Engineering topics

St. Clair, T. L.

Publications and source records attributed to St. Clair, T. L..

At least 19 records

NASA NTRS1992

Melt flow properties of LARC-TPI 1500 series mixtures

This study examines the melt-flow properties of 50/50 mixtures of high flow grade/medium flow grade LARC-TPI 1500 series pellets and a new form (94/6), of medium flow grade material which contains 6 percent of a low molecular weight imide additive. The flow properties are compared with previously reported flow properties of mixtures of earlier batches of high and medium flow grade TPI 1500 materials. Unlike the earlier batches of materials, the later materials were synthesized and mixed at Mitsui Toatsu Chemicals, Inc., Japan, and made into pellets before NASA received them for characterization. They exhibited a lower melt viscosity as well as improved melt stability.

Burks, H. D.↗

NASA NTRS1990

Characterization of medium and high flow series 1500 LARC-TPI

An imidized version of LARC-TPI was developed on NASA's request for use by both aerospace and electronic industries. Two batches of LARC-TPI 1500 Series, consisting of medium-flow and high-flow pellets with different inherent viscosities, are characterized for their dynamic and isothermal melt flow properties at 340 C, mechanical properties of extrudates, extrudate porosity, and degree of crystallinity. The Series shows significantly better melt flow properties than previosly examimed forms of this polymer.

Burks, H. D.↗

NASA NTRS1987

Semi-Interpenetrating Polymer Networks

Desirable qualities achieved by "networking" aromatic and addition polyimides. Novel semi-interpenetrating network (semi-ipn) prepared from two types of polyimides. Semi-ipn results when linear polymer synthesized in presence of cross-linked polymer or vice-versa. Semi-ipn attains certain properties better than those of either polymer alone.

St. Clair, T. L.↗

NASA NTRS1987

Polyimide processing additives

A method has been found for enhancing the melt flow of thermoplastic polyimides during processing. A high molecular weight 422 copoly(amic acid) or copolyimide was fused with approximately 0.05 to 5 pct by weight of a low molecular weight amic acid or imide additive, and this melt was studied by capillary rheometry. Excellent flow and improved composite properties on graphite resulted from the addition of a PMDA-aniline additive to LARC-TPI. Solution viscosity studies imply that amic acid additives temporarily lower molecular weight and, hence, enlarge the processing window. Thus, compositions containing the additive have a lower melt viscosity for a longer time than those unmodified.

Pratt, J. R.↗

NASA NTRS1986

Polyimide of Modified Melt Flow and Toughness

Linear aromatic polyphenylene ether sulfideimide (BDSDA/APB) polymer molded, used as resin, and cast into thin films. In effort to improve further both use properties and amenability to process BDSDA/APB, molecular weight of polymer varied by variations in percentage of end capping. Effect of end capping BDSDA/APB determined by measurement of polymer melt viscosity and fracture-energy values for different number average synthesized molecular weights.

St. Clair, T. L.↗

NASA NTRS1986

Colorless Polyimide Containing Phenoxy-Linked Diamines

Tough, optically transparent films produced. Polyimides having this molecular structure form tough, transparent films. Films made transparent by careful control of manufacturing conditions, including use of highly purified monomers. Need for high-temperature, flexible polymeric films and coating materials that have high optical transparency in 300- to 600nm range of electro-magnetic spectrum for use on antennas, solar cells, and thermalcontrol coatings.

St. Clair, A. K.↗

NASA NTRS1986

Tougher Addition Polyimides Containing Siloxane

Laminates show increased impact resistances and other desirable mechanical properties. Bismaleamic acid extended by reaction of diaminosiloxane with maleic anhydride in 1:1 molar ratio, followed by reaction with half this molar ratio of aromatic dianhydride. Bismaleamic acid also extended by reaction of diaminosiloxane with maleic anhydride in 1:2 molar ratio, followed by reaction with half this molar ratio of aromatic diamine (Michael-addition reaction). Impact resistances improved over those of unmodified bismaleimide, showing significant increase in toughness. Aromatic addition polyimides developed as both matrix and adhesive resins for applications on future aircraft and spacecraft.

St. Clair, T. L.↗

NASA NTRS1986

Solvent-Resistant, Thermally Stable Poly(Carbonate-Imides)

New polymers and copolymers based on polyimide backbone with carbonate moieties exhibit high temperature capability. Because of carbonate unit, many of these materials also exhibit high order or crystallinity. All of new imidecontaining polymers insensitive to acetone. New poly (carbonate-imide) exhibits significantly increased temperature resistance and shows less sensitivity to solvents than commercial polycarbonates.

St. Clair, T. L.↗

NASA NTRS1986

Chromium Ions Improve Moisure Resistance of Epoxy Resins

Broad spectrum of thermosetting epoxy resins used on commercial and military aircraft, primarily as composite matrices and adhesives. In new technique, chromium-ion containing epoxy with improved resistance to moisture produced where chromium ions believed to prevent absorption of water molecules by coordinating themselves to hydroxyl groups on epoxy chain. Anticipated that improved epoxy formulation useful as composite matrix resin, adhesive, or casting resin for applications on commercial and advanced aircraft. Improvement made without sacrifice in mechanical properties of polymer.

St. Clair, A. K.↗

NASA NTRS1986

Colorless, Transparent, Aromatic Polyimide Films

New process yields aromatic condensation polyimide films essentially colorless. Films between 90- and 100-percent transparent at visible wavelength of 500 nm. Optically transparent polyimide films made from variety of aromatic condensation polyimides. Range from very pale in color to colorless, compared to bright yellow color of conventional/ commercial aromatic polyimide film. Increased transparency achieved at no sacrifice in thermal stability, flexibility, toughness, or mechanical properties. These features extremely attractive as films or coating materials for aerospace applications or for any other applications where high optical transparency or thermal stability is required.

St. Clair, A. K.↗

NASA NTRS1986

Ultrasonic Mixing of Epoxy Curing Agents

New ultrasonic mixing technique used to mix several curing agents/epoxy combinations. Major component of commercially available base epoxy resin used in tetraglycidylmethylenedianiline (TGMDA). In ultrasonic mixing system cup holds resin and curing agent during acoustic excitation. Samples placed in cup with top to ultrasonic horn forming bottom of cup. Ultrasonically treated until amber colored and transparent. Because ultrasonic agitation drives out entrapped air, degassing not necessary before cure.

Hodges, W. T.↗

NASA NTRS1986

Evaluation of a novel thermoplastic polyimide for bonding titanium

A novel hot-melt processable polyimide has been synthesized and characterized as an adhesive for a titanium alloy. This system shows potential for applications with service temperatures near 200 C. A bonding cycle was developed from preliminary processing studies. The bonded specimens were tested at room temperature, 177 C and 204 C both before and after aging in air at 204 C for times up to 1000 hours. There was no appreciable change in strength after aging. Bonded specimens were exposed to boiling water continuously for a 72 hour period. These specimens exhibited some loss in strength due to this rather severe exposure.

Progar, D. J.↗

NASA NTRS1985

Evaluation of experimental epoxy monomers

Future generation aircraft need higher performance polymer matrices to fully achieve the weight savings possible with composite materials. New resins are being formulated in an effort to understand basic polymer behavior and to develop improved resins. Some polymer/curing agent combinations that could be useful are difficult to process. In the area of epoxies, a major problem is that some components have physical properties which make them difficult to utilize as matrix resins. A previous study showed that the use of ultrasonic energy can be advantageous in the mixing of curing agents into a standard epoxy resin, such as MY 720 (Ciba-Geigy designation). This work is expanded to include three novel epoxides.

Hodges, W. T.↗

NASA NTRS1985

Siloxane containing polyimides with improved processability

Siloxane containing polyimides were prepared in an effort to improve processability of linear aromatic polyimides and toughness of addition curing imide oligomers. Linear aromatic polyimides were endcapped with varying proportions of a silane; a diaminosiloxane was copolymerized with an aromatic diamine; polyimide oligomers were endcapped with reactive groups; and acetylene terminated siloxane-containing oligomers were blended with linear siloxane-containing polyimides. The resins were used to prepare moldings, titanium to titanium adhesive bonds, and graphite reinforced composites. In each case, physical properties and other characteristics were compared to those of chemically similar polyimides with no siloxane incorporation. The resins, in most cases, performed better at room temperature than the corresponding polyimide. At elevated temperatures, for high siloxane content, the performance deteriorated.

Maudgal, Shubha↗

NASA NTRS1985

A thermoplastic copolyimide

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4,4'-benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗

NASA NTRS1985

Semi-2-interpenetrating polymer networks of high temperature systems

A semi-interpenetrating (semi-IPN) polymer system of the semi-2-IPN type is described in which a polymer of acetylene-terminated imidesulfone (ATPISO2) is cross linked in the presence of polyimidesulfone (PISO2). Six different formulations obtained by mixing of either ATPISO2-1n or ATPISO2-3n with PISO2 in three different proportions were characterized in terms of glass transition temperature, thermooxidative stability, inherent viscosity, and dynamic mechanical properties. Adhesive (lap shear) strength was tested at elevated temperatures on aged samples of adhesive scrim cloth prepared from each resin. Woven graphite (Celion 1000)/polyimide composites were tested for flexural strength, flexural modulus, and shear strength. The network polymers have properties intermediate between those of the component polymers alone, have greatly improved processability over either polyimide, and are able to form good adhesive bonds and composites, making the semi-2-IPN systems superior materials for aerospace structures.

Hanky, A. O.↗

NASA NTRS1985

Synthesis and properties of copoly(carbonate imides)

Copoly(carbonate imides) with varying amounts of carbonate in the backbone were prepared by reacting 4,4-prime-diaminodiphenyl carbonate and 4,4-prime diaminodiphenyl ether with benzophenonetetracarboxylic acid dianhydride in dimethylacetamide at room temeprature. Homopolymers of the two diamines as well as of 3,4-prime- and 3,3-prime-diaminodiphenyl carbonate were prepared in a similar procedure and their properties compared with those of the copolymers.

Maudgal, S.↗

NASA NTRS1985

Processable aromatic polyimides

Two similar polyimide systems were synthesized and characterized. The only structural difference was a sulfide linkage in the anhydride-derived portion of the first system vs. a sulfone linkage in the second. Their physical, mechanical, melt-flow and thermal properties, and their resistance to some of the more common solvents were determined. The flow properties of these polyimides indicate a potential for melt processability.

Burks, H. D.↗