Experience with plastic part evaluations at cold temperatures
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Experiences issues with plastic parts at cold temperatures
Missions to MARS/planets/asteroids require electronic parts to operate and survive at extreme cold conditions. At extreme cold temperatures many types of cold related failures can occur. Office 514 is currently evaluating plastic parts under various cold temperature conditions and applications. Evaluations, screens, and qualifications are conducted on flight parts.
cold temperatures↗
Plastic Parts Delamination Validation Using Failure Analysis Methods
Acoustic Micro Imaging (AMI) was successfully employed by JPL Office 507 to evaluate comercial off-the shelf (COTS) plastic encapsulated microcircuits (PEMs).
plastic delamination validation failure analysis m↗
Inelastic Deformation of Metal Matrix Composites: Plasticity and Damage Mechanisms - Part 1
The deformation mechanisms of a Ti 15-3/SCS6 (SiC fiber) metal matrix composite (MMC) were investigated using a combination of mechanical measurements and microstructural analysis. The objectives were to evaluate the contributions of plasticity and damage to the overall inelastic response, and to confirm the mechanisms by rigorous microstructural evaluations. The results of room temperature experiments performed on 0 degree and 90 degree systems primarily are reported in this report. Results of experiments performed on other laminate systems and at high temperatures will be provided in a forthcoming report. Inelastic deformation of the 0 degree MMC (fibers parallel to load direction) was dominated by the plasticity of the matrix. In contrast, inelastic deformations of the 90 degree composite (fibers perpendicular to loading direction) occurred by both damage and plasticity. The predictions of a continuum elastic plastic model were compared with experimental data. The model was adequate for predicting the 0 degree response; however, it was inadequate for predicting the 90 degree response largely because it neglected damage. The importance of validating constitutive models using a combination of mechanical measurements and microstructural analysis is pointed out. The deformation mechanisms, and the likely sequence of events associated with the inelastic deformation of MMCs, are indicated in this paper.
Majumdar, B. S.↗
Inelastic deformation of metal matrix composites: Plasticity and damage mechanisms, part 2
The inelastic deformation mechanisms for the SiC (SCS-6)/Ti-15-3 system were studied at 538 C (1000 F) using a combination of mechanical measurements and detailed microstructural examinations. The objectives were to evaluate the contributions of plasticity and damage to the overall MMC response, and to compare the room temperature and elevated temperature deformation behaviors. Four different laminates were studied: (0)8, (90)8,(+ or -45)2s, and (0/90)2s, with the primary emphasis on the unidirectional (0)8, and (90)8 systems. The elevated temperature responses were similar to those at room temperature, involving a two-stage elastic-plastic type of response for the (0)8 system, and a characteristic three-stage deformation response for the (90)8 and (+ or -45)2s systems. The primary effects of elevated temperatures included: (1) reduction in the 'yield' and failure strengths; (2) plasticity through diffused slip rather than concentrated planar slip (which occurred at room temperature); and (3) time-dependent deformation. The inelastic deformation mechanism for the (0)8 MMC was dominated by plasticity at both temperatures. For the (90)8 and (+ or -45)2s MMCs, a combination of damage and plasticity contributed to the deformation at both temperatures.
Majumdar, B. S.↗
Application of Thermo-Mechanical Measurements of Plastic Packages for Reliability Evaluation of PEMS
Thermo-mechanical analysis (TMA) is typically employed for measurements of the glass transition temperature (Tg) and coefficients of thermal expansion (CTE) in molding compounds used in plastic encapsulated microcircuits (PEMs). Application of TMA measurements directly to PEMs allows anomalies to be revealed in deformation of packages with temperature, and thus indicates possible reliability concerns related to thermo-mechanical integrity and stability of the devices. In this work, temperature dependencies of package deformation were measured in several types of PEMs that failed environmental stress testing including temperature cycling, highly accelerated stress testing (HAST) in humid environments, and bum-in (BI) testing. Comparison of thermo-mechanical characteristics of packages and molding compounds in the failed parts allowed for explanation of the observed failures. The results indicate that TMA of plastic packages might be used for quality evaluation of PEMs intended for high-reliability applications.
Sharma, Ashok K.↗
Ruggedizing a Commercial Depth Camera for Novel Lunar Exploration.
The novel contribution of this instrument is to take the first depth images on the moon. A commercial Kinect camera from Microsoft has been ruggedized for a CLPS mission to the Lunar South Pole. The 12-megapixel color camera is combined with a 1-megapixel color time-of-flight (ToF) depth sensor. The solid-state depth sensor/LIDAR provides greater resolution, a wider field of view, pixel binning, and reduced power consumption. The high-resolution data collected from the mission can be used to construct a near-field virtual environment of the lunar surface for scientific applications. The depth camera can provide a 360-degree view of the target area by combining ToF data with RGB imagery and rover turning. The unit was evaluated for space flight compliant materials and parts at NASA Ames. The microphone array, RF shield, front face, and outer body parts were removed to reduce mass. Plastic parts were replaced with vacuum-compatible materials; manufactured cables were added to properly interface with the host rover, built by Lunar Outpost. The environmental testing was performed on the Kinect with Random Vibration/Sine Testing (Fig 1a), per GEVS (NASA’s General Environmental Verification Standard for spaceflight launch survival). Thermal Vacuum testing cycled the instrument between expected hot (+ 85 C) and cold survival temperatures, as well as +50 C and -25 C operational temps (Fig 1b). The instrument functioned nominally at the conclusion of vibration and thermal cycling tests. The Azure Kinect is manifested on the Nova-C lander which flies on the Intuitive Machines mission IM-2, landing at the lunar south pole for a mission duration of 14 days (one lunar daylight cycle). The unit will be integrated to the MAPP (Mobile Autonomous Prospecting Platform) rover at Lunar Outpost. The Azure Kinect with ToF feature will improve the resolution of lunar geology data near the south pole and enable ground-based VR experience of details of the lunar surface (Fig 1c).
V. Jha↗
Evaluation of Data Retention and Imprint Characteristics of FRAMs Under Environmental Stresses for NASA Applications
A major reliability issue for all advanced nonvolatile memory (NVM) technology devices including FRAMs is the data retention characteristics over extended period of time, under environmental stresses and exposure to total ionizing dose (TID) radiation effects. For this testing, 256 Kb FRAMs in 28-pin plastic DIPS, rated for industrial grade temperature range of -40 C to +85 C, were procured. These are two-transistor, two-capacitor (2T-2C) design FRAMs. In addition to data retention characteristics, the parts were also evaluated for imprint failures, which are defined as the failure of cells to change from a "preferred" state, where it has been for a significant period of time to an opposite state (e.g., from 1 to 0, or 0 to 1). These 256 K FRAMs were subjected to scanning acoustic microscopy (C-SAM); 1,000 temperature cycles from -65 C to +150 C; high temperature aging at 150 C, 175 C, and 200 C for 1,000 hours; highly accelerated stress test (HAST) for 500 hours; 1,000 hours of operational life test at 125 C; and total ionizing dose radiation testing. As a preconditioning, 10 K read/write cycles were performed on all devices. Interim electrical measurements were performed throughout this characterization, including special imprint testing and final electrical testing. Some failures were observed during high temperature aging test at 200 C, during HAST testing, and during 1,000 hours of operational life at 125 C. The parts passed 10 Krad exposure, but began showing power supply current increases during the dose increment from 10 Krad to 30 Krad, and at 40 Krad severe data retention and parametric failures were observed. Failures from various environmental group testing are currently being analyzed.
Sharma, Asbok K.↗
Evaluation of Data Retention and Imprint Characteristics of FRAMs Under Environmental Stresses for NASA Applications
A major reliability issue for all advanced nonvolatile memory (NVM) technology devices including FRAMs (Ferroelectric random access memories) is the data retention characteristics over extended period of time, under environmental stresses and exposure to total ionizing dose (TID) radiation effects. For this testing, 256 Kb FRAMs in 28-pin plastic DIPS, rated for industrial grade temperature range of -40 C to +85 C, were procured. These are two-transistor, two-capacitor (2T-2C) design FRAMs. In addition to data retention characteristics, the parts were also evaluated for imprint failures, which are defined as the failure of cells to change from a "preferred" state, where it has been for a significant period of time to an opposite state (e.g., from 1 to 0, or 0 to 1). These 256 K FRAMs were subjected to scanning acoustic microscopy (C-SAM); 1,000 temperature cycles from -65 C to +150 C; high temperature aging at 150 C, 175 C, and 200 C for 1,000 hours; highly accelerated stress test (HAST) for 500 hours; 1,000 hours of operational life test at 125 C; and total ionizing dose radiation testing. As a preconditioning, 10 K read/write cycles were performed on all devices. Interim electrical measurements were performed throughout this characterization, including special imprint testing and final electrical testing. Some failures were observed during high temperature aging test at 200 C, during HAST testing, and during 1,000 hours of operational life at 125 C. The parts passed 10 Krad exposure, but began showing power supply current increases during the dose increment from 10 Krad to 30 Krad, and at 40 Krad severe data retention and parametric failures were observed. Failures from various environmental group testing are currently being analyzed.
Sharma, Ashok K.↗
Evaluation of the energy transfer in the char zone during ablation. Part 2: In-depth response of ablative composites, volume 1
The decomposition of ablative composites is described along with the transport phenomena of pyrolysis gases which result from the decomposition of these plastics as they flow through the porous char of char-forming ablators. The pyrolysis products are those formed by the thermal degradation of nylon-phenolic resin and silicone elastomer composites. Emphasis is placed on the nature and extent of chemical reactions of the pyrolysis products and the char, along with the energy absorbed by the combined pyrolysis and char zone. Chemical reactions with thermodynamically consistent kinetic data are determined in order to develop a realistic analysis for predicting the thermal performance of ablative heat shields.
Pike, R. W.↗
Dosimetric results on EURECA
Detector packages were exposed on the European Retrievable Carrier (EURECA) as part of the Biostack experiment inside the Exobiology and Radiation Assembly (ERA) and at several locations around EURECA. The packages consist of different plastic nuclear track detectors, nuclear emulsions and thermoluminescence dosimeters (TLD's). Evaluation of these detectors yields data on absorbed dose and particle and LET spectra. Preliminary results of absorbed dose measurements in the EURECA dosimeter packages are reported and compared to results of the LDEF experiments. The highest dose rate measured on EURECA is 63.3 plus or minus 0.4 mGy d(exp -1) behind a shielding thickness of 0.09 g cm(exp -2) in front of the detector package.
Reitz, G.↗
Adhesive Properties of Cured Phenylethynyl containing Imides
As part of a program to develop structural adhesives for high performance aerospace applications, several phenylethynyl containing oligomer blends of Larc(TM) MPEI and a reactive plasticizer designated LaRC LV-1 21 were prepared and evaluated. The fully imidized blends exhibited minimum melt viscosity as low as 1000 poise at 371 C. Ti/Ti lap shear specimens fabricated at 316 C under 15 psi gave RT strength of approx. 4300 psi and no change in strength was observed at 177 C. The chemistry and properties of this new MPEI as well as some blends of MPEI with LV-121 are presented and compared to the linear version, LARC(TM)-PETI-5.
Chang, Alice C.↗
Considerations of crack growth and plasticity in finite element analysis
A finite-element analysis was made of crack growth in a center-cracked specimen subjected to monotonically increasing load until the point of fast fracture. Since part of the specimen experienced unloading, the boundary value problem which was formulated was based upon incremental theory of plasticity. Experimental load and crack size records were utilized. Linear relations between plastic energy and crack growth were observed. Fracture toughness parameters, which were evaluated at the onset of unstable crack propagation from finite-element analysis, were in good agreement with those determined experimentally.
Lee, J. D.↗
Materials Selection and Their Characteristics as Used in Rapid Prototyping
NASA's Marshall Space Flight Center (MSFC) conducted a program to evaluate six technologies used in Rapid Prototyping (RP) to produce investment casting patterns. In this paper, RP refers to the collective additive fabrication technologies known as Solid Free-Form Fabrication. Such technologies are being used with increasing frequency in manufacturing applications, due in part to their rapidly expanding capabilities to fabricate models from many types of materials. This study used ABS plastic, polycarbonate, TrueForm PM6, epoxy resin, paper, starch, and wax. The baseline model was a semi-complex prototype fuel pump housing, intended for use in the X-33 reusable launch vehicle. All models were shelled in a production- grade colloidal silica ceramic. Primary coats were zircon-base flour with zircon backup, while secondary coats were silica grains with a tabular alumina backup. Each model was shelled in an identical manner, using the same atmospheric conditions and drying times, as well as the same number of layers. Bake-outs and firing cycles were consistent with the leach ability of each material. Preheat and bath temperatures were also kept consistent. All molds were cast in vacuum using a hydrogen-resistant superalloy (NASA- 23) that was developed in-house. The final technical evaluation included detailed measurements of the model and the final casting, in order to determine any dimensional changes caused by different pattern materials, as well as documentation of all defects and any obvious refractory/model reactions. Prototype production costs were estimated for each method and taken into consideration during trade-off analysis.
Cooper, K.↗
Evaluation of Data Retention Characteristics for Ferroelectric Random Access Memories (FRAMs)
Data retention and fatigue characteristics of 64 Kb lead zirconate titanate (PZT)-based Ferroelectric Random Access Memories (FRAMs) microcircuits manufactured by Ramtron were examined over temperature range from -85 C to +310 C for ceramic packaged parts and from -85 C to +175 C for plastic parts, during retention periods up to several thousand hours. Intrinsic failures, which were caused by a thermal degradation of the ferroelectric cells, occurred in ceramic parts after tens or hundreds hours of aging at temperatures above 200 C. The activation energy of the retention test failures was 1.05 eV and the extrapolated mean-time-to-failure (MTTF) at room temperature was estimated to be more than 280 years. Multiple write-read cycling (up to 3x10(exp 7)) during the fatigue testing of plastic and ceramic parts did not result in any parametric or functional failures. However, operational currents linearly decreased with the logarithm of number of cycles thus indicating fatigue process in PZT films. Plastic parts, that had more recent date code as compared to ceramic parts, appeared to be using die with improved process technology and showed significantly smaller changes in operational currents and data access times.
Sharma, Ashok K.↗
Landing Energy Dissipation for Manned Reentry Vehicles
Analytical and experimental investigations have been made to determine the landing-energy-dissipation characteristics for several types of landing gear for manned reentry vehicles. The landing vehicles are considered in two categories: those having essentially vertical-descent paths, the parachute-supported vehicles, and those having essentially horizontal paths, the lifting vehicles. The energy-dissipation devices discussed are crushable materials such as foamed plastics and honeycomb for internal application in couch-support systems, yielding metal elements as part of the structure of capsules or as alternates for oleos in landing-gear struts, inflatable bags, braking rockets, and shaped surfaces for water impact. It appears feasible to readily evaluate landing-gear systems for internal or external application in hard-surface or water landings by using computational procedures and free-body landing techniques with dynamic models. The systems investigated have shown very interesting energy-dissipation characteristics over a considerable range of landing parameters. Acceptable gear can be developed along lines similar to those presented if stroke requirements and human-tolerance limits are considered.
Fisher, Lloyd J., Jr.↗
Investigation of the Ignition and Burning of Materials in Space Cabin Atmospheres. Part 1: Ignition and Burning of Material
An analytical study of the theory of ignition and burning of a plastic material immersed in an atmosphere of a space cabin which may be subjected to gravity force changes is considered. The hazardous condition in a space cabin environment where the changes of gravity may effect the combustion process is evaluated. The model considered the analysis of the coupled gas and solid phases and is based on the premise that material heating leads to the formation of pyrolysis gases from the decomposed solid which then react with the ambient oxidizer to further the combustion process. Moreover, free convection plays a dominant role in transporting these hot gases to the virgin material. A time-dependent study of the coupled gas-solid model as required for ignition processes with emphasis on the surface energy interchange of the gas and solid phases has been made. Detailed distribution of species composition and temperature patterns provide a spatial and time map of the evolving gases from the material combustion.
Lew, H. G.↗
AE (Acoustic Emission) for Flip-Chip CGA/FCBGA Defect Detection
C-mode scanning acoustic microscopy (C-SAM) is a nondestructive inspection technique that uses ultrasound to show the internal feature of a specimen. A very high or ultra-high-frequency ultrasound passes through a specimen to produce a visible acoustic microimage (AMI) of its inner features. As ultrasound travels into a specimen, the wave is absorbed, scattered or reflected. The response is highly sensitive to the elastic properties of the materials and is especially sensitive to air gaps. This specific characteristic makes AMI the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. C-SAM analysis, which is a type of AMI, was widely used in the past for evaluation of plastic microelectronic circuits, especially for detecting delamination of direct die bonding. With the introduction of the flip-chip die attachment in a package; its use has been expanded to nondestructive characterization of the flip-chip solder bumps and underfill. Figure 1.1 compares visual and C-SAM inspection approaches for defect detection, especially for solder joint interconnections and hidden defects. C-SAM is specifically useful for package features like internal cracks and delamination. C-SAM not only allows for the visualization of the interior features, it has the ability to produce images on layer-by-layer basis. Visual inspection; however, is only superior to C-SAM for the exposed features including solder dewetting, microcracks, and contamination. Ideally, a combination of various inspection techniques - visual, optical and SEM microscopy, C-SAM, and X-ray - need to be performed in order to assure quality at part, package, and system levels. This reports presents evaluations performed on various advanced packages/assemblies, especially the flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. Both external and internal equipment was used for evaluation. The outside facility provided images of the key features that could be detected using the most advanced C-SAM equipment with a skilled operator. Investigation continued using in-house equipment with its limitations. For comparison, representative X-rays of the assemblies were also gathered to show key defect detection features of these non-destructive techniques. Key images gathered and compared are: Compared the images of 2D X-ray and C-SAM for a plastic LGA assembly showing features that could be detected by either NDE technique. For this specific case, X-ray was a clear winner. Evaluated flip-chip CGA and FCBGA assemblies with and without heat sink by C-SAM. Only the FCCGA package that had no heat sink could be fully analyzed for underfill and bump quality. Cross-sectional microscopy did not revealed peripheral delamination features detected by C-SAM. Analyzed a number of fine pitch PBGA assemblies by C-SAM. Even though the internal features of the package assemblies could be detected, C-SAM was unable to detect solder joint failure at either the package or board level. Twenty times touch ups by solder iron with 700degF tip temperature, each with about 5 second duration, did not induce defects to be detected by C-SAM images. Other techniques need to be considered to induce known defects for characterization. Given NASA's emphasis on the use of microelectronic packages and assemblies and quality assurance on workmanship defect detection, understanding key features of various inspection systems that detect defects in the early stages of package and assembly is critical to developing approaches that will minimize future failures. Additional specific, tailored non-destructive inspection approaches could enable low-risk insertion of these advanced electronic packages having hidden and fine features.
Ghaffarian, Reza↗