides. This process comprises the steps of: providing a polar aprotic solvent, adding a dianhydride and a diamine to the solvent to form a mixture, stirring the mixture at ambient temperature, and adding glacial acetic acid to the mixture to provide a ratio of polar aprotic solvent to glacial acetic acid which ranges from about 90 to 10 to about 75 to 25 by volume to form a solution. The solution was heated to a range from about 110.degree. C. to about 140.degree. C. to form a polyimide precipitate. The polyimide precipitate was recovered as a semi-crystalline polyimide powder.

Chang, Alice C.↗

NASA NTRS1995

LaRC(TM)-IA Copolyimides

Copolyimides modified versions of LaRC(TM)-IA thermoplastic polyimide formulated by incorporating moieties of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and, alternatively, isophthaloyldiphthalic anhydride (IDPA) into LaRC(TM)-IA polymer backbones. Exhibit higher glass-transition temperatures and retain greater fractions of lower-temperature shear moduli at higher temperatures. Copolyimides spun into fibers or used as adhesives, molding powders, or matrix resins in many applications, especially in fabrication of strong, lightweight structural components of aircraft.

St. Clair, Terry L.↗

NASA NTRS1995

Polyimides That Contain Cyclobutene-3,4-Dione Moieties

Linear aromatic polyimides containing cyclobutene-3,4,-dione moieties synthesized in experiments. Polymers exhibit high thermal and thermo-oxidative stabilities, making them useful in structural components exposed to hot and/or oxidative environments, as in jet engines and on outer surfaces of supersonic aircraft. Electrons in cyclobutene-3,4-dione moieties readily excited to states of higher energy upon exposure to ultraviolet light, giving rise to electronic properties with potential utility in photovoltaic, photoconductive, and/or photoemissive devices.

St. Clair, Terry L.↗

NASA NTRS1995

Polyimides Made From 3,5-Diaminobenzotrifluoride

Polyimides synthesized from 3,5-diaminobenzotrifluoride (DABTF). One monomer of major importance in preparing these high-temperature polymers is 1,3-phenylenediamine (mPDA). Fluorinated polyimides exhibit characteristics potentially attractive for aerospace and electronic applications. Includes optical transparency, solubility in common polar solvents, enhanced thermo-oxidative stability, low dielectric constants, and high glass-transition temperatures. Polyimides also used to form free-standing films, coatings, and moldings.

St. Clair, Terry L.↗

NASA NTRS1994

Aromatic Polyimides With Low Dielectric Constants

Linear aromatic polyimides developed containing dimethylsilane linkages in dianhydride portions of molecules and at least one trifluoromethyl group in each of diamine portions. Polyimides offer advantages of thermal stability, low density, resistance to ionizing radiation, toughness, flexibility, and exhibit lower dielectric constants. Also polyimides nearly transparent and colorless; an advantage in protective coating of solar photovoltaic cells, optical components, and antennas.

St. Clair, Anne K.↗

NASA NTRS1994

Oligomers Terminated By Maleimide And Acetylene

Oligomeric molecules terminated with maleimide and acetylene groups synthesized and thermally treated to form cross-linked polymers exhibiting high or undetectable glass-transition temperatures and high thermo-oxidative stabilities. Compounds used to make thermally stable, glassy polymers.

St. Clair, Terry L.↗

NASA NTRS1994

Making Semicrystalline Polyimide Powders

Semicrystalline polyimides with controlled molecular weights synthesized in process that yields polyimides in powder form. Powders with desirable melt-flow properties formed in reaction vessels, without grinding. Commercially attractive for fabrication of adhesive bonds, compression molding of shaped parts, and deposition onto reinforcing fibers for subsequent hot pressing into polyimide-matrix/fiber composites.

St. Clair, Terry L.↗

NASA NTRS1994

Modified LaRC(TM)-IA Polyimides

Modified versions of thermoplastic polyimide LaRC(TM)-IA incorporate various amounts of additional, rigid moieties into backbones of LaRC(TM)-IA molecules. Modified versions more resistant to solvents and exhibit higher glass-transition temperatures, yet retain melt-flow processability of unmodified LaRC(TM)-IA.

St. Clair, Terry L.↗

NASA NTRS1994

Aromatic Polyimides Containing Meta-Biphenoxy Moieties

Synthesis of two novel monomers and subsequent incorporation into aromatic polyimides yields polyimides containing meta-biphenoxy moieties exhibiting stability at high temperatures and having glass-transition temperatures lower than state-of-the-art polyimides containing para-biphenoxy moieties. Because of outstanding thermal stability, low density, resistance to radiation, electrical-insulating capability, toughness, and flexibility, linear aromatic polyimides used increasingly for applications in aerospace and electronics industries and possibly in others.

St. Clair, Terry L.↗