Engineering topics

St. Clair, T. L.

Publications and source records attributed to St. Clair, T. L..

At least 37 records · Page 2

NASA NTRS1984

Siloxane containing addition polyimides. II - Acetylene terminated polyimides

Acetylene terminated polyimide oligomers having a range of molecular weights have been synthesized by reacting bis (gamma-aminopropyl) tetramethyldisiloxane, aminophenylacetylene and 3, 3', 4, 4' benzophenonetetracarboxylic dianhydride in different molar ratios. The prepolymers were isolated and characterized for melt flow and cure properties. They show promise as adhesives for bonding titanium to titanium and as matrix resins for graphite cloth reinforced composites. The most promising system has been blended in varying proportions with Thermid 600, a commercially available acetylene terminated polyimide oligomer, and the mixtures have been tested for application as composite matrix resins.

Maudgal, S.↗

NASA NTRS1984

Preparation and properties of silane-endcapped polyimide adhesives

Silane-endcapped polyimide high temperature adhesive formulations were prepared by reacting anhydride-terminated poly(amic acid), obtained from benzophenonetetracarboxylic dianhydride and a diamine (3,3'-, 3,4'- or 4,4'-diaminodiphenylmethane and 3,3', 3,4'- or 4,4'-diaminobenzophenone) with varying amounts of gama-aminopropyltriethoxysilane in dimethylacetamide. Resin properties were evaluated by torsional braid analysis and thermogravimetric analysis. Lap shear strengths of some of the adhesive bonds were determined at room temperature and at 177 C before and after ageing at 200 C for 2500 h and after boiling in water for 72 h.

Maudgal, S.↗

NASA NTRS1984

Moisture dependence of positron annihilation spectra in nylon-6

Positron annihilation time spectra have been measured in nylon-6 samples as a function of their moisture content. The measured average long life component lifetime values are: 1722 + or - 47 ps (dry), 1676 + or - 40 ps (14.6 percent saturation value), 1719 + or - 26 ps (29.3 percent saturation value), 1720 + or - 35 ps (50 percent of saturation value), 1857 + or - 35 ps (78.1 percent saturation value), and 1936 + or - 57 ps (saturated). It appears that nylon-6 has a special affinity for water at low concentration levels where H2O molecules enter between the (C = O - H-N) chemical bonds between nylon molecular chains. As the water concentration increases beyond a critical level, nylon-6 specimens start trapping H2O molecules in other bond sites or potential wells. The trapped water increases the free volume in the test specimens and reduces Ps atom formation as well as its subsequent decay rate.

Singh, J. J.↗

NASA NTRS1984

Siloxane containing addition polyimides

Addition polyimide oligomers have been synthesized from bis(gamma-aminopropyl) tetramethyldisiloxane and 3, 3', 4, 4'-benzophenonetetracarboxylic dianhydride using a variety of latent crosslinking groups as endcappers. The prepolymers were isolated and characterized for solubility (in amide, chlorinated and ether solvents), melt flow and cure properties. The most promising systems, maleimide and acetylene terminated prepolymers, were selected for detailed study. Graphite cloth reinforced composites were prepared and properties compared with those of graphite/Kerimid 601, a commercially available bismaleimide. Mixtures of the maleimide terminated system with Kerimid 601, in varying proportions, were also studied.

Maudgal, S.↗

NASA NTRS1984

Preparation and characterization of a siloxane containing bismaleimide

A novel siloxane containing bismaleimide has been prepared by reacting maleic anhydride, benzophenonetetracarboxylic dianhydride and bis(gamma-aminopropyl)tetramethyldisiloxane. Characterization of this monomer was done by comparing its nuclear magnetic resonance spectrum (NMR) to those of model compounds. Solubility of the prepolymer was tested in amide, chlorinated and ether solvents. Films were cast from solution as well as by melt processing and a cure cycle was determined. Infrared spectrum (IR) of the resulting film was obtained. Thermal polymerization was investigated by differential scanning calorimetry (DSC). Thermal properties of the cured resin were followed by means of thermogravimetric analysis (TGA), torsional braid analysis (TBA) and dynamic mechanical analysis (DMA). Thermomechanical analysis (TMA) was used to study the effect of postcure on the glass transition temperature (Tg) of the resin. Adhesive strength of the resin was obtained at ambient temperature.

Maudgal, S.↗

NASA NTRS1984

A thermoplastic polyimidesulfone

A polymer system has been prepared which has the excellent thermoplastic properties generally associated with polysulfones, and the solvent resistance and thermal stability of aromatic polyimides. This material, with improved processability over the base polyimide, can be processed in the 260-325 C range in such a manner as to yield high quality, tough unfilled moldings; strong, high-temperature-resistant adhesive bonds; and well consolidated, graphite-fiber-reinforced moldings (composites). The unfilled moldings have physical properties that are similar to aromatic polysulfones which demonstrates the potential as an engineering thermoplastic. The adhesive bonds exhibit excellent retention of initial strength levels even after thermal aging for 5000 hours at 232 C. The graphite-fiber-reinforced moldings have mechanical properties which makes this polymer attractive for the fabrication of structural composites.

St. Clair, T. L.↗

NASA NTRS1984

Synthesis and characterization of a melt processable polyimide

A melt processable polyimide which contains sulfur and oxygen bridges between the aromatic rings (BDSDA/APB) was synthesized and characterized. Its physical, mechanical, thermal and flow properties were determined as was its resistance to some of the more commonly used solvents. The melt flow properties were measured for the temperature range 250 C - 350 C and under the conditions (stress/strain) encountered in commercial processes.

Burks, H. D.↗

NASA NTRS1984

The development of aerospace polyimide adhesives

Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.

St. Clair, A. K.↗

NASA NTRS1984

Polyimide adhesives - Modified with ATBN and silicone elastomers

A series of studies evaluating the effects of added elastomers on the properties of a high-temperature addition polyimide adhesive is reviewed. First, thermoset polyimides containing various butadiene/acrylonitrile and silicone elastomers were synthesized either as physical polybends or by chemically reacting the elastomers directly onto the polymer backbone. The modified adhesive resins were characterized for thermomechanical properties, fracture toughness and adhesive strength. A second series of elastomer-containing polyimides was also prepared in order to study the effects of the elastomer chain length on polymer properties. Aromatic amine-terminated silicone rubbers with repeat units varying from n = 10 to 105 were reacted onto the polyimide backbone, and the resulting polymers were characterized for their adhesive properties.

St. Clair, A. K.↗

NASA NTRS1983

Aromatic Polyimides With Group VI Linkages

New polymer system combines thermal and solvent resistant properties of aromatic polyimides with processability of PPX polymers. PPX polymers include polyphenylene oxide, polyphenylene sulfide, and polyphenylene sulfone classes. Generally more processable by hot melt or thermoplastic techniques than aromatic polyimides. PPX systems more susceptible to attack by solvents and have lower glass transition temperatures than PI group.

St. Clair, T. L.↗

NASA NTRS1983

Hot-Melt Adhesive Attachment System

Adhesive system is as effective on Earth as in space. Fiberglass cloth mounted in head assembly. When adhesive reaches melt temperature head is attached to metals composites, ceramics, and other materials. Once attached, head cooled rapidly for quick stick. Used to tether tools or attach temporary scaffolding to walls, buildings, or beams.

Fox, R. L.↗

NASA NTRS1983

Laminating Polyimide Films

Thermoplastic polyimide adhesive is used to bond polyimide sheets into flexible laminates. Films are first primed with polyimide adhesive, then bonded together under heat and pressure. Adhesive is cast on separate surface, then sandwiched between polyimide and/or metal films for final assembly. Objectives of process are to improve bonding of high-temperature polyimide film, prepare flexible, large-area, void-free laminates from polyimide film, and laminate polyimide film not only to itself but to metal surfaces.

St. Clair, A. K.↗

NASA NTRS1983

A Solvent-Resistant, Thermoplastic Poly(imidesulfone)

Process for preparing thermoplastic poly(imidesulfone) results in material having excellent thermoplastic properties generally associated with polysulfones and excellent solvent resistance generally associated with polyimides. New thermoplastic, solvent-resistant polymer is used as molding resin, as adhesive, and as matrix resin for fiber reinforced composites.

St. Clair, T. L.↗

NASA NTRS1983

Ultrasonic mixing of epoxy curing agents

A new technique for mixing solid curing agents into liquid epoxy resins using ultrasonic energy was developed. This procedure allows standard curing agents such as 4,4 prime-diaminodiphenyl sulfone (4,4 prime-DDS) and its 3,3 prime-isomer, (3,3 prime-DDS) to be mixed without prior melting of the curing agent. It also allows curing agents with very high melt temperatures such as 4,4 prime-diaminodiphenyl sulfone (4,4 prime-DDS) and its 3,3 prime-isomer, (3,3 prime-DDS) to be mixed without prior melting of the curing agent. It also allows curing agents with very high melt temperatures such as 4,4 prime-diaminobenzophenone (4,4 prime-DABP) (242 C) to be mixed without premature curing. Four aromatic diamines were ultrasonically blended into MY-720 epoxy resin. These were 4, 4 prime-DDS; 3,3 prime-DDA; 4, 4 prime-DABP and 3,3 prime-DABP. Unfilled moldings were cast and cured for each system and their physical and mechanical properties compared. Previously announced in STAR as N83-27018

Hodges, W. T.↗

NASA NTRS1983

Thermoset/Thermoplastic Aromatic Polyamides for Composites

Aromatic polyamides are processed at relatively low temperature, then heat-treated to attain high softening temperature required when polyamides are used as matrix resins in structural composites. New polyamides are compatable with organic fibers often used as reinforcing agents in such composites Pendent propargyl groups serve as latent cross-linking agents in new series of polyamide resins.

St. Clair, T. L.↗

NASA NTRS1983

Acetylene-terminated polyimide adhesives

The nadic-encapped LARC-43 addition polyimide exhibits excellent flow, is easy to process, and can be utilized for short terms at temperatures up to 593 C. It retains good lap shear strength as an adhesive for titanium after aging in air up to 125 hours at 316 C; but lap shear strength degrades with longer exposures at that temperature. Thermid 600, an addition polyimide that is acetylene encapped, exhibits thermomechanical properties even after long term exposure in at air at 316 C. An inherent drawback of this system is that it has a narrow processing window. An acetylene encapped, addition polyimide which is a hybrid of these two systems was developed. It has good retention of strength after long term aging and is easily processed. The synthesis and characterization of various molecular weight oligomers of this system are discussed as well as the bonding, aging, and testing of lap shear adhesive samples. Previously announced in STAR as N83-18910

Hanky, A. O.↗

NASA NTRS1982

Elastomer-Toughened Polyimide Adhesives

T-Peel strengths of adhesive/Titanium bonds are compared for LARC-13 with and without elastomer additives. Elastomer toughening (incorporation of small amounts of rubber into polymer matrix) has been one of the most successful methods for modifying polymer toughness. Addition polyimides are currently under consideration as high-temperature adhesives for bonding composite materials such as titanium.

St. Clair, A. K.↗

NASA NTRS1981

New pressure-sensitive silicone adhesive

Adhesive for high or low temperatures does not stretch severely under load. It is produced by combining intermediate-molecular-weight pressure sensitive adhesive which does not cure with silicone resin that cures with catalyst to rubbery tack-free state. Blend of silicone tackifier and cured rubbery silicone requires no solvents in either atmospheric or vacuum environments. Ratio of ingredients varies for different degrees of tack, creep resistance, and tensile strength.

Leiffer, J. L.↗