Solder Joint Reliability in Fine Pitch Ball Grid Arrays
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Fowler, Hannah Nicole↗
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Failure Analysis of Solder Joints
Soldering is a critical filler material joining process found in nearly all modern electronics. Ensuring solder joint reliability is crucial for the safety, performance, and cost-effectiveness of microelectronics.
42 ENGINEERING↗
Strain-Controlled High-Cycle Fatigue of Aged Solder Joints for High-Reliability Environments
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Fowler, Hannah Nicole [Sandia National Laboratorie↗
Towards engineering the growth morphology of anisotropic bicrystals
Eutectic alloys, such as Pb-free Bi-Sn-Ag or Sn-Ag-Cu, are essential for their low melting points in solder joints but suffer from brittle intermetallic phases, reducing reliability. Traditional solder design relies on equilibrium phase diagrams, often neglecting the kinetic influence of crystalline anisotropy during solidification. This study hypothesizes that the energetics at the solid-solid-liquid trijunction dictate crystalline facet selection. Using the Al-Al 3 Ni alloy as a model, this project combines atomistic simulations and experimental methods to understand interfacial energies and develop predictive models. This approach aims to mitigate the negative effects of intermetallics, enhancing component reliability in electronic applications.
36 MATERIALS SCIENCE↗