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Risk-Based SMA and Modernizing Risk Classification at GSFC

In 2014, in response to a large volume of feedback from industry, the science community, and internal to Goddard Space Flight Center (GSFC), GSFC’s Safety and Mission Assurance (SMA) Directorate began a transition to a risk-based implementation of SMA, departing from its longstanding practice of being primarily driven by a mostly static set of Mission Assurance Requirements. The transition started out with a pilot project involving risk-based acceptance of bare-printed circuit boards that was enormously successful, continued through a complete organizational transformation in 2015, and culminated with the baselining of formal Risk-Based SMA policy in 2016. In this presentation we will describe the risk-based SMA concept, segue into how it shapes a modernization of risk classification that GSFC has rolled out, and provide results from the original pilot project for risk-based SMA, involving the printed circuit board assurance process.

Jesse Leitner

Risk-Based SMA

This presentation is a broad overview of risk-based safety and mission assurance, covering most discipline areas within SMA, with multiple examples from experiences in implementation at GSFC since 2014.

Leitner, Jesse A.

Risk-based SMA for Cubesats

This presentation conveys an approach for risk-based safety and mission assurance applied to cubesats. This presentation accompanies a NASA Goddard standard in development that provides guidance for building a mission success plan for cubesats based on the risk tolerance and resources available.

Small Satellites

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards