Polymer Encapsulated Framework Materials for Enhanced Gas Storage and Separations
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For many flexible electronic and photonic devices, moisture stability is one of the most important factors that affects its short- and long-term performance. To maintain the performance, the device should be packaged in such a way that it hermetically blocks moisture from the device; however, in practice, it is rather difficult to achieve. The more practical solution is to impede the moisture ingress to the device. In optoelectronic devices that will be outdoors like solar cells, the interfacial adhesion strength between the encapsulant layer (adhesive) and a moisture barrier layer is also a critical parameter. This paper presents surface modifications of poly(ethylene terephthalate) (PET) carrier films, one of the layers in the trilayer barrier film that directly adheres to an encapsulant, using chemical, UV/ozone, and both treatments to improve adhesion with the thermoset encapsulant polymer material. Whereas previous studies also utilized treatment methods to increase the wettability characteristics, in this paper, we not only present the results of the adhesion strength upon various techniques to achieve good adhesion but also screen their behavior upon exposure to a damp–heat (60 °C, 90% RH) environment. Here, we found that the combined treatment method increases the adhesion by up to 12.1-fold and demonstrates up to a 200% increase in adhesion strength even upon our severe damp–heat environmental condition.
Numerical tools, such as the finite-element method, are increasingly used to design and evaluate the photovoltaic (PV) modules, providing for the reduction of development time and improved performance and reliability. However, high-fidelity material models are necessary to accurately model the complex structural behavior of the involved packaging materials. A common simplification used in recent years is to model the polymer materials (i.e., encapsulant and backsheet) as linear elastic, which will lead to inaccurate results. Therefore, in this work, we present a thorough characterization of the time- and temperature-dependent mechanical response of predominant PV module encapsulant and backsheet materials. Based on this material characterization, we developed and experimentally validated generalized Maxwell models to describe each material's viscoelastic response. In addition, we included measurements of the coefficient of thermal expansion and presented all material models in such a fashion for direct input into commercial finite-element method modeling software.
Modern c-Si photovoltaic (PV) cells provide high performance but can be vulnerable to ultraviolet light induced degradation (UV-ID). Encapsulants, if chosen correctly, can mitigate UV-ID of the PV cell. Here, we explore performance and durability of 14 commercial encapsulant materials before, during, and after irradiation with UV-containing light. Materials include contemporary, polymer-based encapsulants with a base polymer of poly (ethylene co-vinyl acetate) (EVA), polyethylene-..alpha..-olefin (POE), or their composite (EPE). Polymers contain additives that induce UV-blocking, UV-transmitting, or UV-downshifting properties. We use test coupons to study degradation in a chamber held at 65 degrees C under a xenon light source for up to 4000 h of exposure, corresponding to a cumulative dose of 11.5 MJ/m2 at 340 nm. We examine optical properties including spectral transmittance, yellowness index and spectral fluorescence, considering changes to both the encapsulant and glass as a function of weathering time. Degradation modes identified include discoloration, changes to UV cutoff wavelength, changes to solar-weighted transmittance, and most notably a change to the UV-managing properties of some additives. We propose the use of solar-weighted transmittance in the 300- to 400-nm range to better track performance changes in the UV region associated with the UV-related additive. This is especially relevant for the emerging class of UV-downshifting additives, as metrics like UV-cutoff can understate the degree of degradation or change in these materials. While most encapsulants show very little change after weathering, some show significant changes that directly impact how much UV light would reach an underlying cell.
Terrestrial photovoltaic modules must undergo substantial reductions in cost in order to become economically attractive as practical devices for large scale production of electricity. Part of the cost reductions must be realized by the encapsulation materials that are used to package, protect, and support the solar cells, electrical interconnects, and other ancillary components. As many of the encapsulation materials are polymeric, cost reductions necessitate the use of low cost polymers. The performance and status of ethylene vinyl acetate, a low cost polymer that is being investigated as an encapsulation material for terrestrial photovoltaic modules, are described.
Additively manufactured polymer heat exchangers are of recent interest in the thermal sciences due to their lightweight and intricate heat-transfer-enhancing geometrical features. The goal of the present research is to directly encapsulate phase-change material (PCM) into polymer filament for the purpose of 3D printing polymer heat exchangers capable of latent heat thermal energy storage and management. PCMs have the ability to absorb large amounts of latent heat while undergoing a solid-to-liquid phase change at a nearly constant temperature. Encapsulation or containment of PCMs is necessary to prevent leaking since the material continuously cycles between a liquid and a solid state. An organic-based PCM and high-density polyethylene (HDPE) were combined and extruded into a functional composite filament. For the first time, with the aid of a heated enclosure and HDPE build plates, it was demonstrated that these functional composite materials can be printed using fused filament fabrication (FFF). Printing HDPE is known to be difficult; however, based on what was observed in the current study, the PCM and HDPE composite was easier to print than pure HDPE. Thermal properties, such as latent heat of fusion, phase-change temperature, and thermal conductivity, of the composite filament and 3D printed samples were investigated and compared with compression-molded bulk material. Finally, the microstructures of the composite filament and 3D printed samples were visualized, and the basic structures of the HDPE and PCM within both the filament and 3D printed parts were clearly delineated.
Geothermal energy is sustainable and gaining momentum as a solution to energy crises and environmental issues. However, challenges like production temperature and thermal breakthrough can impact geothermal project efficiency. One innovative solution to alleviate the thermal breakthrough is to inject polymer-based materials that are encapsulated in microcapsules into fractures to modify fracture permeability and prevent preferential flow. In our study, we utilized a coupled computational fluid dynamics and discrete element method to simulate the transport of microcapsules under various scenarios controlled by microcapsule size, microcapsule concentration, and fracture roughness. For a smooth fracture, the results indicate that small microcapsules can travel through a smooth fracture regardless of their concentrations. Large microcapsules can transport through a smooth fracture when present in lower concentrations. However, medium and mixed-size microcapsules tend to cause the sealing of a smooth fracture, irrespective of their concentrations. For a rough fracture, the transport of microcapsules is complicated by their interactions with the rough fracture walls. The presence of two sealing positions in a rough fracture adds further complexity to this transport phenomenon. The size and concentration of microcapsules control one sealing location, while the rough fracture walls determine the other sealing location. The rough walls substantially affect microcapsule transport, rendering the role of microcapsule size and concentration less significant. The simulation results suggest that complex fracture surfaces significantly elevate the occurrence of sealing behavior. To mitigate sealing behavior within more complex fractures, it would be beneficial to use smaller and lower concentrations of microcapsules.
Accelerated testing must address the failure mechanisms active within the devices undergoing tests in order to assess lifetimes in a meaningful way. The assumption of constant temperature, thermally activated lifetime, based upon the Arrhenius assumptions, does not always provide the necessary understanding to interpret accelerated tests in microelectronics. Plastic encapsulants, dielectric polymers, and underfill materials are subject to delamination and cracking with thermal cycling. Crack propagation during use environment exposure, drives the potential for failure of microelectronic devices and is therefore a necessary focal point in qualification and life testing. This paper reviews the available research in the application of fracture mechanics to this class of problems in microelectronics including relevant test data. In addition, useful acceleration factor models are derived for polymer crack propagation based on principles of linear elastic fracture mechanics. Further, a simple approach to estimating the minimum temperature cycling ranges, necessary to propagate a crack, is also presented. Finally, a methodology of applying acceleration factors to develop testing plans is shown, with an example in spaceflight for a cubesat in low Earth orbit. Overall, this is a paper that shows a useful and appropriate process for creating physics of failure based life testing for delamination and cracking failures in microelectronic polymers in a temperature cycling environment.
Virus-like particles (VLPs) are a class of biomaterials which serve as platforms for achieving the desired functionality through interior and exterior modifications. Through ionic strength-mediated electrostatic interactions, VLPs have been assembled into hierarchically ordered materials. This work builds on predictive models to prepare polymer-coated VLP dusters at very low ionic strength. Zeta potential measurements showed that the clusters carried a strongly positive charge, a complete charge reversal from the VLP building block. SAXS analysis confirmed polymer adsorption onto the VLP exterior. Furthermore, we then studied the activity of an encapsulated enzyme toward small molecular and macromolecular substrates to determine the effect of each component of the hierarchically assembled material. We found that while encapsulation and polymer coating did not have a large effect on access to the enzyme by its native, small molecular substrate, substrate modification with a macromolecule caused the polymer coating and encapsulation to affect the access to the enzyme.
In this project, ceramic encapsulation materials were studied for high temperature (>~°500 C) applications where typical polymer encapsulants are unstable. A new low temperature (<~°200 C) method of processing ceramics, the cold sintering process was examined. Additionally, commercially available high temperature ceramic cements were investigated. In both cases, the mechanical strengths of available materials are less than desired (i.e., desired strengths similar to Si 3 N 4 ), limiting applicability. Composite designs to increase mechanical strength are suggested. Additionally, non-uniformities in stresses and densification while embedding alumina sheets in encapsulants via cold sintering using uni-axial pressing led to fracture of sheets, and an alternative iso-static based approach is recommended for future studies.
Developing specialized Electro-Static grippers (commercially used in Semiconductor Manufacturing and in package handling) will allow gentle and secure Capture, Soft Docking, and Handling of a wide variety of materials and shapes (such as upper-stages, satellites, arrays, and possibly asteroids) without requiring physical features or cavities for a pincher or probe or using harpoons or nets. Combined with new rigid boom mechanisms or small agile chaser vehicles, flexible, high speed Electro-Static Grippers can enable compliant capture of spinning objects starting from a safe stand-off distance. Electroadhesion (EA) can enable lightweight, ultra-low-power, compliant attachment in space by using an electrostatic force to adhere similar and dissimilar surfaces. A typical EA enabled device is composed of compliant space-rated materials, such as copper-clad polyimide encapsulated by polymers. Attachment is induced by strong electrostatic forces between any substrate material, such as an exterior satellite panel and a compliant EA gripper pad surface. When alternate positive and negative charges are induced in adjacent planar electrodes in an EA surface, the electric fields set up opposite charges on the substrate and cause an electrostatic adhesion between the electrodes and the induced charges on the substrate. Since the electrodes and the polymer are compliant and can conform to uneven or rough surfaces, the electrodes can remain intimately close to the entire surface, enabling high clamping pressures. Clamping pressures of more than 3 N/cm2 in shear can be achieved on a variety of substrates with ultra-low holding power consumption (measured values are less than 20 microW/Newton weight held). A single EA surface geometry can be used to clamp both dielectric and conductive substrates, with slightly different physical mechanisms. Furthermore EA clamping requires no normal force be placed on the substrate, as conventional docking requires. Internally funded research and development has demonstrated that EA can function effectively in space, even in the presence of strong ultraviolet radiation, atomic oxygen, and free electrons. We created a test setup in an existing vacuum chamber to simulate low-Earth-orbit conditions. An EA mechanism was fabricated and installed in the chamber, instrumented, operated in a vacuum, and subjected to ultraviolet photons and free electrons generated by an in-chamber multipactor electron emitter. Extensions to EA that can add value include proximity and contact sensing and transverse motion or rotation, both of which could enhance docking or assembly applications. Possible next steps include development of targeted applications for ground investigation or on-orbit subsystem performance demonstrations using low cost access to space such as CubeSats.
Engineered living materials (ELMs) are a class of hybrid materials that include engineered microbes encapsulated by a polymer matrix. The biotic and abiotic components define the ELMs design space and can be altered to improve performance and function. While current synthetic materials in the field display robust biocompatibility with both native and engineered living systems, we have a limited understanding of how to leverage three-dimensional (3D) form factors to spatially organize and control microbial dynamics within the material. Motivated by this knowledge gap, we employed extrusion-based 3D printing to fabricate multi-kingdom hydrogel constructs for the encapsulation of both single and multi-kingdom microbial systems. Core–shell cubic constructs enabled the spatial organization of a constitutive multi-kingdom system of levodopa (L-DOPA)-producing E. coli and betaxanthins (BXN)-producing S. cerevisiae. This spatial organization in 3D materials can introduce precise control over bioproduction, bioprotection, and biocontainment features that are critical to the efficacy of current ELMs. The relative spatial organization of the organisms, as well as the surface area-to-volume ratio were investigated to determine how these design elements impact microbial behavior (metabolite production, growth, expression, and cell distribution) over time. We demonstrated that F127-bis-urethane methacrylate (F127-BUM) core–shell geometries enable the hierarchical 3D printing of multi-kingdom constructs, offering customizable control over bioproduction, bioprotection, and biocontainment. With the optimization of these core–shell structures for continuous bioproduction, these ELMs could be deployed as compact and sustainable bioreactors in remote environments.
Here, encapsulation of ionic liquids (ILs) and phase change materials (PCMs) can overcome limitations associated with bulk materials, e.g., slow mass transfer rates, high viscosities, or susceptibility to external environment. Single step soft-templated encapsulation methods commonly use interfacial polymerization for shell formation, with a multifunctional monomer in the continuous phase and another in the discontinuous phase, and thus do not give pristine core material. We posit that polymer precipitation onto emulsion droplets in non-aqueous emulsions could produce a robust shell without contamination of the core, ideal for the encapsulation of water-sensitive or water-miscible materials. Solutions of commodity polymers were added to the continuous phase of non-aqueous Pickering emulsions stabilized by alkylated graphene oxide (GO) nanosheets such that the change in solubility of the polymer led to formation of robust shells and the production of capsules that could be isolated. We demonstrate that a polymer precipitation approach can produce capsules with pristine core of the IL 1-ethyl-3-methylimidazolium hexafluorophosphate [Emim][PF 6 ] or the salt hydrate PCM magnesium nitrate hexahydrate (MNH) and shell of nanosheets and polystyrene, poly(methyl methacrylate), or polyethylene. The capsules are approximately 80 wt% [Emim][PF 6 ] or >90 wt% MNH, and the core can undergo multiple cycles of solidification and melting without leakage or destruction. This novel, single-step methodology provides a distinct advantage to access capsules with pristine core composition and is amenable to different core and shell, paving the way for tailoring capsule composition for desired applications.
The Flat Plate Solar Array Project (FSA) has established technically challenging cost and service life goals for photovoltaic modules. These goals are a cost of $70 sq m and an expected 30 years of service life in an outdoor weathering environment. out of the cost goal, $14 sq m is allocated for encapsulation materials, which includes the cost of a structural panel. At FSA's inception in 1975, the cumulative cost of encapsulation materials in popular use, such as room temperature vulcanized (RTV) silicones, aluminum panels, etc., greatly exceeded $14/sq m. Accordingly, it became necessary to identify and/or develop new materials and new material technologies to achieve the goals. Many of these new materials are low cost polymers that satisfy module engineering and encapsulation processing requirements but unfortunately are not intrinsically weather stable. This necessitates identifying lifetime and/or weathering deficiencies inherent in these low cost materials and developing specific approaches to enhancing weather stability.
Polymeric encapsulants are essential materials in photovoltaic modules, protecting sensitive electronics from the environment while providing mechanical integrity to the multilayered assembly. However, these polymeric materials are susceptible to degradation processes driven by the ingress of environmental species, ultraviolet radiation, thermal stresses, and mechanical loading. In this study, we employ a combined atomistic simulation and accelerated aging experimental approach to study the molecular-scale mechanisms of encapsulant degradation. Classical molecular dynamics simulations quantify the diffusion of environmental and degradation species through the polymer matrix, producing composition-specific diffusion coefficients. Reactive simulations characterize activation energy barriers and reaction rate constants for key chemical pathways. In parallel, thermal-desorption analyses coupled with mass spectrometry monitor the emergence and concentration profiles of degradation products under controlled stressor conditions. By integrating simulation and experiment, we establish quantitative correlations between polymer composition, species diffusivity, and chemical reactivity. We anticipate that these relations and quantitative values could serve as high-fidelity inputs to reaction-diffusion models, enabling physics-informed lifetime predictions and guiding the design of more durable encapsulant materials for solar energy applications.
The long-term reliability of encapsulation has a critical impact on the overall cost and effectiveness of photovoltaic modules. An often overlooked but important element of this reliability concerns adhesive degradation of the encapsulant, which results in delamination. This work critically examines the degradation mechanisms – deacetylation, β-scission, and hydrolytic depolymerization – primarily responsible for adhesion loss in ethylene co-vinyl acetate (EVA) encapsulants to provide evidence and clarity regarding the contribution of these mechanisms to the adhesive degradation over the lifetime of a module. EVA samples obtained from mini-modules exposed in two sets of controlled, accelerated conditions – with and without ultraviolet (UV) radiation – are characterized to find specific evidence for the proposed degradation mechanisms. The mini-modules were exposed up to 10,000 h, which represents up to 15–20 years in the field. Results affirm that initially, deacetylation dominates the degradation before scission takes over, followed by hydrolytic depolymerization. Additional analysis highlights the climacteric interdependency between deacetylation and hydrolytic depolymerization as it relates to eventual delamination, where deacetylation products catalyze interfacial hydrolysis reactions. Furthermore, effects occurring at a given interface are isolated, explicitly providing evidence for how these mechanisms are nonuniform throughout the thickness of the EVA. Results demonstrate that the EVA that interfaces with the glass as opposed to the cell experiences increased levels of degradation, explaining why this initially stronger interface becomes the preferential interface for delamination after longer periods of exposure. Additionally, elevated temperatures alone are shown to induce limited migration of sodium ions across the glass/EVA interface.
A polymer syrup for encapsulating solar cell assemblies. The syrup includes uncrosslinked poly(n-butyl)acrylate dissolved in n-butyl acrylate monomer. Preparation of the poly(n-butyl)acrylate and preparation of the polymer syrup is disclosed. Methods for applying the polymer syrup to solar cell assemblies as an encapsulating pottant are described. Also included is a method for solar cell construction utilizing the polymer syrup as a dual purpose adhesive and encapsulating material.
A polymer syrup for encapsulating solar cell assemblies. The syrup includes uncrosslinked poly(n-butyl)acrylate dissolved in n-butyl acrylate monomer. Preparation of the poly(n-butyl)acrylate and preparation of the polymer syrup is disclosed. Methods for applying the polymer syrup to solar cell assemblies as an encapsulating pottant are described. Also included is a method for solar cell construction utilizing the polymer syrup as a dual purpose adhesive and encapsulating material.