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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Multichip packaging with thermal insulation

Thermal insulation technique permits low and high power electronic chips to operate in the same package without thermal cross-coupling. An alumina glass shield thermally isolates the low power chip from the high power chip while Kovar substrate acts as a heat sink to remove heat from the high power chip.

Mc Inturff, R. G.

A ceramic composite thermal insulation

Ceramic composite thermal insulation comprised of alumina-silica fibers, pigmentary potassium titanate, and asbestos fibers, bonded with a colloidal silica sol has improved insulating capabilities to both radiant and convective heat. Gelation of the colloidal silica sol prevents binder migration.

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