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Chen, C. P.

Publications and source records attributed to Chen, C. P..

81 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Allowable silicon wafer thickness versus diameter for ingot rotation ID wafering

Inner diameter (ID) wafering of ingot rotation reduce the ID saw blade diameter was investigated. The blade thickness can be reduced, resulting in minimal kerf loss. However, significant breakage of wafers occurs during the rotation wafering as the wafer thickness decreases. Fracture mechanics was used to develop an equation relating wafer thickness, diameter and fracture behavior at the point of fracture by using a model of a wafer, supported by a center column and subjected to a cantilever force. It is indicated that the minimum allowable wafer thickness does not increase appreciably with increasing wafer diameter and that fracture through the thickness rather than through the center supporting column limits the minimum allowable wafer thickness. It is suggested that the minimum allowable wafer thickness can be reduced by using a vacuum chuck on the wafer surface to enhance cleavage fracture of the center core and by using 111 ingots.

Chen, C. P.↗
NASA NTRS1982

Corrosion inhibitors for water-base slurry in multiblade sawing

The use of a water-base slurry instead of the standard PC oil vehicle was proposed for multiblade sawing (MBS) silicon wafering technology. Potential cost savings were considerable; however, significant failures of high-carbon steel blades were observed in limited tests using a water-based slurry during silicon wafering. Failures were attributed to stress corrosion. A specially designed fatigue test of 1095 steel blades in distilled water with various corrosion inhibitor solutions was used to determine the feasibility of using corrosion inhibitors in water-base MBS wafering. Fatigue tests indicate that several corrosion inhibitors have significant potential for use in a water-base MBS operation. Blade samples tested in these specific corrosion-inhibitor solutions exhibited considerably greater lifetime than those blades tested in PC oil.

Chen, C. P.↗
NASA NTRS1981

Analytical calculation of thickness versus diameter requirements of silicon solar cells

It may be more cost-effective to produce larger diameter silicon Cz solar cells. However, greater thickness is anticipated to be necessary for larger diameter wafers to withstand wafering, cell processing and handling. No material standard for these dimensional requirements is practical or cost-effective for cell manufacturers. The equations relating wafer thickness and diameter were derived by using fracture mechanics analysis. An analytical model was used as a guideline to estimate thickness versus diameter requirements of silicon solar cells in terms of fracture mechanics parameters.

Chen, C. P.↗
NASA NTRS1981

The application of fracture mechanics to failure analysis of photovoltaic solar modules

Cracking of silicon solar cells and solar module transparent cover panels such as glass or polymethylmethacrylate (PMMA) is a major cause of photovoltaic solar module failure in field service. Silicon and cover materials are brittle, and cracking of these materials is expected to result from the extension of preexisting flaws under stress. Study of the cracking mechanisms is therefore an appropriate area for the application of fracture mechanics principles. In this study, fracture mechanics techniques were employed to identify the mode of crack propagation, to examine the fracture-initiating flaw, to estimate the nature and magnitude of fracture stress in the field, and to predict analytically the service lifetime. Recommendations for corrective actions are also made.

Chen, C. P.↗
NASA NTRS1980

Fracture toughness of silicon

The paper presents a study to determine the fracture toughness and to characterize fracture modes of silicon as a function of the orientation of single-crystal and polycrystalline material. It is shown that bar specimens cracked by Knoop microhardness indentation and tested to fracture under four-point bending at room temperature were used to determine the fracture toughness values. It is found that the lowest fracture toughness value of single crystal silicon was 0.82 MN/m to the 3/2 in the 111 plane type orientation, although the difference in values in the 111, 110, and 100 planes was small.

Chen, C. P.↗
NASA NTRS1980

Effect of production processes on the fracture strength of silicon solar cells

Fracture of Czochralski silicon wafers during processing is an important factor in solar cell yield and cost. A fracture-mechanics test and analysis program was developed to evaluate fracture strength changes in the in-process wafer-to-cell processing at different stages on a manufacturer's production line. The strength data were described by Weibull statistical analysis and can be interpreted with the surface-flaw distribution of each of the process steps.

Chen, C. P.↗
NASA NTRS1979

Fracture strength of silicon solar cells

A test program was developed to determine the nature and source of the flaw controlling the fracture of silicon solar cells and to provide information regarding the mechanical strength of cells. Significant changes in fracture strengths were found in seven selected in-process wafer-to-cell products from a manufacturer's production line. The fracture strength data were statistically analyzed and interpreted in light of the exterior flaw distribution of the samples.

Chen, C. P.↗
NASA NTRS1978

Multi-wire slurry wafering demonstrations

Ten slicing demonstrations on a multi-wire slurry saw, made to evaluate the silicon ingot wafering capabilities, reveal that the present sawing capabilities can provide usable wafer area from an ingot 1.05m/kg (e.g. kerf width 0.135 mm and wafer thickness 0.265 mm). Satisfactory surface qualities and excellent yield of silicon wafers were found. One drawback is that the add-on cost of producing water from this saw, as presently used, is considerably higher than other systems being developed for the low-cost silicon solar array project (LSSA), primarily because the saw uses a large quantity of wire. The add-on cost can be significantly reduced by extending the wire life and/or by rescue of properly plated wire to restore the diameter.

Chen, C. P.↗