Engineering topics
Publications and source records attributed to Jensen, Brian J..
Poly(arylene ether)s containing pendent ethynyl groups synthesized. Offer advantage over linear poly(arylene ether)s in upon heating, pendent ethynyl groups react to form cross-linked molecular structures exhibiting greater resistance to solvents and higher glass-transition temperatures and tensile moduli. Polymers useful as adhesives, moldings, films, and matrices of composite materials.
Phenylethynyl-terminated polyimides exhibit properties suitable for films, moldings, adhesives, and composite-material matrices. Polyimides synthesized at various molecular weights, selected to obtain desirable properties for specific applications. Thermally cured to form cross-linked molecular structures typically increasing resistance to solvents, glass-transition temperatures, and moduli of elasticity. Also have low molecular weights and low melt viscosities for easier processing into composites and adhesive bonds.
Diamines containing pendent ethynyl and substituted ethynyl groups are synthesized. These diamines are reacted with dianhydrides to form polyamide acids, which are chemically or thermally cyclodehydrated to form polyimides and copolyimides with pendent ethynyl groups. Upon heating, the pendent ethynyl groups react to form crosslinked resins that are useful as adhesives, composite matrices, coatings, moldings, and films.
A phenylethynyl composition which can be used to endcap nucleophilic species is employed in the production of phenylethynyl terminated reactive oligomers exclusively. These phenylethynyl terminated reactive oligomers display unique thermal characteristics, as exemplified by the model compound, 4-phenoxy 4'-phenylethynylbenzophenone, which is relatively stable at 200 C, but reacts at 350 C. In addition, a reactive diluent was prepared which decreases the melt viscosity of the phenylethynyl terminated oligomers and subsequently reacts therewith to increase density of the resulting thermoset. The novelty of this invention resides in the phenylethynyl composition used to terminate a nucleophilic reagent, resulting in the exclusive production of phenylethynyl terminated reactive oligomers which display unique thermal characteristics. A reactive diluent was also employed to decrease the melt viscosity of a phenylethynyl terminated reactive oligomer and to subsequently react therewith to increase the crosslink density of the resulting thermoset. These materials have features which make them attractive candidates for use as composite matrices and adhesives.
Compounds containing phenylethynyl group serve as thermally reactive polymer end caps and reactive diluents. Useful in preparation of adhesives, composite matrices, and molding compounds. These reagents transform arylene ether oligomers and polymers into readily processable reactive materials that convert thermally to thermosets. Compounds synthesized for subsequent use in making thermoset polymers. Phenylethynyl group found to offer several unexpected advantages over ethynyl-based analog.
Phenylethynyl-terminated poly(arylene ethers) synthesized in wide range of molecular weights by adjusting monomer ratios and adding appropriate amounts of 4-phenylethynyl-4'-fluorobenzophenone to monomers to end-cap oligomers during polymerization. Have low molecular weights and low melt viscosities, and are easily processed as adhesives, composites, and moldings. Thermally cured to provide materials that are crosslinked and insoluble in common organic solvents. Exhibit increased resistance to solvents, greater tensile moduli, and better high-temperature properties. Useful as adhesives, composite matrices, and moldings, especially in applications in which combination of toughness and resistance to solvents needed.
Poly(arylene ether)s containing pendent ethynyl and substituted ethynyl groups and poly(arylene ether) copolymers containing pendent ethynyl and substituted ethynyl groups are readily prepared from bisphenols containing ethynyl and substituted ethynyl groups. The resulting polymers are cured up to 350 C to provide crosslinked poly(arylene ether)s with good solvent resistance, high strength and modulus.
Four phenylethynyl amine compounds - 3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone - were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and phenylethynyl-terminated imide oligomers with various molecular weights and compositions were prepared and characterized. These oligomers were cured at 300 to 400 C to provide crosslinked polyimides with excellent solvent resistance, high strength and modulus, and good high temperature properties. Adhesive panels, composites, films, and moldings from these phenylethynyl terminated imide oligomers gave excellent mechanical performance.
Series of novel diamines containing pendent ethynyl groups synthesized and reacted with various dianhydrides to form polyamide acids cyclodehydrated to form polyimides containing pendent ethynyl groups. Copolyimides of these diamines and other diamines also prepared. Upon heating, ethynyl groups in these polymers react with one another to form cross-linked molecular structures. As result of curing reaction, resistance to solvents, glass-transition temperature, and modulus of elasticity of polymer of this type generally increase, accompanied by corresponding decrease in tensile elongation and toughness. Cured polymers used as films, moldings, adhesives, and composite matrices.
Future civilian aircraft will require the use of advanced adhesive systems with high temperature capabilities. One such material has been developed at the NASA Langley Research Center, a phenylethynyl-terminated polyimide given the designation LARC(sup TM)-PETI-5. Recent work has shown the advantages of similar phenylethynyl-terminated polyimides as films, moldings, adhesives, and composite matrix resins. Phenylethynyl-terminated oligomers provide greater processing windows than materials which incorporate simple ethynyl endcaps. Since these low molecular weight, low melt viscosity oligomers thermally cure without the evolution of volatile by-products, they provide an excellent means of producing polymers with high glass transition temperatures, excellent solvent resistance, and high mechanical properties. Three different versions of LARC(sup TM)-PETI-5 with theoretical number average molecular weights (M(sub n)s) of 250, 5000, and 10000 g/mol were synthesized in this work. Differential Scanning Calorimetry (DSC) measurements were performed on the dry powder form of these materials to establish cure conditions which result in high glass transition temperatures (T(sub g)s). Lap shear specimens were prepared from adhesive tape made from each material and with the thermal cure conditions determined from the DSC data. The tensile shear data established processing conditions which provided the best adhesive strengths. Further testing was performed to establish the properties of LARC(sup TM)-PETI-5 as an adhesive material and to determine its solvent resistance.
Phenylethynyl-terminated poly(arylene ethers) are prepared in a wide range of molecular weights by adjusting monomer ratio and adding an appropriate amount of 4-fluoro- 4'-phenylethynyl benzophenone during polymer synthesis. The resulting phenylethynyl-terminated poly(arylene ethers) react and crosslink upon curing for one hour at 350 C to provide materials with improved solvent resistance, higher modulus, and better high temperature properties than the linear, uncrosslinked polymers.
Phosphine oxide groups react with oxygen to form protective phosphate surface layers. Series of imide/arylene ether block copolymers containing phosphine oxide units in backbone synthesized and characterized. In comparison with commercial polyimide, these copolymers display better resistance to etching by oxygen plasma. Tensile strengths and tensile moduli greater than those of polyarylene ether homopolymer. Combination of properties makes copolymers attractive for films, coatings, adhesives, and composite matrices where resistance to atomic oxygen needed.
A series of oxygen plasma resistant imide/arylene ether copolymers were prepared by reacting anhydride-terminated poly(amide acids) and amine-terminated polyarylene ethers containing phosphine oxide units. Inherent viscosities for these copolymers ranged from 0.42 to 0.80 dL/g. After curing, the resulting copolymers had glass transition temperatures ranging from 224 C to 228 C. Solution cast films of the block copolymers were tough and flexible with tensile strength, tensile moduli, and elongation at break up to 16.1 ksi, 439 ksi, and 23 percent, respectively at 25 C and 9.1 ksi, 308 ksi and 97 percent, respectively at 150 C. The copolymers show a significant improvement in resistance to oxygen plasma when compared to the commercial polyimide Kapton. The imide/arylene ether copolymers containing phosphine oxide units are suitable as coatings, films, adhesives, and composite matrices.
Imide/arylene ether block copolymers are prepared by reacting anhydride terminated poly(amic acids) with amine terminated poly(arylene ethers) in polar aprotic solvents and by chemically or thermally cyclodehydrating the resulting intermediate poly(amic acids). The resulting block copolymers have one glass transition temperature or two, depending upon the particular structure and/or the compatibility of the block units. Most of these block copolymers form tough, solvent resistant films with high tensile properties.
Free volume measurements were made in several molecular weight fractions of two different geometries of poly(arylene ether ketone)s. Free volumes were measured using positron lifetime spectroscopy. It has been observed that the free volume cell size V(sub f) varies with the molecular weight M of the test samples according to an equation of the form V(sub f) = AM(B), where A and B are constants. The molecular weights computed from the free volume cell sizes are in good agreement with the values measured by gel permeation chromatography.
A series of imide/arylene ether block copolymers were prepared using an arylene ether block containing a hexafluoroisopropylidene group and an imide block containing a hexafluoroisopropylidene and a trifluoromethyl group in the polymer backbone. The copolymers were characterized and mechanical properties were determined and compared to the homopolymers.
Several new polyimides containing pendent ethynyl groups were prepared and characterized. The new polyimides were prepared from the following novel ethynyl containing diamines; 1,1-bis(p aminophenyl)-1-(p ethynylphenyl) 2,2,2-trifluoroethane, and 1,1-bis(p aminophenyl)-1-(p phenylethynylphenyl)-2,2,2 trifluoroethane, and 1,1-bis(p aminophenyl)-1-(p hexynylphenyl)-2,2,2 trifluoroethane by reacting with either 3,3',4,4' benzophenone tetracarboxylic dianhydride or 2,2-bis(3,4 dicarboxyphenyl) hexafluoropropane dianhydride (6FDA). Inherent viscosities for the polymers ranged from 0.26 to 0.94 dL/g. Three copolymers prepared by reacting 10 mole pct. of one of the ethynyl containing diamines and 90 mole pct. of 2,2-bis-(4-(4 aminophenoxy)phenyl) hexafluoropropane with 6FDA were also prepared and characterized. Inherent viscosities for these copolymers ranged from 1.08 to 1.54 dL/g. Original polyimide glass transition temperatures were approx. 265 C while curing at 300 to 350 C for 1 hr in air increased the Tgs by approx. 10 C. Film properties and thermal stability were also measured for these copolyimides.
New imide/arylene ether copolymers prepared by reacting anhydride-terminated poly(amic acids) with amine-terminated poly(arylene ethers) in polar aprotic solvents. Each resulting copolymer may have one glass-transition temperature or two, depending on chemical structure and/or compatibility of block units. Most of copolymers form tough, solvent-resistant films with high tensile properties. Films cast from solution tough and flexible, and exhibit useful thermal and mechanical properties. Potentially useful as moldings, adhesives, or composite matrices. Because of flexible arylene ether blocks, these copolymers easier to process than polyimides.