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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

A Hardware Platform for Studying Naval Power Electronic Power Distribution Systems

Abstract – Future intelligent ship system designs will likely include electric propulsion, numerous highpower sensors, and directed energy weapons. Supply and control of these large nonlinear loads will require a networked, multi-converter power electronic power distribution system. This work presents a hardware platform to emulate a microgrid power system with multiple power converters and a power data communication network. The platform is reconfigurable and can include both AC and DC power distribution zones, representative of shipboard power systems. It also allows for the study of both power control actuation and power data communication delays. Since the platform is based on electric power hardware, spatial and temporal uncertainties are inherently embedded in the system. Specifically, this work examines the control actuation of multiple pulsed power loads in a single microgrid. Several pulse load levels and operating scenarios have been implemented and measured. A framework for control parameter quantification is presented, and various metrics are explored to capture pulse signal characteristics. The sensitivity of pulse load metric parameters is analyzed. Dynamic shipboard, mission-specific load profiles coupled with pulse loads can also be emulated in the hardware platform.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2022

Packaging of wide bandgap power electronic power stages

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

Singh, Brij N.↗
DOE OSTI2023

Emerging Computing Architectures: Simulation of Power Electronics in Power Grids

As the penetration of power electronics increases in power grids, new computing architectures needed to be evaluated for the simulation of high-fidelity models of power electronics in power grids in operations. In this paper, emerging computing architectures such as quantum processing units are evaluated for the simulation of power electronics in power grids. A hybrid algorithm based on classical computing and quantum computing is developed and tested for different use cases of electromagnetic transient (EMT) simulation of power electronics (PE)-based systems and simple circuits. The algorithms needed to simulate power electronics in emerging computing architectures are discussed and thereafter, simulation results are shown.

Debnath, Suman↗
DOE OSTI2024

Tailoring Growth Interfaces of Virtual Substrates for Power Electronics

Power electronics materials are poised to play a critical role in fulfilling next generation energy needs, with up to 90% of future energy demand predicted to flow through power electronics at some point. AlxGa1-xN ranks high among candidate materials, having bipolar dopability, thermal and chemical stability and an ultra-wide bandgap. However, AlGaN growth is limited by a lack of lattice-matched substrates, ultimately stunting material quality at higher thicknesses needed for power electronics applications. Further, high power applications increasingly call for fully vertical device structures, necessitating a conductive substrate. Recently our group identified the (111) plane of TaC as a conductive surface lattice-matched to Al0.55Ga0.45N, taking inspiration from prior work of AlN and GaN binaries on carbide and boride substrates. In this talk we demonstrate the growth of (111)-oriented TaC by RF sputtering. We investigate the interface of TaC with sapphire and SiC substrates and identify means to suppress competing Ta2C nucleation in order to stabilize (111)-oriented TaC. Potential stacking sequences are identified with respect to crystal structure and observed twinning in the TaC films. We next assess structural changes and film recrystallization that results from face-to-face annealing of TaC thin films at high temperatures above 1500 degrees C. Changes to grain structure and domain size are assessed by x-ray diffraction and surface morphology is explored using atomic force microscopy. Figure 1 shows significant improvements to in- and out-of-plane strain following annealing along with the formation of terraced step edges at the film surface. Strain as a function of material composition and thickness is considered, as this may play a major role in future nucleation of AlGaN layers. (1) R. J. in a face-to-face configuration, as illustrated in the schematic at left. Kaplar et al 2017, ECS J. Solid State Sci. Technol. 6 Q3061; (2) D. M. Roberts et al 2022, https://arxiv.org/abs/2208.11769; (3) T. Aizawa et al 2008, J Crys Growth 310, 1 22; (4) R. Liu et al 2002, Appl. Phys. Lett. 81, 3182-3184.

ENGINEERING↗
DOE OSTI2023

Tailoring Growth Interfaces of Virtual Substrates for Power Electronics

Power electronics materials are poised to play a critical role in fulfilling next generation energy needs, with up to 90% of future energy demand predicted to flow through power electronics at some point.[1] Among a number of candidate materials, AlxGa1-xN is the strongest, having bipolar dopability, thermal and chemical stability, an ultra-wide bandgap, and demonstrated experimental feasibility. However, AlGaN growth is limited by a lack of lattice-matched substrates, ultimately stunting material quality at higher thicknesses needed for power electronics applications. Further, high power applications increasingly call for fully vertical device structures, necessitating a conductive substrate. [1] Recently our group identified the (111) plane of TaC as a conductive surface lattice-matched to Al0.55Ga0.45N, taking inspiration from prior work of AlN and GaN binaries on carbide and boride substrates. [2,3,4] In this talk we demonstrate the growth of (111)-oriented TaC by RF sputtering. We investigate the interface of TaC with sapphire and SiC substrates and identify means to suppress competing Ta2C nucleation in order to stabilize (111)-oriented TaC. Potential stacking sequences are identified with respect to crystal structure and observed twinning in the TaC films. We next assess structural changes and film recrystallization that results from face-to-face annealing of TaC thin films at high temperatures above 1500 degrees Celsius. Changes to grain structure and domain size are assessed by x-ray diffraction and surface morphology is explored using atomic force microscopy. Figure 1 shows significant improvements to in- and out-of-plane strain following annealing along with the formation of terraced step edges at the film surface. Strain as a function of material composition and thickness is considered, as this may play a major role in future nucleation of AlGaN layers.

CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SU↗
DOE OSTI2024

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging - Power Die, Power Module, and Converter Level - Part 1

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. To increase power density, performance, efficiency, and reliability and reduce cost, innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental research and development related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics; packaging materials; thermal materials and interfaces; fluid-based thermal management technologies; reliability; condition monitoring; and prognostics. To address these important aspects, this Special Section on Multiphysics Aspects of Power Electronics Packaging includes several articles to be published in two parts. More details are given below on the articles included in the first part.

condition monitoring↗
DOE OSTI2024

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level: Part 2

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. Here, to increase power density, performance, efficiency, and reliability-as well as to reduce cost-innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental R&D related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics, packaging materials, thermal materials and interfaces, fluid-based thermal management technologies, reliability, condition monitoring, and prognostics. Latest developments in this area are published as a Special Section on Multiphysics Aspects of Power Electronics Packaging. The first part was published in the May 2024 issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology (Volume 14, Issue 5). The second part of that Special Section is being published in this issue. A brief summary of the papers included in the second part are given below.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2021

Electrical Systems of Pumped Storage Hydropower Plants: Electrical Generation, Machines, Power Electronics, and Power Systems

Adjustable-speed (AS) pumped storage hydropower (PSH) technology has the potential to become a large, consistent contributor to grid stability enabling higher penetrations of wind and solar energy on the future U.S. power system. AS-PSH has high-value characteristics, such as fast response to provide ancillary services to the grid, because it is a power converter interface with the grid (like battery storage), but at the same time it has the energy content large enough to supply both short-term (seconds-to-minutes) and long-term (minutes-to-hours) of energy needs, like more conventional power plants. However, designs must be optimized to lower the capital expenditure (CapEx) and to provide a high-quality grid interface capability (e.g. power quality, ancillary service provider, fault-tolerant or fault ride-through capability), which is a primary factor in the acceptance of AS-PSH into a utility’s generation mix. This CapEx will be greatly affected by the cost savings associated with the civil structure, turbine design, power electronics, control systems, or unique generator designs. A holistic design must be considered to get a full picture of the benefits of the technology proposed. The AS-PSH can be controlled to reduce the impact of transient disturbance on a power system and at the same time can be controlled to minimized subsequent component fatigue and potential oscillation modes within the plant, with the overall impact in reducing the operational expenditures (OpEx).Generating clean power to meet standards such as Institute of Electrical and Electronics Engineers (IEEE) 519 and International Electrotechnical Commission (IEC) 1000-3-2 will be a continuing challenge. For many technology developers, however, improved AS-PSH technologies will become a key component of generator-storage systems of the future given the prospects of increased performance and decreasing costs, and the ever-increasing penetration of renewables (e.g wind power and solar power).

13 HYDRO ENERGY↗
DOE OSTI2020

Ubiquitous Power Electronics in Future Power Systems: Recommendations to fully utilize fast control capabilities

Power electronics is becoming ubiquitous in power systems because the rapid growth of variable renewable generation such as wind and solar, responsive load, electric vehicles, energy storage, as well as DC transmission. As a result, a high percentage of electricity will be generated, transmitted or consumed by power electronics in the future power system. Such a high penetration of power electronics is changing power system operation landscapes and dynamic characteristics. Two major kinds of impact are reduced system mechanical inertia by inverter-based resources displacing conventional generation and active participation of many distributed energy resources through inverters. This has caused significant reliability challenges for power system operation. The mitigation approach so far has mostly focused on accommodating power electronics inverters as passive devices or creating synthetic inertias to make inverter-based generation behaving as conventional generators. However, the high-speed control capabilities of power electronics present new opportunities for achieving an optimal performance beyond conventional power systems. A lower-inertia system can be more responsive for improving reliability, and distributed small resources can be more adaptive and scalable for better flexibility and resilience. Power electronic inverters are capable of multiple fast control functions. To fully utilized the ubiquitous power electronics in power systems requires technology advancements in the following areas: data and communications to capture the new dynamic behaviors introduced by power electronics; modeling and simulation to understand the behaviors of power electronics and its interactions with other components in the context of power systems; control and optimization methods for fully utilizing the capabilities of power electronics for a new paradigm of performance beyond the traditional inertia-heavy system; and significant upgrades in power electronics hardware to cater to the new control capabilities. If properly controlled and optimized, power electronics can help transform the power system to be responsive, adaptive, and scalable.

Huang, Zhenyu↗
DOE OSTI2021

Nodal Admittance Matrix Based Area Partition Method for Small-Signal Stability Analysis of Large-Scale Power Electronics Based Power Systems

In power electronics-based power systems (PEPSs), small-signal stability is an important factor for system design and operation, where the impedance-based approach is often used. However, unlike small-scale PEPSs with simple and straightforward impedance models, it would take much more efforts to derive the large-scale PEPSs impedance model, which is very complicated and sometimes may get wrong results due to the elimination of right-half plane (RHP) poles during the impedance aggregation process. To simplify the derivation procedure and analyze the small-signal stability of large-scale PEPSs, this paper proposes a nodal admittance matrix (NAM) based area partition method. In this method, the large-scale PEPS is divided into several sub-areas, and the stability is analyzed within the sub-area first, and then the interconnection stability among these sub-areas is analyzed. The proposed method is scalable and can help to locate the weakest areas/converters that may cause instability in the whole system. In this paper, the concept of the proposed method and its application to an example system are introduced. Experimental results are also given to validate the effectiveness of the proposed method.

Qiao, Liang↗
DOE OSTI2026

Power Electronic Development Challenges for High Power Density Integrated Electric Drive Applications

The ever-increasing demand for compact, efficient, and high-performance traction drive systems for transportation applications has accelerated the development of integrated electric drives. In these systems, the electric machine and inverter are integrated within a single housing, offering significant advantages in electrical performance, volume, weight, cost, and overall system efficiency. Despite these benefits, such high levels of integration introduce a new set of challenges, particularly in power electronic design and component selection. This article presents an in-depth investigation of a highly integrated electric drive architecture with an internal stator-mounted inverter, highlighting key design considerations and trade-offs aimed exclusively at maximizing system power density.Based on a comprehensive review of the literature, the power density of a voltage-source-inverter-driven electric drive is primarily governed by the volumetric contributions of the power modules, heat sinks, and DC-link capacitors. Accordingly, this work focuses on the optimization of these three critical components to enhance the inverter's overall power density. The proposed design achieves a power density of 100 kW/L, demonstrating the effectiveness of the presented approach for next-generation integrated electric drive systems.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2023

Guest Editorial: Control interactions in power electronic converter dominated power systems

The modern power systems have undergone significant transformations at the generation, transmission, distribution, and utilization levels due to the remarkable advancements in power electronic converter technology. Power electronic converters are now prevalent in various applications, including wind turbine converters, photovoltaic inverters, flexible AC transmission systems (FACTS) and high-voltage DC (HVDC) converters, distributed generators, microgrids, and electric vehicles. The widespread adoption of power electronic converters has revolutionized the power system by providing fast and flexible controllability. However, their unique characteristics, such as fast response, multi-time scale dynamics, reconfigurable control, and varying sizes and capacities, have introduced new stability challenges, fundamentally altering the dynamics of modern power systems.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2022

Applied Mathematics Challenge: Simulation of Power Electronics in Future Power Grid

There has been a buzz around increased grid modernization for more than a decade. Grid modernization includes, but is not limited to, upgrades to the grid to enhance reliability, resilience, security, and access to clean energy sources. One significant change that has been happening in this context is the increased penetration of computing power and controlled devices like power electronics in the power grid. As this change happens, the operation and characteristics of the power grid are set to undergo a significant change. The power grid moves from an older electric machine dominated grid that used analog electronics for controls to a power electronics dominated grid that uses digital computing for controls. As this transition happens, there are significant problems of applied mathematics that will need to be resolved in power electronics and power grid. The problems include the ability to simulate in different timescales, while also leveraging the significantly improved computing capabilities available today. In this paper, the challenges related to simulation of power electronics are discussed and the challenge problems laid down that applied mathematics may help resolve in future.

Debnath, Suman↗
DOE OSTI2020

Modeling Needs for Power Semiconductor Devices and Power Electronics Systems: Preprint

As energy systems move towards wide-spread electrification, penetration of power semiconductor devices and power electronics continues to grow at a rapid pace. This paper attempts to review the state of the art in power semiconductor modeling and the existing state of modeling in general when in it comes to design of devices and systems. The modeling needs for semiconductor devices vary depending on the end goal, and the level of abstraction needed towards model formulation also changes with the size and complexity of system to be designed. Finally, key aspects of thermal design and modeling for power electronics are also discussed.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2024

Use of Grid-Forming Medium-Voltage Power Electronics Hub in a Microgrid Setting

This paper presents the application of a new design of a multiport, modular, medium-voltage power electronics hub (M3PE-HUB) in a microgrid setting. The M3PE-HUB system was modeled in a digital real-time simulator (DRTS) and integrated into the Banshee microgrid test system. This paper presents the preliminary DRTS simulation-based results of the M3PE-HUB system connected in a test microgrid system. Verification and validation of the M3PE-HUB architecture and controls in the test microgrid setting are the primary contributions of this work. The results of the operation during the islanding and resynchronization process indicate the feasibility of the proposed architecture in a microgrid setting. This paper also presents results for a system reconfiguration use case where the M3PE-HUB was used to reconfigure the system under a fault condition.

grid forming↗
DOE OSTI2023

Comparative Study of Nonlinear Black-Box Modeling for Power Electronics Converters

With the increasing penetration level of renewable sources and power electronics loads in modern power systems, accurate and computationally efficient models are needed. Black-box model (BBM) could be a useful method in such systems. However, not very extensive research efforts have been made for power electronics BBM so far, and existing works mostly focus on steady-state operation, neglecting the important transient behaviors such as load transients, voltage transients, and faults. This paper presents a comparative study of three commonly used nonlinear BBM approaches for transient behaviors of power electronics converters. Comparison methods are proposed, and the evaluations are conducted under different transients using a grid-connected single-phase photovoltaic inverter. The findings of this study provide valuable references for further feasibility investigations on implementing BBMs in large-scale power electronics-rich power systems.

Qiao, Liang↗
DOE OSTI2022

Control of Grid-Connected Multiport MV Power Electronics Energy Hub: Preprint

In this paper a new concept of multiport modular medium-voltage power electronics hub (M3PE-HUB) is introduced for future power grid. The goal for this project is to design, develop, and demonstrate foundational technologies and capabilities for multiport power electronics energy hubs that can serve as intelligent devices to coordinate and control several different sources and loads. In this paper, the architecture of the controller, the central controls, and its verification is presented.

controls↗
DOE OSTI2022

Power Electronic Hardware-in-the-Loop (PE-HIL): Testing Individual Controllers in Large-Scale Power Electronics Systems

Large power electronics systems like multi-port autonomous reconfigurable solar power plant (MARS) are increasingly being researched upon to integrate emerging energy sources. MARS connects photovoltaic (PV) systems and energy storage systems (ESSs) to high-voltage direct current (HVdc) links/grids and high-voltage alternating current (ac) transmission grids. As these large power electronics systems incorporate complex hierarchical control systems that are close-by and communicate fast, the control systems require an unique power electronic hardware-in-the-loop (PE-HIL) real-time architecture to evaluate individual controllers. In this paper, a PE-HIL real-time architecture is proposed to evaluate one of the hundreds to thousands of digital signal processors (DSPs) that are a part of the complex hierarchical control system. The DSP connects to a central processing unit (CPU) and a field programmable gate array (FPGA) that form a part of the upper levels of the control system. The DSP is part of the lower level of the control system. The proposed PE-HIL architecture is tested and evaluated. Preliminary test results are presented to showcase the concept.

Debnath, Suman↗