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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Overview of a new slicing method: Fixed Abrasive Slicing Technique (FAST)

The fixed abrasive slicing technique (FAST) was developed to slice silicon ingots more effectively. It was demonstrated that 25 wafers/cm can be sliced from 10 cm diameter and 19 wafers/cm from 15 cm diameter ingots. This was achieved with a combination of machine development and wire-blade development programs. Correlation was established between cutting effectiveness and high surface speeds. A high speed slicer was designed and fabricated for FAST slicing. Wirepack life of slicing three 10 cm diameter ingots was established. Electroforming techniques were developed to control widths and prolong life of wire-blades. Economic analysis indicates that the projected add-on price of FAST slicing is compatible with the DOE price allocation to meet the 1986 cost goals.

Schmid, F.↗
NASA NTRS1982

Part 2: Multi-wire slicing. Fixed Abrasive Slicing Technique (FAST)

The Fixed Abrasive Slicing Techniques (FAST) is a new slicing technique that was developed to slice ingots more effectively. It was demonstrated that 25 wafers/cm can be sliced from 10cm diameter and 19 wafers/cm from 15 cm diameter ingots. Over 99% yield (222 out of a possible 224) was demonstrated during slicing of a 10 cm diameter ingots at 25 wafers/cm. The average thickness of wafers was 0.249 mm and the kerf was 0.151 mm. Slicing rates as high as 0.14 mm/min were also demonstrated for 10 cm diameter ingots.

Source record↗
NASA NTRS1979

Silicon ingot casting: Heat exchanger method. Multi-wire slicing: Fixed abrasive slicing technique, phase 3

In the area of ingot casting the proof of concept of heat exchanger method (HEM) was established. It was also established that HEM cast silicon yielded solar cell performance comparable to Czochralski grown material. Solar cells with conversion efficiencies of up to 15% were fabricated. It was shown that square cross-section ingots can be cast. In the area of crystal slicing, it was established that silicon can be sliced efficiently with the fixed abrasive slicing technique approach. This concept was carried forward to 10 cm diameter workpiece.

Schmid, F.↗
NASA NTRS1982

Silicon slicing by fixed abrasive slicing technique

One of the major cost factors in silicon ingot technology adaptation for terrestrial photovoltaic application is in slicing boules into wafers. The most developed industrial practice is the Internal Diameter (ID) slicing. This method utilizes diamond cutting. The diamond stands up for long periods, hence, the cost of expendable materials is low. However, the ID technology as practiced today has poor material utilization. The Multiblade Slurry (MBS) method has low equipment and labor costs but its expendable material costs are high. Recently Multiwire Slurry (MWS) technology has shown very good material utilization, but its expendable material costs are even higher than MBS. The multiwire Fixed Abrasive Slicing Technique (FAST) still in advanced development stage, combines the low expendable material costs of ID method, the low labor and equipment costs of MBS and high material utilization of MWS.

Schmid, F.↗
NASA NTRS1981

Silicon Ingot Casting - Heat Exchanger Method (HEM). Multi-Wire Slicing - Fixed Abrasive Slicing Technique (Fast). Phase 4 Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-Cost Solar Array Project

The crystallinity of large HEM silicon ingots as a function of heat flow conditions is investigated. A balanced heat flow at the bottom of the ingot restricts spurious nucleation to the edge of the melted-back seed in contact with the crucible. Homogeneous resistivity distribution over all the ingot has been achieved. The positioning of diamonds electroplated on wirepacks used to slice silicon crystals is considered. The electroplating of diamonds on only the cutting edge is described and the improved slicing performance of these wires evaluated. An economic analysis of value added costs of HEM ingot casting and band saw sectioning indicates the projected add on cost of HEM is well below the 1986 allocation.

Schmid, F.↗
NASA NTRS1982

Wire blade development for Fixed Abrasive Slicing Technique (FAST) slicing

A low cost, effective slicing method is essential to make ingot technology viable for photovoltaics in terrestrial applications. The fixed abrasive slicing technique (FAST) combines the advantages of the three commercially developed techniques. In its development stage FAST demonstrated cutting effectiveness of 10 cm and 15 cm diameter workpieces. Wire blade development is still the critical element for commercialization of FAST technology. Both impregnated and electroplated wire blades have been developed; techniques have been developed to fix diamonds only in the cutting edge of the wire. Electroplated wires show the most near term promise and this approach is emphasized. With plated wires it has been possible to control the size and shape of the electroplating, it is expected that this feature reduces kerf and prolongs the life of the wirepack.

Khattak, C. P.↗
NASA NTRS1979

Silicon Ingot Casting - Heat Exchanger Method Multi-wire Slicing - Fixed Abrasive Slicing Technique. Phase 3 Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-cost Solar Array Project

Several 20 cm diameter silicon ingots, up to 6.3 kg. were cast with good crystallinity. The graphite heat zone can be purified by heating it to high temperatures in vacuum. This is important in reducing costs and purification of large parts. Electroplated wires with 45 um synthetic diamonds and 30 um natural diamonds showed good cutting efficiency and lifetime. During slicing of a 10 cm x 10 cm workpiece, jerky motion occurred in the feed and rocking mechanisms. This problem is corrected and modifications were made to reduce the weight of the bladeheat by 50%.

Schmid, F.↗
NASA NTRS1979

Silicon Ingot Casting: Heat Exchanger Method. Multi-wire Slicing: Fixed Abrasine Slicing Technique, Phase 3

Ingot casting was scaled up to 16 cm by 16 cm square cross section size and ingots weighing up to 8.1 kg were cast. The high degree of crystallinity was maintained in the large ingot. For large sizes, the nonuniformity of heat treatment causes chipping of the surface of the ingot. Progress was made in the development of a uniform graded structure in the silica crucibles. The high speed slicer blade-head weight was reduced to 37 pounds, allowing surface speeds of up to 500 feet per minute. Slicing of 10 cm diameter workpieces at these speeds increased the through-put of the machine to 0.145 mm/min.

Schmid, F.↗
DOE OSTI2023

Towards 5G-Enabled Operational Technology for Process Monitoring and Network Slicing

Cyber-Physical Systems (CPS) are deployed to monitor physical processes in critical cyber-enabled services like power generation. However, CPS ecosystems are typically designed without robust security. While it is important to ensure optimal performance of the Operational Technology (OT) environments, security cannot be overlooked. To modernize traditional OT services, 5G technology is being integrated. 5G technology offers low latency and high availability, making it a suitable infrastructure for managing and monitoring physical processes. How-ever, integrating 5G mechanisms into large-scale OT networks introduces new implementation and performance challenges. Therefore, this paper presents a 5G-enabled CPS architecture (5G-CPS) that describes the necessary components, services, and communication protocols and conducts feasibility study to integrate 5G technology in industrial control system networks to understand the performance merits. The 5G-CPS architecture aims to minimize implementation and operational challenges associated with integrating 5G technology into constrained OT.

Aguayo, Jared M.↗
DOE OSTI2023

Integrating 5G Technology for Improved Process Monitoring and Network Slicing in ICS

Industrial Control Systems (ICS) are crucial for monitoring physical processes that support essential cyber-enabled services like power generation. The use of proprietary communication and lack of effective intrusion detection mechanisms pose constraints for efficient operation. Therefore, there is a need to modernize these systems with decentralized technologies like Edge Computing and 5G. However, integrating 5G and Edge Computing into large-scale ICS networks presents implementation and performance challenges. To address these challenges, this paper proposes an integrated ICS architecture that combines 5G and Edge Computing technologies with traditional ICS protocols. The objective is to minimize implementation and operational difficulties while improving the monitoring of physical processes and enabling robust intrusion detection. The proposed architecture outlines the necessary components, services, and communication protocols required for the integration of 5G and Edge Computing.

Aguayo, Jared M.↗
DOE OSTI2025

Enhancing Security and Resiliency in Operational Technology Environments Through Network Slicing and Federated Learning

The growing convergence of Information Technology (IT) and Operational Technology (OT) within Industry 4.0 environments has introduced new demands on industrial network infrastructure. As cyber-physical systems become increasingly interconnected, ensuring the secure, timely, and efficient exchange of critical data is essential. This thesis explores how network slicing, a method of creating isolated virtual network segments, can be applied within OT environments to address challenges such as latency, security, and resource allocation. The first research question addressed in this thesis is: How can OT networks take advantage of NFV and SDN technology to become cyber resilient? This study examines the operational, security, and architectural implications of introducing network slicing into traditionally static OT infrastructures such as Industrial Control Systems (ICS) and SCADA. Through simulated deployments and case studies, the research demonstrates how slicing enables better isolation between critical and non-critical services, thereby improving response time, throughput, and security in sensitive environments. The second question considers: How to dynamically implement network slicing and take advantage of network resources towards integrating decentralized machine learning? In response, this thesis proposes a framework that combines Software-Defined Networking (SDN), Network Function Virtualization (NFV), and Federated Learning (FL) to enable real-time analytics while maintaining data locality. The proposed approach reduces the burden on centralized infrastructure and minimizes privacy risks by supporting on-site training of models across distributed OT nodes, coordinated through dynamically allocated network slices. The third focus explores: How slicing helps to increase the resiliency of OT networks through the orchestration of a dynamic DMZ? To answer this, the thesis presents a method for creating and managing Dynamic Demilitarized Zones (DMZs) using network slicing. This enables flexible and automated isolation of sensitive subsystems during threat scenarios or high-risk operations. Coupled with intelligent orchestration and containerized security services, the dynamic DMZ significantly enhances the system's ability to respond to cyber incidents without halting production. Ultimately, this thesis contributes a comprehensive architecture that blends network slicing with machine learning, secure segmentation, and automation, paving the way for resilient, adaptive, and intelligent OT environments. Performance evaluations across multiple scenarios show improvements in system reliability, threat response time, model accuracy, and resource utilization, providing a strong foundation for future industrial automation systems.

Rodiles Delgado, Brian G↗
DOE OSTI2022

Characteristics and mathematical modeling of apple slice drying in an electrohydrodynamic system with a needle‐plate electrode

Abstract The drying of apple slices in an electrohydrodynamic (EHD) system with a needle‐plate electrode was characterized and mathematically modeled at voltages of 30, 40, and 50 kV and with distances between needles of 5, 6, and 7 cm. The results showed that the drying rate, effective water diffusion coefficient, and rehydration ratio of the apple slices, and specific energy consumption of drying, all increased with increasing voltage. Initially, there was a period when the drying rate was approximately constant in the low‐voltage EHD, but not in the high voltage conditions. At the same voltage, the drying rate was highest when the distance between needles was 6 cm. The voltage and distance between needles had a significant ( p < .05) interactive effect on the effective water diffusion coefficient and specific energy consumption, but not on the rehydration ratio. General mathematical models for drying can be used to represent the drying behavior of apple slices. The Midilli and Kucuk model and the Logarithmic model had the best fits, with correlation coefficients of 0.998803 and 0.998267, respectively. Predictive functions for the moisture ratio of apple slices based on voltage and distance between needles were established and verified. The results indicated that the Logarithmic model could more accurately predict the moisture ratio of apple slices dried using the EHD method. Practical Applications As a new drying technology, electrohydrodynamic (EHD) drying has unequaled advantages. According to the results, using the appropriate voltage and distance between needles improves not only drying efficiency, but also the rehydration ratio of apple slices, which reflects the quality of dried products. The Logarithmic model can accurately predict the EHD drying behavior of apple slices, which is of great significance in optimizing actual production.

Li, Bowen↗
NASA NTRS1992

The topology of large-scale structure. VI - Slices of the universe

Results of an investigation of the topology of large-scale structure in two observed slices of the universe are presented. Both slices pass through the Coma cluster and their depths are 100 and 230/h Mpc. The present topology study shows that the largest void in the CfA slice is divided into two smaller voids by a statistically significant line of galaxies. The topology of toy models like the white noise and bubble models is shown to be inconsistent with that of the observed slices. A large N-body simulation was made of the biased cloud dark matter model and the slices are simulated by matching them in selection functions and boundary conditions. The genus curves for these simulated slices are spongelike and have a small shift in the direction of a meatball topology like those of observed slices.

Park, Changbom↗
NASA NTRS1985

Temperature effects on evoked potentials of hippocampal slices from euthermic chipmunks, hamsters and rats

1. Neural activity was recorded in hippocampal slices from euthermic chipmunks, hamsters and rats. 2. While recording the evoked potentials, the temperature of the Ringer's solution bathing the slice was varied by controlling the temperature of an outer chamber jacketing the recording chamber. 3. The temperature just below that at which a population spike could be evoked, Tt, was 10.4 +/- 0.3 degrees C (mean +/- SEM) for chipmunk slices, 14.1 +/- 0.4 degrees C for rat slices and 14.8 +/- 0.4 degrees C for hamster slices. Tt was significantly lower in the chipmunk slices (P<0.01) than in the rat and hamster slices. 4. Data were interpreted as consistent with the hypothesis that chipmunk hippocampal neurons are intrinsically cold resistant.

NASA Discipline Number 40-30↗
DOE OSTI2022

Different CT slice thickness and contrast‐enhancement phase in radiomics models on the differential performance of lung adenocarcinoma

Abstract Background To investigate the effects of computed tomography (CT) reconstruction slice thickness and contrast‐enhancement phase on the differential diagnosis performance of radiomic signature in lung adenocarcinoma. Methods A total of 187 patients who had been pathologically confirmed with lung adenocarcinoma and nonadenocarcinoma were divided into a training cohort ( n = 149) and validation cohort ( n = 38). All the patients underwent contrast‐enhanced CT and the images were reconstructed with different slice thickness. The radiomic features were extracted from different slice thickness and scan phase. The logistic regression (LR) algorithm was used to build a machine learning model for each group. The area under the curve (AUC) obtained from the receiver operating characteristic (ROC) curve and DeLong test was used to evaluate its discriminating performance. Results Finally, 34 image features and five semantic features were selected to establish a radiomics model. Based on the three contrast‐enhanced CT phases and four reconstruction slice thickness, 12 groups of radiomics models showed good discrimination ability with the AUCs range from 0.9287 to 0.9631, sensitivity range from 0.8349 to 0.9083, specificity range from 0.825 to 0.925 in the training group. Similar results were observed in the validation group. However, there was no statistical significance between the different CT scan phase groups and different slice thickness ( p > 0.05). Conclusions The radiomic analysis of contrast‐enhanced CT can be used for the differential diagnosis of lung adenocarcinoma. Moreover, different slice thickness and contrast‐enhanced scan phase did not affect the discriminating ability in the radiomics models.

Wang, Yang↗
NASA NTRS1976

Slicing of silicon into sheet material: Silicon sheet growth development for the large area silicon sheet task of the low cost silicon solar array project

Multiblade slurry sawing is used to slice 10 cm diameter silicon ingots into wafers 0.024 cm thick using 0.050 cm of silicon per slice (0.026 cm kerf loss). Total slicing time is less than twenty hours, and 143 slices are produced simultaneously. Productivity (slice area per hour per blade) is shown as a function or blade load and thickness, and abrasive size. Finer abrasive slurries cause a reduction in slice productivity, and thin blades cause a reduction of wafer accuracy. Sawing induced surface damage is found to extend 18 microns into the wafer.

Holden, S. C.↗