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At least 19 records

Measurement of the vibration of structures with a three-component vibration sensor

The effects of transverse waves and longitudinal displacements on transverse displacements in a plate are studied using a three component vibration sensor. Limitations of using the sensor in such measurements are: (1) sensor connection to the plate leads to changes in transverse displacement points on the plate surface, (2) the sensor has a finite magnitude of selectivity with respect to vibrations in the direction of the different channel axes, (3) longitudinal displacements of plate surface create restrictions on relative sensitivity of sensor to longitudinal-transverse waves, and (4) tranverse displacement of plate surface during longitudinal wave propagation also creates a restriction on sensor sensitivity to transverse waves.

Yeskov, V. V.↗

Balanced Placement Of Vibration Sensors And Actuators

Mathematical approach that involves Hankel singular values leads to method for estimation of optimal placement of relatively few vibration sensors and actuators in multivariable flexible structure. Approach extends and complements previous developments regarding approximate decomposition, to Hankel singular values, of singular values of controllability and observability grammian matrices of multivariable flexible structure. Mathematical constructs also described in "Designing An Approximately Balanced LQG Compensator" (NPO-19000).

Gawronski, Wodek↗

Surface Acoustic Wave Vibration Sensors for Measuring Aircraft Flutter

Under NASA's Advanced Air Vehicles Program the Advanced Air Transport Technology (AATT) Project is investigating flutter effects on aeroelastic wings. To support that work a new method for measuring vibrations due to flutter has been developed. The method employs low power Surface Acoustic Wave (SAW) sensors. To demonstrate the ability of the SAW sensor to detect flutter vibrations the sensors were attached to a Carbon fiber-reinforced polymer (CFRP) composite panel which was vibrated at six frequencies from 1Hz to 50Hz. The SAW data was compared to accelerometer data and was found to resemble sine waves and match each other closely. The SAW module design and results from the tests are presented here.

Wilson, William C.↗

Improved Fiber-Optic-Coupled Pressure And Vibration Sensors

Improved fiber-optic coupler enables use of single optical fiber to carry light to and from sensor head. Eliminates problem of alignment of multiple fibers in sensor head and simplifies calibration by making performance both more predictable and more stable. Sensitivities increased, sizes reduced. Provides increased margin for design of compact sensor heads not required to contain amplifier circuits and withstand high operating temperatures.

Zuckerwar, Allan J.↗

Silicon Micromachined Sensor for Broadband Vibration Analysis

The development of a family of silicon based integrated vibration sensors capable of sensing mechanical resonances over a broad range of frequencies with minimal signal processing requirements is presented. Two basic general embodiments of the concept were designed and fabricated. The first design was structured around an array of cantilever beams and fabricated using the ARPA sponsored multi-user MEMS processing system (MUMPS) process at the Microelectronics Center of North Carolina (MCNC). As part of the design process for this first sensor, a comprehensive finite elements analysis of the resonant modes and stress distribution was performed using PATRAN. The dependence of strain distribution and resonant frequency response as a function of Young's modulus in the Poly-Si structural material was studied. Analytical models were also studied. In-house experimental characterization using optical interferometry techniques were performed under controlled low pressure conditions. A second design, intended to operate in a non-resonant mode and capable of broadband frequency response, was proposed and developed around the concept of a cantilever beam integrated with a feedback control loop to produce a null mode vibration sensor. A proprietary process was used to integrat a metal-oxide semiconductor (MOS) sensing device, with actuators and a cantilever beam, as part of a compatible process. Both devices, once incorporated as part of multifunction data acquisition and telemetry systems will constitute a useful system for NASA launch vibration monitoring operations. Satellite and other space structures can benefit from the sensor for mechanical condition monitoring functions.

Gutierrez, Adolfo↗

Thermally Stable, Piezoelectric and Pyroelectric Polymeric Substrates

A thermally stable, piezoelectric and pyroelectric polymeric substrate was prepared. This thermally stable, piezoelectric and pyroelectric polymeric substrate may be used to prepare electromechanical transducers, thermomechanical transducers, accelerometers. acoustic sensors, infrared sensors, pressure sensors, vibration sensors, impact sensors, in-situ temperature sensors, in-situ stress/strain sensors, micro actuators, switches, adjustable fresnel lenses, speakers, tactile sensors. weather sensors, micro positioners, ultrasonic devices, power generators, tunable reflectors, microphones, and hydrophones. The process for preparing these polymeric substrates includes: providing a polymeric substrate having a softening temperature greater than 1000 C; depositing a metal electrode material onto the polymer film; attaching a plurality of electrical leads to the metal electrode coated polymeric substrate; heating the metal electrode coated polymeric substrate in a low dielectric medium; applying a voltage to the heated metal electrode coated polymeric substrate to induce polarization; and cooling the polarized metal electrode coated polymeric electrode while maintaining a constant voltage.

Simpson, Joycely O.↗

Method of Making Thermally Stable, Piezoelectric and Proelectric Polymeric Substrates

A thermally stable, piezoelectric and pyroelectric polymeric substrate was prepared. This thermally stable, piezoelectric and pyroelectric polymeric substrate may be used to prepare electromechanical transducers, thermomechanical transducers, accelerometers, acoustic sensors, infrared sensors, pressure sensors, vibration sensors, impact sensors. in-situ temperature sensors, in-situ stress/strain sensors, micro actuators, switches, adjustable fresnel lenses, speakers, tactile sensors, weather sensors, micro positioners, ultrasonic devices, power generators, tunable reflectors, microphones, and hydrophones. The process for preparing these polymeric substrates includes: providing a polymeric substrate having a softening temperature greater than 100 C; depositing a metal electrode material onto the polymer film; attaching a plurality of electrical leads to the metal electrode coated polymeric substrate; heating the metal electrode coated polymeric substrate in a low dielectric medium: applying a voltage to the heated metal electrode coated polymeric substrate to induce polarization; and cooling the polarized metal electrode coated polymeric electrode while maintaining a constant voltage.

Simpson, Joycelyn O.↗

Thermally Stable, Piezoelectric and Pyroelectric Polymeric Substrates and Method Relating Thereto

A thermally stable, piezoelectric and pyroelectric polymeric substrate was prepared, This thermally stable, piezoelectric and pyroelectric polymeric substrate may be used to prepare electromechanical transducers, thermomechanical transducers, accelerometers, acoustic sensors, infrared sensors, pressure sensors, vibration sensors, impact sensors. in-situ temperature sensors, in-situ stress/strain sensors, micro actuators, switches. adjustable fresnel lenses, speakers, tactile sensors, weather sensors, micro positioners, ultrasonic devices, power generators, tunable reflectors, microphones, and hydrophones. The process for preparing these polymeric substrates includes: providing a polymeric substrate having a softening temperature greater than 100 C; depositing a metal electrode material onto the polymer film; attaching a plurality of electrical leads to the metal electrode coated polymeric substrates; heating the metal electrode coated polymeric substrate in a low dielectric medium; applying a voltage to the heated metal electrode coated polymeric substrate to induce polarization; and cooling the polarized metal electrode coated polymeric electrode while maintaining a constant voltage.

Joycelyn O Simpson↗

Technology for Smoother Transit

Langley Research Center has developed a portable, self contained ride quality meter for accessing ride quality during vehicle operation. System is applicable to air, sea, road, or track vehicles for estimating passenger ride comfort in the presence of complex vibrations and interior noise. Meter has three components: a package of three vibration sensors, a microphone, and a computer. Installed on the floor of the vehicle being tested, sensors measure vibrations in five different axes, microphone measures noise level, and computer processes input from both and gives user a printed readout including a number of options for assessing ride quality.

Source record↗

Zero-Annihilation Periodic Control For Damping Vibrations

Report presents study on use of recently developed zero-annihilation periodic (ZAP) controller for active suppression of vibrations in flexible structures characterized by non-minimum-phase transfer functions. Non-minimum-phase situation occurs if certain kinds of vibration-sensor/vibration-actuator pairs (e.g., piezoelectric) used, and/or if vibration sensor(s) not colocated with vibration actuator(s).

Bayard, David S.↗

Vibrating-piston electrostatic field sensor.

Vibrating-piston electrostatic field sensor for Gemini program, examining design improvements including unity-feedback preamplifier, noise reduction devices, etc

ELECTROSTATIC FIELD↗

Measuring Vibrations With Nonvibration Sensors

Information about vibrations of structure and/or of nonvibration sensor attached to structure extracted from output of sensor. Sensor operated in usual way except, output fed to power-spectral-density analyzer. Vibrational components easily distinguishable in analyzer output because they have frequencies much higher than those of more-slowly-varying temperature, pressure, or other normally desired components. Spectral-analysis technique applied successfully to high-frequency resistance changes in output of platinum-wire resistance thermometer: vibrational peaks in resistance frequency spectrum confirmed by spectrum from accelerometer. Technique also showed predicted 17-kHz vibrational resonance in strain-guage-supporting beam in pressure sensor.

Hill, Arthur J.↗

Robustness In Suppressing Vibrations With Adaptive Control

Report describes theoretical and experimental study of robustness of adaptive model-reference control scheme designed to suppress vibrations in large, flexible structure. Model can be mathematical model or collection of models approximating dynamics of structure, vibration sensors, and vibration-suppressing actuators.

Ih, Che-Hang C.↗

Improved Method of Manufacturing SiC Devices

The phrase, "common-layered architecture for semiconductor silicon carbide" ("CLASSiC") denotes a method of batch fabrication of microelectromechanical and semiconductor devices from bulk silicon carbide. CLASSiC is the latest in a series of related methods developed in recent years in continuing efforts to standardize SiC-fabrication processes. CLASSiC encompasses both institutional and technological innovations that can be exploited separately or in combination to make the manufacture of SiC devices more economical. Examples of such devices are piezoresistive pressure sensors, strain gauges, vibration sensors, and turbulence-intensity sensors for use in harsh environments (e.g., high-temperature, high-pressure, corrosive atmospheres). The institutional innovation is to manufacture devices for different customers (individuals, companies, and/or other entities) simultaneously in the same batch. This innovation is based on utilization of the capability for fabrication, on the same substrate, of multiple SiC devices having different functionalities (see figure). Multiple customers can purchase shares of the area on the same substrate, each customer s share being apportioned according to the customer s production-volume requirement. This makes it possible for multiple customers to share costs in a common foundry, so that the capital equipment cost per customer in the inherently low-volume SiC-product market can be reduced significantly. One of the technological innovations is a five-mask process that is based on an established set of process design rules. The rules provide for standardization of the fabrication process, yet are flexible enough to enable multiple customers to lay out masks for their portions of the SiC substrate to provide for simultaneous batch fabrication of their various devices. In a related prior method, denoted multi-user fabrication in silicon carbide (MUSiC), the fabrication process is based largely on surface micromachining of poly SiC. However, in MUSiC one cannot exploit the superior sensing, thermomechanical, and electrical properties of single-crystal 6H-SiC or 4H-SiC. As a complement to MUSiC, the CLASSiC five-mask process can be utilized to fabricate multiple devices in bulk single-crystal SiC of any polytype. The five-mask process makes fabrication less complex because it eliminates the need for large-area deposition and removal of sacrificial material. Other innovations in CLASSiC pertain to selective etching of indium tin oxide and aluminum in connection with multilayer metallization. One major characteristic of bulk micromachined microelectromechanical devices is the presence of three-dimensional (3D) structures. Any 3D recesses that already exist at a given step in a fabrication process usually make it difficult to apply a planar coat of photoresist for metallization and other subsequent process steps. To overcome this difficulty, the CLASSiC process includes a reversal of part of the conventional flow: Metallization is performed before the recesses are etched.

Okojie, Robert S.↗