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At least 19 records

Experimental determination of satellite bolted joints thermal resistance

The thermal resistance was experimentally determined of the bolted joints of the first Brazilian satellite (SCD 01). These joints, used to connect the satellite structural panels, are reproduced in an experimental apparatus, keeping, as much as possible, the actual dimensions and materials. A controlled amount of heat is forced to pass through the joint and the difference of temperature between the panels is measured. The tests are conducted in a vacuum chamber with liquid nitrogen cooled walls, that simulates the space environment. Experimental procedures are used to avoid much heat losses, which are carefully calculated. Important observations about the behavior of the joint thermal resistance with the variation of the mean temperature are made.

Mantelli, Marcia Barbosa Henriques↗

An investigation of thermal resistance in single- and multiple-cell GaAs MESFETs

Thermal resistances among FETs of a variable number of gates in parallel are compared. Although the thermal resistance per cell for multiple cells is higher, the total thermal resistance is still low because all the cells are parallel to one another. This implies that the multiple-cell structure is capable of dissipating more power than the single-cell structure and therefore of being used as a power FET.

Wang, Y.-C.↗

Low-Thermal-Resistance Baseplate Mounting

Low-thermal-resistance mounting achieved by preloading baseplate to slight convexity with screws threaded through beam. As mounting bolts around edge of base-place tightened, baseplate and cold plate contact first in center, with region of intimate contact spreading outward as bolts tightened.

Perreault, W. T.↗

Thermal resistances of solder-boss/potting compound combinations

Formulas, which can be used as a design tool, are derived to calculate the thermal resistance of solder-boss/potting compound combinations, for different depths of a solder boss, in electronic cordwood modules. Since the solder boss is the heat source, its shape and position will affect the thermal resistance of the surrounding potting compound.

Veilleux, E. D.↗

Thermal resistant environmental barrier coating

A process for preparing a silicon based substrate with a protective coating having improved thermal resistance at temperature up to at least 1500.degree. C., and the resulting article.

Bhatia, Tania↗

Thermal Contact Resistance

Thermal, surface, and deformation analyses for predicting thermal contact resistance for metal surface characteristics in vacuum and fluid environment

METAL SURFACE↗

Corrosion resistant thermal barrier coating

A thermal barrier coating system for protecting metal surfaces at high temperature in normally corrosive environments is described. The thermal barrier coating system includes a metal alloy bond coating, the alloy containing nickel, cobalt, iron, or a combination of these metals. The system further includes a corrosion resistant thermal barrier oxide coating containing at least one alkaline earth silicate. The preferred oxides are calcium silicate, barium silicate, magnesium silicate, or combinations of these silicates.

Levine, S. R.↗

Wear-Resistant, Thermally Conductive Coating

Process makes coating with unusual properties. Coating is copper or copper alloy with controlled dispersion of oxide or carbide particles. Process results in coating that has thermal expansion similar to base material, increased resistance to abrasion when hot, and high thermal conductivity. Coatings resistant to wear used in variety of applications ranging from earth-moving equipment to space vehicles.

Edmonds, Brian J.↗

Junction-to-Case Thermal Resistance of a Silicon Carbide Bipolar Junction Transistor Measured

Junction temperature of a prototype SiC-based bipolar junction transistor (BJT) was estimated by using the base-emitter voltage (V(sub BE)) characteristic for thermometry. The V(sub BE) was measured as a function of the base current (I(sub B)) at selected temperatures (T), all at a fixed collector current (I(sub C)) and under very low duty cycle pulse conditions. Under such conditions, the average temperature of the chip was taken to be the same as that of the temperature-controlled case. At increased duty cycle such as to substantially heat the chip, but same I(sub C) pulse height, the chip temperature was identified by matching the V(sub BE) to the thermometry curves. From the measured average power, the chip-to-case thermal resistance could be estimated, giving a reasonable value. A tentative explanation for an observed bunching with increasing temperature of the calibration curves may relate to an increasing dopant atom ionization. A first-cut analysis, however, does not support this.

Niedra, Janis M.↗

Smoother Turbine Blades Resist Thermal Shock Better

Surface treatment increases resistance of turbine blades to low-cycle fatigue. Smoothing removes small flaws where cracks start. Intended for blades in turbines subject to thermal shock of rapid starting. No recrystallization occurs at rocket-turbine operating temperatures.

Czerniak, Paul↗

Sustainably Sourced, Thermally Resistant, Radiation Hard Biopolymer

This material represents a breakthrough in the production, manufacturing, and application of thermal protection system (TPS) materials and radiation shielding, as this represents the first effort to develop a non-metallic, non-ceramic, biomaterial-based, sustainable TPS with the capability to also act as radiation shielding. Until now, the standing philosophy for radiation shielding involved carrying the shielding at liftoff or utilizing onboard water sources. This shielding material could be grown onboard and applied as needed prior to different radiation landscapes (commonly seen during missions involving gravitational assists). The material is a bioplastic material. Bioplastics are any combination of a biopolymer and a plasticizer. In this case, the biopolymer is a starch-based material and a commonly accessible plasticizer. Starch molecules are composed of two major polymers: amylase and amylopectin. The biopolymer phenolic compounds are common to the ablative thermal protection system family of materials. With similar constituents come similar chemical ablation processes, with the potential to have comparable, if not better, ablation characteristics. It can also be used as a flame-resistant barrier for commercial applications in buildings, homes, cars, and heater firewall material. The biopolymer is observed to undergo chemical transformations (oxidative and structural degradation) at radiation doses that are 1,000 times the maximum dose of an unmanned mission (10-25 Mrad), indicating that it would be a viable candidate for robust radiation shielding. As a comparison, the total integrated radiation dose for a three-year manned mission to Mars is 0.1 krad, far below the radiation limit at which starch molecules degrade. For electron radiation, the biopolymer starches show minimal deterioration when exposed to energies greater than 180 keV. This flame-resistant, thermal-insulating material is non-hazardous and may be sustainably sourced. It poses no hazardous waste threats during its lifecycle. The material composition is radiation-tolerant up to megarad doses, indicating its use as a radiation shielding material. It is lightweight, non-metallic, and able to be mechanically densified, permitting a tunable gradient of thermal and radiation protection as needed. The dual-use (thermal and radiation shielding), sustainable nature of this material makes it suitable for both industrial applications as a sustainable/green building material, and for space applications as thermal protection material and radiation shield.

Pugel, Diane↗

Low conductivity and sintering-resistant thermal barrier coatings

A thermal barrier coating composition comprising a base oxide, a primary stabilizer oxide, and at least one dopant oxide is disclosed. Preferably, a pair of group A and group B defect cluster-promoting oxides is used in conjunction with the base and primary stabilizer oxides. The new thermal barrier coating is found to have significantly lower thermal conductivity and better sintering resistance. The base oxide is selected from the group consisting of zirconia and hafnia and combinations thereof. The primary stabilizing oxide is selected from the group consisting of yttria, dysprosia, erbia and combinations thereof. The dopant or group A and group B cluster-promoting oxide dopants are selected from the group consisting of rare earth metal oxides, transitional metal oxides, alkaline earth metal oxides and combinations thereof. The dopant or dopants preferably have ionic radii different from those of the primary stabilizer and/or the base oxides.

Zhu, Dongming↗

Low conductivity and sintering-resistant thermal barrier coatings

A thermal barrier coating composition is provided. The composition has a base oxide, a primary stabilizer, and at least two additional cationic oxide dopants. Preferably, a pair of group A and group B defect cluster-promoting oxides is used in conjunction with the base and primary stabilizer oxides. The new thermal barrier coating is found to have significantly lower thermal conductivity and better sintering resistance. In preferred embodiments, the base oxide is selected from zirconia and hafnia. The group A and group B cluster-promoting oxide dopants preferably are selected such that the group A dopant has a smaller cationic radius than the primary stabilizer oxide, and so that the primary stabilizer oxide has a small cationic radius than that of the group B dopant.

Zhu, Dongming↗