Spherical harmonics method for computing the image stress due to a spherical void
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Ultrasonic longitudinal through-thickness attenuation in an isotropic medium due to scattering by randomly distributed voids is considered analytically. The attenuation is evaluated on the assumption of no interaction between voids. The scattered power is assumed to be entirely lost, thus accounting for the ultrasonic attenuation. The scattered power due to the presence of a void is described in terms of the scattering cross section of the void. An exact solution exists for the scattering cross section of a spherical void. An approximate solution for the scattering cross section of an ellipsoidal void is developed based on the so-called Born approximation commonly used in quantum mechanics. This approximate solution is valid for k sub p a sub i 1, where k sub p is the wave number of the incident longitudinal wave and a sub i is the largest dimension of the void. It is found that the shape of the void has negligible effect on the scattering cross section and that only the volume of the void is important. Thus, it is noted that in cases where k sup p a sub i 1, the exact scattering cross section of a spherical void having the same volume as an arbitrarily shaped void can be used for evaluating ultrasonic attenuation.
Ultrasonic longitudinal through-thickness attenuation in an isotropic medium due to scattering by randomly distributed voids is considered analytically. The attenuation is evaluated on the assumption of no interaction between voids. The scattered power is assumed to be entirely lost, thus accounting for the ultrasonic attenuation. The scattered power due to the presence of a void is described in terms of the scattering cross section of the void. An exact solution exists for the scattering cross section of a spherical void. An approximate solution for the scattering cross section of an ellipsoidal void is developed based on the so-called Born approximation commonly used in quantum mechanics. This approximate solution is valid for k sub p a sub i much less than 1, where k sub p is the wave number of the incident longitudinal wave and a sub i is the largest dimension of the void. It is found that the shape of the void has negligible effect on the scattering cross section and that only the volume of the void is important. Thus, it is noted that in cases where k sub p a sub i is much less than 1, the exact scattering cross section of a spherical void having the same volume as an arbitrarily shaped void can be used for evaluating ultrasonic attenuation. Previously announced in STAR as N83-28466
This study investigates the role of geometrically necessary dislocations (GNDs) and microstructure on void nucleation and growth in wrought and additively manufactured (AM) tantalum subjected to high-strain rate loading. Multi-modal 3D data was collected using TriBeam tomography to calculate GND densities and their spatial relationship to voids. A microstructural comparison between the wrought and AM samples identified distinct void shapes and locations, with intragranular voids and more spherical voids frequently observed in the AM dataset. Results indicate that voids preferentially form at both high-angle grain boundaries and low-angle subgrain boundaries, the latter of which are frequently observed in the AM material. Through a radial distribution analysis of all voids in the datasets, significant GND localization to near-void-surface regions was observed in both samples. 3D crystal plasticity simulations were employed to extend the experimental observations, revealing higher void growth rates in [111] oriented grains when compared to [001] grains. The simulations also suggest that GNDs can be generated as part of the void growth process, with more GND accumulation for growth in a [111] grain than a [001] grain. These findings provide valuable insights into the links between nanoscale void nucleation, mesoscale void growth, and microstructural effects in dynamically loaded tantalum.
Here, the dimensionality of defects in high explosives controls their heat generation and the expansion of deflagrations from them. We compare the behaviour of spherical voids in three dimensions to that of circular voids in two dimensions. The behaviour is qualitatively similar, but the additional focusing along the extra transverse dimension significantly reduces the piston velocity needed to initiate reactions. However, the reactions do not grow as well in three dimensions, so detonations require larger piston velocities. Pressure exponents are seen to be similar to those for the two-dimensional system.
Morphology is a fundamental attribute when investigating voids and bubbles in UO 2 . Here we use molecular dynamics and Monte Carlo simulations to predict the lowest energy shapes for voids and bubbles in UO 2 . The energies of the {100}, {110} and {111} surfaces have been calculated and used to predict the equilibrium void shape from Wulff construction. This equilibrium shape is compared to low energy faceted voids exhibiting different relative proportions of each family of terminating surfaces. It is found that the equilibrium Wulff shape does not represent the lowest energy morphology for nm void sizes at temperatures between 300 K and 1200 K. Furthermore, the lowest energy faceted voids are slightly more energetically favourable than spherical voids, and as Xe is added, and bubble pressure increases, the faceted morphology becomes even more favourable than the spherical shape.
The growth of an isolated spherical void at and near a grain boundary or a triple junction is studied by means of full-field crystal plasticity simulations with explicit representation of the void. To examine the fundamental aspects of void/grain boundary interactions in these cases, a three-dimensional large-strain elasto-viscoplastic fast-Fourier transform (LS-EVP-FFT) model with axisymmetric tensile periodic boundary conditions was developed. We employ this model to reveal the role of crystallography (grain orientations, grain boundary misorientation and inclination angle with respect to the largest component of the applied stress) and type of loading on void growth. It was found that grain orientation was the primary crystallographic feature governing void growth in strain-rate controlled simulations. For strains small enough to not significantly alter the local geometry, the overall growth of the void in bicrystal boundaries was not strongly affected by grain boundary inclination angle. The relative amount of void growth experienced within each grain in a bicrystal or tri-crystal was strongly dependent on the grain boundary inclination angle. We found a subset of orientations that exhibit faster void growth in bicrystal boundaries than inside the constituent single crystals. Last, we show that when placed primarily in one grain but near the grain boundary, void growth was similar to void growth when placed at the grain boundary. Furthermore, the growing void remained in the original grain and did not grow into the other grain, regardless of crystallographic character.
We explore how the definition of a void influences the conclusions drawn about the impact of the void environment on galactic properties using two void-finding algorithms in the Void Analysis Software Toolkit: Voronoi Voids (V 2 ), a Python implementation of ZOnes Bordering On Voidness (ZOBOV); and VoidFinder, an algorithm that grows and merges spherical void regions. Using the Sloan Digital Sky Survey Data Release 7, we find that galaxies found in VoidFinder voids tend to be bluer and fainter and to have higher (specific) star formation rates than galaxies in denser regions. Conversely, galaxies found in V 2 voids show less significant differences when compared to galaxies in denser regions, less consistent with the large-scale environmental effects on galaxy properties expected from both simulations and previous observations. These results align with previous simulation results that show V 2 -identified voids “leak” into the dense walls between voids because their boundaries extend up to the density maxima in the walls. As a result, when using ZOBOV-based void-finders, galaxies likely to be part of wall regions are instead classified as void galaxies, a misclassification that can be critical to our understanding of galaxy evolution.
For high voltage electrical devices, prevention of high voltage breakdown is critical for device function. Use of polymeric encapsulation such as epoxies is common, but these may include air bubbles or other voids of varying size. The present work aimed to model and experimentally determine the size dependence of breakdown voltage for voids in an epoxy matrix, as a step toward establishing size criteria for void screening. Effects were investigated experimentally for both one-dimensional metal/epoxy/air/epoxy/metal gap sizes from 50 μm to 10 mm, as well as spherical voids of 250 μm, 500 μm, 1 mm and 2 mm sizes. These experimental results were compared to modified Paschen curve and particle-in-cell discharge models; minimum breakdown voltages of 6 - 8.5 kV appeared to be predicted by 1D models and experiments, with minimum breakdown voltage for void sizes of 0.2 - 1 mm. In a limited set of 3D experiments on 250 μm, 500 μm, 1 mm and 2 mm voids within epoxy, the minimum breakdown voltages observed were 18.5 - 20 kV, for 500 μm void sizes. These experiments and models are aimed at providing initial size and voltage criteria for tolerable void sizes and expected discharge voltages to support design of encapsulated high voltage components.
The paper describes the formation, morphology and mechanical properties of Ti void composites. The Ti void composites were made using 100 and 325 mesh Ti powder for solid scaffold formation. The spherical and polyhedral voids (pores) were formed using saccharose particles (table sugar) of different shapes. The Ti void composite morphology was investigated by microcomputed tomography and scanning electron microscopy. The Ti void composites of designed porosity of 50–70% were made. Compression test was applied for mechanical properties estimation. It has been found, that Ti void composites made from 100 mesh Ti and those having spherical pores have a higher strength and elastic modulus, i.e. for the designed porosity of 50% for 100 and 325 mesh Ti void composites, a compressive strength was 32.32 and 20.13 MPa, respectively. It has been shown that this is related to better sintering of the 100 mesh Ti powders compared with the 325 mesh Ti powders. A correlation between microcomputed tomography data and mechanical properties has also been shown. The Ti void composites, made with the use of saccharose as a space holder, described in this work should be a promising material for biomedical applications, where interconnected pores and good mechanical properties are required. - Highlights: • Ti scaffolds of the porosity of 50–70% were made. • Saccharose particles as space holder were applied. • The voids in the scaffolds were designed with spherical and polyhedral shape. • The scaffold structure was investigated by SEM and micro-CT. • Micro-CT data and mechanical properties of the Ti scaffold have been correlated.
Interpreting nonlinear ultrasonic signals detected in nondestructive evaluation of radiation damage needs the knowledge of the correlation between defects and nonlinearity. In this work, molecular dynamics simulations are performed to study the effect of distributed vacancies, voids, Cu atoms, and Cu precipitates on nonlinear ultrasonic response in body-centered cubic (bcc) Fe. The nonlinearity parameter calculated from the second harmonic amplitude in the perfect lattice is 2.73. Vacancies are found to increase the nonlinearity. Surprisingly, clusters of vacancies in the form of spherical voids show an opposite effect. This finding can be used to conveniently distinguish vacancies from voids in the material. Unlike vacancies, individual Cu atoms decrease the nonlinearity. Clustering of Cu atoms into Cu precipitates further decrease the nonlinearity. Interestingly, precipitates with a diameter of 2 nm and larger exhibit a similar effect despite their different structure and coherency with the Fe matrix.
We show although it is well-established that voids profoundly influence the initiation and reaction behaviors of heterogeneous energetic materials such as polymer-bonded explosives (PBX) and propellants, there has been little study of how void location in different constituents in the microstructures of such materials affect the macroscale behavior. Here, we use three-dimensional (3D) mesoscale simulations to study how void placement within the reactive grains versus the polymer binder influences the shock-to-detonation transition (SDT) in a polymer-bonded explosive. The material studied here has a microstructure comprised of 75% PETN (pentaerythritol tetranitrate) grains and 25% HTPB (hydroxyl-terminated polybutadiene) polymer binder by volume. Porosities up to 10% in the form of spherical voids distributed in both the grains and polymer are considered. An Arrhenius reactive burn relation is used to model the chemical kinetics of the PETN grains under shock loading, thereby resolving the heterogeneous detonation behavior of the PBX. The influence of void location on the shock initiation sensitivity of the material is quantitatively ranked by comparing the predicted run distance to detonation (RDD) for each sample. The analysis includes inherent quantification of uncertainties arising from the stochastic variations in the microstructure morphologies and void distributions by using statistically equivalent microstructure sample sets (SEMSS), leading to probabilistic formulations for the RDD as a function of shock pressure. The calculations reveal that the location of voids in the composite microstructure significantly affects the RDD. Specifically, voids exclusively within the grains cause the PBX to be more sensitive (having shorter RDD) than voids in the polymer binder. Unique probabilistic relationships are derived to map the probability of observing RDD for each void location material case, allowing for prediction of initiation behavior anywhere in the shock pressure – RDD space. These findings agree with trends reported in the literature.
This study reports on the formation of 25Mg-bearing precipitates and voids in cubic phase silicon carbide (3C-SiC) single crystals implanted to 9.6×1016 25Mg+/cm2 at 673 K and subsequently annealed at 1073 and 1573 K for 2, 6 and 12 h in an Ar environment. Unidirectionally aligned tetrahedral precipitates are observed around the Mg profile peak, many of which are likely cubic MgC2 and tetragonal Mg2Si particles or their precursor structures. There is also evidence that suggests a possible formation of core (MgC2)-shell (Mg2Si) structure in some of the large precipitates. In addition, small spherical voids are observed near the surface, along with the larger faceted voids in the region of maximum vacancy concentration. 25Mg segregation takes place with a dominant fraction of small atomic clusters. The study provides important results needed to fully assess SiC for potential fusion applications.
Based on the generalized rheological method, the mathematical model describing small deformations of a single-phase porous medium without regard to the effects of a fluid or gas in pores is constructed. The change in resistance of a material to the external mechanical impacts at the moment of pore collapse is taken into account by means of the von Mises–Schleicher strength condition. In order to consider irreversible deformations, alongside with the classical yield conditions by von Mises and Tresca– Saint-Venant, the special condition modeling the plastic loss of stability of a porous skeleton is used. The random nature of the pore size distribution is taken into account. It is shown that the proposed mathematical model satisfies the principles of thermodynamics of irreversible processes. Phenomenological parameters of the model are determined on the basis of the approximate calculation of the problem on quasi-static loading of a cubic periodicity cell with spherical voids. In the framework of the obtained model, the process of propagation of plane longitudinal waves of the compression in a homogenous porous medium, accompanied by the plastic deformation of a skeleton and the collapse of pores, is analyzed.
Damage evolution in engineering metal alloys at the grain scale exhibits significant microstructural heterogeneity and anisotropy. These heterogeneities create local hotspots for stress and strain localization, leading to void nucleation. Crystal orientation influences the active slip systems around voids, affecting lattice rotation and potentially forming discontinuities. At low triaxiality, voids may change shape due to lower stress, rotation, elongation, and coalescence. At high triaxiality, the correlation between crystal orientation and void growth rate becomes stronger, resembling the behavior observed in isolated single crystals. Therefore, understanding the effects of crystal orientation, heterogeneous strain, and defect evolution is crucial for single crystal fracture characterization. Here, in this work, a coupled phase-field damage (PFD) and crystal plasticity (CP) model is implemented within a finite element framework to analyze crystal deformation and failure. The CP method employs a dislocation density-based constitutive model, while intragranular failure is modeled using an anisotropic PFD method. The PFD model considers both the stored energy due to elastic stretching and the energy release due to defect formation and crack formation. A single crystal Al2219 with an intracrystalline spherical void is chosen to analyze fracture. The study finds that fracture propagation is strongly correlated with crystal orientations. This coupled CP-PFD model provides accurate failure prediction in crystalline materials by incorporating the effects of crystal orientations and existing voids. This study demonstrates how the local microstructure and defects influence plastic deformation and failure mechanisms in metal alloys.
Geometrically well-defined Cu6Sn5 thin films were used as model systems to estimate the diffusion depth and diffusion pathway requirements of Li and Na ions in alloy anodes. eta-Cu6Sn5 anodes have an initial reversible capacity towards Li of 545 mAh g-1 (Li3.96Sn or 19.8 Li/Cu6Sn5) and a very low initial irreversible capacity of 1.6 Li/Cu6Sn5. In contrast, the reaction with Na is limited with a reversible capacity of 160 mAh g-1 compared to the expected 516 mAh g-1. The potential profile is analogous to that of pure Sn with an average potential of 0.3 V. X-ray diffraction and 119Sn-M ssbauer measurements show that this limited capacity is likely resulting from the limited diffusion of Na into the anode particles not the formation of a low Na-content phase. This is substantiated by the analysis of the structure of eta-Cu6Sn5 which revealed zig-zag and tunnel diffusion pathways with spherical voids with a diameter very close to that of Na+. Moreover, our results also indicate that an alloy of eta-Cu6Sn5 should have optimized particle sizes of about 10 nm in diameter to increase the Na-capacity significantly. An alternative system consisting of a mixture of Cu6Sn5 and Sn of nominal composition Cu6Sn10 has been studied as possible Na-ion anode material possessing higher storage capacity than pure Cu6Sn5. Indeed this mixture of phase delivers a larger initial reversible storage capacity up to 400 mAh g-1. Finally, we have evidenced that the presence of Cu in Cu6Sn5 and in Cu6Sn10 suppresses the anomalous electrolyte decomposition normally measured for pure Sn at 1.2 V during discharge.