Dielectric cure monitoring of the 55A filament wound case resin
Studies were conducted to correlate data from dielectric cure monitoring of 55A filament would case resins using the Micromet System II with differential scanning calorimetry and resin strength tests. Strength tests for resin bonding at various time intervals and DSC are standard accepted techniques for monitoriong resin cure cycles. They are time consuming, destructive, and non-continuous. The Micromet System II will yield reliable information on degree of cure and other parameters, which should allow better quality control on filament wound case resin cure.