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Caruso, S. V.

Publications and source records attributed to Caruso, S. V..

29 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

Evaluation of electrically insulative adhesives for use in hybrid microcircuit fabrication

The initial results of a study directed to the task of selecting suitable evaluation tests which can form the basis for guidelines for electrically insulated adhesives are given. The properties of adhesives considered to be of major importance for the proposed application are enumerated, with brief comments. Specific tests to determine the chemical and electrolytic corrosivity of adhesives to commonly used metallization systems, their long-term outgassing after cure, and their bond strengths under a variety of conditions are defined and discussed in detail.

Licari, J. J.↗
NASA NTRS1973

Design guidelines for use of adhesives in hybrid microcircuits

Although it is generally accepted that the use of adhesives in the assembly of hybrid microcircuits offers advantages over other bonding methods, there currently does not exist a set of guidelines for the selection of adhesives which will insure that hybrid microcircuits assembled with them will meet the long use-life, high-reliability requirements of electronic equipment for space applications. This study was directed to the identification of the properties of electrically insulative adhesives that potentially could cause problems in such an application, and to the development of evaluation tests to quantify these properties and thus form the basis for establishing suitable guidelines and, ultimately, specifications. Bond strength, outgassing after cure, and corrosivity were selected for detailed attention since they are considered to be especially critical. Introductory discussion includes enumeration and brief comments on the properties of adhesives considered to be important for the proposed application, a general review of polymeric types of adhesives, and identification of the major types of adhesives commercially available and specifically designed for microelectronic use. The specific tests developed to evaluate bond strength, outgassing after cure, and corrosivity are discussed in detail, and comparative results obtained for selected adhesives representative of the major types are given.

Caruso, S. V.↗
NASA NTRS1972

Development of a container for handling, testing, and storing discrete microelectronic components

A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.

Filip, G. L.↗
NASA NTRS1972

Specification guidelines for hybrid microcircuits

Guidelines establishing manufacturing and control procedures for hybrid microcircuits used in aerospace programs may have possible commercial and industrial applications. Guidelines encompass parts, materials, and process controls, as well as assembly, packaging methods, screening, and inspection procedures for procurement of custom packaged, high reliability microcircuits.

Caruso, S. V.↗
NASA NTRS1972

Investigation of mounting discrete chip components for hybrid microelectronic applications.

In the assembly of hybrid microcircuits, passive and active discrete chip components are attached by epoxy cements and by solders. This study was initiated to determine the integrity of such attachments. Alumina substrates were subjected to a group of thermal and mechanical test environments defined by test methods in MIL-STD-883. Lot samples of substrates with assembly variations were subjected to separately applied testing and to serial testing. These test methods were applied sequentially to the same lot of substrates. Epoxy cements were generally satisfactory with respect to separate tests, although sequential tests severely degraded epoxy bond strengths of all types. Bond strengths to unglazed substrates were slightly superior to those of the same components on glazed types. Solder joints were vulnerable to catastrophic failure in several environments, especially temperature cycling and thermal shock. Vibration and impact shock also produced solder joint failures.

Caruso, S. V.↗
NASA NTRS1972

Thermal expansion compatibility of ceramic chip capacitors mounted on alumina substrates.

The thermal expansion coefficients of a representative sample of BaTiO3 and TiO2 ceramic chip capacitors and alumina substrates have been examined. These data have revealed large potential mechanical stresses under thermal cycling. A mathematical analysis of a composite model of the capacitor to predict the thermal expansion and modulus of elasticity and an analysis of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. In all cases studied, thermally induced stresses great enough to cause capacitor body rupture or termination failure was predicted.

Allen, R. V.↗