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Caruso, S. V.

Publications and source records attributed to Caruso, S. V..

At least 19 records

Third Aerospace Environmental Technology Conference

The elimination of CFC's, Halons, TCA, other ozone depleting chemicals, and specific hazardous materials is well underway. The phaseout of these chemicals has mandated changes and new developments in aerospace materials and processes. We are beyond discovery and initiation of these new developments and are now in the implementation phase. This conference provided a forum for materials and processes engineers, scientists, and managers to describe, review, and critically assess the evolving replacement and clean propulsion technologies from the standpoint of their significance, application, impact on aerospace systems, and utilization by the research and development community. The use of these new technologies, their selection and qualification, their implementation, and the needs and plans for further developments are presented.

Whitaker, A. F.

Analysis of debris from Spacelab Space Life Sciences-1

Airborne microbiological and particulate contamination generated aboard Spacelab modules is a potential safety hazard. In order to shed light on the characteristics of these contaminants, microbial and chemical/particulate analyses were performed on debris vacuumed from cabin and avionics air filters in the Space Life Sciences-1 (SLS-1) module of the Space Transportation System 40 (STS-40) mission 1 month after landing. The debris was sorted into categories (e.g., metal, nonmetal, hair/fur, synthetic fibers, food particles, insect fragments, etc.). Elemental analysis of particles was done by energy dispersive analysis of x rays (metals) and Fourier transform infrared spectroscopy (nonmetals). Scanning electron micrographs were done of most particles. Microbiological samples were grown on R2A culture medium and identified. Clothing fibers dominated the debris by volume. Other particles, all attributed to the crew, resulted from abrasions and impacts during missions operations (e.g., paint chips, plastic, electronic scraps and clothing fibers). All bacterial species identified are commonly found in the atmosphere or on the human body. Bacillus sp. was the most frequently seen bacterium. One of the bacterial species, Enterobacter agglomerans, could cause illness in crew members with depressed immune systems.

Caruso, S. V.

Low-Cost Alternatives in Hybrid Microcircuit Packaging

Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.

Caruso, S. V.

Standards for Epoxies Used in Microelectronics

Improved qualification standards and test procedures for epoxy adhesives used in assembly of high-reliability hybrid microcircuits listed in new report. Objective of standards to resolve problems in areas of outgassing, bond shear strength, corrosivity, volume resistivity, ionic impurities, electrical stability, and frequency of qualification testing. pp

Caruso, S. V.

Shock during PIND test frees particles

Recent study on Particle-Impact Noise-Detection (PIND) shows impact at 1,500 to 4,000 G normally imparted to hybrid microcircuits during testing knocks loose stray trapped particle that can be subsequentially removed. Process may be 80 to 90 percent effective in removal of particles depending on type of test utilized.

Caruso, S. V.

Some aspects of contamination detection, analyses, and control in microcircuits for the NASA Space Shuttle program

The Space Shuttle system is currently one of the National Aeronautics and Space Administration's (NASA) most important and complex programs. A significant number of hybrid microcircuits are being developed and used on the Space Shuttle. Since the Shuttle is a manned vehicle, reliability of the hybrids is flight critical. Loose particle contamination is one of the major causes of failure and reduced operating life for microcircuits. Process controls, surface coatings, and the particle impact noise detection (PIND) test were assessed for control of particle contamination, and the decision was made by NASA to require PIND test for all hybrid circuits. Selected hybrids from the production line of one vendor that had failed the PIND test were analyzed. Results of this program are presented.

Caruso, S. V.

Sensitivities of particle impact noise detection

The results of a study on Particle Impact Noise Detection commonly referred to as PIND testing is described. Certain sensitivities of PIND testing as applicable to hybrid microcircuits were determined, and techniques for removing particles from sealed hybrid packages were evaluated. Methods for freeing particles which have become trapped or hung up inside the hybrid package and, therefore, give no PIND test response were examined.

Keister, F. Z.

Polymer adhesives for hybrid circuits

Report discusses number of tests used in comparing polymer adhesives with metal bonding processes and includes charts and photographs to illustrate test results. Findings suggest reduced quality control costs when epoxies are used in fabrication of microcircuits.

Caruso, S. V.

Reliability of hybrid microcircuit bonding

Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.

Caruso, S. V.

Electrical properties of adhesives used in hybrid microelectronic applications

This paper describes a test program conducted to determine the electrical properties of adhesives used in hybrid microelectronic applications and to develop test methods for measuring these properties. The electrical properties of transistor chips mounted with conductive adhesives are also measured, and the effect of long term storage at high temperature on these devices is determined.

Sergent, J. E.

The relationship between reliability and bonding techniques in hybrid microcircuits

Differential thermal expansion was shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. It is shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis was conducted of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses. It was experimentally observed that the stresses in more compliant bonding systems such as soft lead tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate was proven to be a determining factor in the prediction of failure solder systems. It was found that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Strain gage techniques were used to determine thermally induced expansion stresses of the capacitors and the alumina substrates. The compliance of the different bonding mediums was determined. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Caruso, S. V.

The relationship between reliability and bonding techniques in hybrid systems

Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. It has been experimentally observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Kinser, D. L.

Investigation of discrete component chip mounting technology for hybrid microelectronic circuits

The use of polymer adhesives for high reliability microcircuit applications is a radical deviation from past practices in electronic packaging. Bonding studies were performed using two gold-filled conductive adhesives, 10/90 tin/lead solder and Indalloy no. 7 solder. Various types of discrete components were mounted on ceramic substrates using both thick-film and thin-film metallization. Electrical and mechanical testing were performed on the samples before and after environmental exposure to MIL-STD-883 screening tests.

Caruso, S. V.

The relationship between reliability and bonding techniques in hybrid systems

Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses has been conducted. It has been observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate has proven to be a determining factor in the prediction of failure in both the indium and tin/lead solder systems. This study has shown that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Kinser, D. L.

Contamination control coatings for hybrids

Conductive particles unexpectedly present in hermetically sealed hybrid microcircuit packages pose a high risk of shorting the closely spaced planar conductors within the package, causing failure of the device. The present work evaluates commercially available organic coating materials and determines the most promising ones for protection of complex microcircuits against entrapped particulate contaminants. The candidate materials were exposed to a series of physical and electrical screening tests, the results of which were used as a basis for the final coating selection. Silicones and high-purity epoxies are found to not only display excellent compatibility with microcircuits but to improve the performance of microcircuits as to voltage breakdown between adjacent conductors.

Mastro, A. R.

Design guidelines for use of adhesives and organic coatings in hybrid microcircuits

A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits.

Caruso, S. V.

Capacitor bonding techniques and reliability

The effect of thermal cycling on the mechanical failure of bonded ceramic chip capacitors mounted on alumina substrates is studied. It is shown that differential thermal expansion is responsible for the cumulative effects which lead to delayed failure of the capacitors. Harder or higher melting solders are found to be less susceptible to thermal cycling effects, although they are more likely to fail during initial processing operations.

Kinser, D. L.