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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Photonic Source for Binary Source Simulations

More than half of the sun-like stars are in binary systems or have companions that hinder the search for planets around them using traditional technologies. There are only 69 FGK dwarfs within ten pc that can harbor true earth analogs. Direct imaging can detect and study the habitability of those targets measuring the chemical composition of the atmosphere, and astrometry can measure the planet's mass. We use Multi-Star Wavefront Control (MSWC), a technique that removes stellar leakage from both stellar components to enable direct imaging of binary systems. Currently, there is a technology demonstration experiment of MSWC for the Roman coronagraph instrument at the High Contrast Imaging Testbeds operated at JPL. One of the challenges for this experiment is to produce a binary source where both stars are incoherent with each other at close physical separation. On the other hand, to measure masses, it is possible to obtain relative astrometry measurements between the binary. The TOLIMAN concept proposes to use a diffractive pupil to calibrate the distortion and detector effects to reach 1uas astrometric accuracy. JPL currently has a laboratory to demonstrate this technology, which faces the same challenge as the MSWC project of producing two incoherent nearby sources. We developed Photonic Chips with multiple waveguides in Silicon Nitride for both projects to create incoherent single sources as close as 15um. In this paper, we present the concept application, the chips design, and the first results.

photonic chips↗
NASA NTRS2016

Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects

Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability.

Body of Knowledge (BOK)↗
NASA NTRSDate not supplied

Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE)

The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid- state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.

Anthony W Yu↗
NASA NTRSDate not supplied

Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE)

The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid-state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.

Anthony W Yu↗
NASA NTRSDate not supplied

Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE)

The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid-state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.

Anthony W. Yu↗
NASA NTRS2008

Radiation Testing, Characterization and Qualification Challenges for Modern Microelectronics and Photonics Devices and Technologies

At GOMAC 2007, we discussed a selection of the challenges for radiation testing of modern semiconductor devices focusing on state-of-the-art memory technologies. This included FLASH non-volatile memories (NVMs) and synchronous dynamic random access memories (SDRAMs). In this presentation, we extend this discussion in device packaging and complexity as well as single event upset (SEU) mechanisms using several technology areas as examples including: system-on-a-chip (SOC) devices and photonic or fiber optic systems. The underlying goal is intended to provoke thought for understanding the limitations and interpretation of radiation testing results.

LaBel, Kenneth A.↗
NASA NTRS2010

Digital Microfluidics Sample Analyzer

Three innovations address the needs of the medical world with regard to microfluidic manipulation and testing of physiological samples in ways that can benefit point-of-care needs for patients such as premature infants, for which drawing of blood for continuous tests can be life-threatening in their own right, and for expedited results. A chip with sample injection elements, reservoirs (and waste), droplet formation structures, fluidic pathways, mixing areas, and optical detection sites, was fabricated to test the various components of the microfluidic platform, both individually and in integrated fashion. The droplet control system permits a user to control droplet microactuator system functions, such as droplet operations and detector operations. Also, the programming system allows a user to develop software routines for controlling droplet microactuator system functions, such as droplet operations and detector operations. A chip is incorporated into the system with a controller, a detector, input and output devices, and software. A novel filler fluid formulation is used for the transport of droplets with high protein concentrations. Novel assemblies for detection of photons from an on-chip droplet are present, as well as novel systems for conducting various assays, such as immunoassays and PCR (polymerase chain reaction). The lab-on-a-chip (a.k.a., lab-on-a-printed-circuit board) processes physiological samples and comprises a system for automated, multi-analyte measurements using sub-microliter samples of human serum. The invention also relates to a diagnostic chip and system including the chip that performs many of the routine operations of a central labbased chemistry analyzer, integrating, for example, colorimetric assays (e.g., for proteins), chemiluminescence/fluorescence assays (e.g., for enzymes, electrolytes, and gases), and/or conductometric assays (e.g., for hematocrit on plasma and whole blood) on a single chip platform.

Pollack, Michael G.↗
NASA NTRS2007

Aligning Optical Fibers by Means of Actuated MEMS Wedges

Microelectromechanical systems (MEMS) of a proposed type would be designed and fabricated to effect lateral and vertical alignment of optical fibers with respect to optical, electro-optical, optoelectronic, and/or photonic devices on integrated circuit chips and similar monolithic device structures. A MEMS device of this type would consist of a pair of oppositely sloped alignment wedges attached to linear actuators that would translate the wedges in the plane of a substrate, causing an optical fiber in contact with the sloping wedge surfaces to undergo various displacements parallel and perpendicular to the plane. In making it possible to accurately align optical fibers individually during the packaging stages of fabrication of the affected devices, this MEMS device would also make it possible to relax tolerances in other stages of fabrication, thereby potentially reducing costs and increasing yields. In a typical system according to the proposal (see Figure 1), one or more pair(s) of alignment wedges would be positioned to create a V groove in which an optical fiber would rest. The fiber would be clamped at a suitable distance from the wedges to create a cantilever with a slight bend to push the free end of the fiber gently to the bottom of the V groove. The wedges would be translated in the substrate plane by amounts Dx1 and Dx2, respectively, which would be chosen to move the fiber parallel to the plane by a desired amount Dx and perpendicular to the plane by a desired amount Dy. The actuators used to translate the wedges could be variants of electrostatic or thermal actuators that are common in MEMS.

Morgan, Brian↗
NASA NTRS2007

NASA Tech Briefs, March 2007

Topics include: Advanced Systems for Monitoring Underwater Sounds; Wireless Data-Acquisition System for Testing Rocket Engines; Processing Raw HST Data With Up-to-Date Calibration Data; Mobile Collection and Automated Interpretation of EEG Data; System for Secure Integration of Aviation Data; Servomotor and Controller Having Large Dynamic Range; Digital Multicasting of Multiple Audio Streams; Translator for Optimizing Fluid-Handling Components; AIRSAR Web-Based Data Processing; Pattern Matcher for Trees Constructed From Lists; Reducing a Knowledge-Base Search Space When Data Are Missing; Ground-Based Correction of Remote-Sensing Spectral Imagery; State-Chart Autocoder; Pointing History Engine for the Spitzer Space Telescope; Low-Friction, High-Stiffness Joint for Uniaxial Load Cell; Magnet-Based System for Docking of Miniature Spacecraft; Electromechanically Actuated Valve for Controlling Flow Rate; Plumbing Fixture for a Microfluidic Cartridge; Camera Mount for a Head-Up Display; Core-Cutoff Tool; Recirculation of Laser Power in an Atomic Fountain; Simplified Generation of High-Angular-Momentum Light Beams; Imaging Spectrometer on a Chip; Interferometric Quantum-Nondemolition Single-Photon Detectors; Ring-Down Spectroscopy for Characterizing a CW Raman Laser; Complex Type-II Interband Cascade MQW Photodetectors; Single-Point Access to Data Distributed on Many Processors; Estimating Dust and Water Ice Content of the Martian Atmosphere From THEMIS Data; Computing a Stability Spectrum by Use of the HHT; Theoretical Studies of Routes to Synthesis of Tetrahedral N4; Estimation Filter for Alignment of the Spitzer Space Telescope; Antenna for Measuring Electric Fields Within the Inner Heliosphere; Improved High-Voltage Gas Isolator for Ion Thruster; and Hybrid Mobile Communication Networks for Planetary Exploration.

Source record↗
NASA NTRS2011

Multiple-Event, Single-Photon Counting Imaging Sensor

The single-photon counting imaging sensor is typically an array of silicon Geiger-mode avalanche photodiodes that are monolithically integrated with CMOS (complementary metal oxide semiconductor) readout, signal processing, and addressing circuits located in each pixel and the peripheral area of the chip. The major problem is its single-event method for photon count number registration. A single-event single-photon counting imaging array only allows registration of up to one photon count in each of its pixels during a frame time, i.e., the interval between two successive pixel reset operations. Since the frame time can t be too short, this will lead to very low dynamic range and make the sensor merely useful for very low flux environments. The second problem of the prior technique is a limited fill factor resulting from consumption of chip area by the monolithically integrated CMOS readout in pixels. The resulting low photon collection efficiency will substantially ruin any benefit gained from the very sensitive single-photon counting detection. The single-photon counting imaging sensor developed in this work has a novel multiple-event architecture, which allows each of its pixels to register as more than one million (or more) photon-counting events during a frame time. Because of a consequently boosted dynamic range, the imaging array of the invention is capable of performing single-photon counting under ultra-low light through high-flux environments. On the other hand, since the multiple-event architecture is implemented in a hybrid structure, back-illumination and close-to-unity fill factor can be realized, and maximized quantum efficiency can also be achieved in the detector array.

Zheng, Xinyu↗
NASA NTRS2012

Fiber Bragg Grating Sensor System for Monitoring Smart Composite Aerospace Structures

Lightweight, electromagnetic interference (EMI) immune, fiber-optic, sensor- based structural health monitoring (SHM) will play an increasing role in aerospace structures ranging from aircraft wings to jet engine vanes. Fiber Bragg Grating (FBG) sensors for SHM include advanced signal processing, system and damage identification, and location and quantification algorithms. Potentially, the solution could be developed into an autonomous onboard system to inspect and perform non-destructive evaluation and SHM. A novel method has been developed to massively multiplex FBG sensors, supported by a parallel processing interrogator, which enables high sampling rates combined with highly distributed sensing (up to 96 sensors per system). The interrogation system comprises several subsystems. A broadband optical source subsystem (BOSS) and routing and interface module (RIM) send light from the interrogation system to a composite embedded FBG sensor matrix, which returns measurand-dependent wavelengths back to the interrogation system for measurement with subpicometer resolution. In particular, the returned wavelengths are channeled by the RIM to a photonic signal processing subsystem based on powerful optical chips, then passed through an optoelectronic interface to an analog post-detection electronics subsystem, digital post-detection electronics subsystem, and finally via a data interface to a computer. A range of composite structures has been fabricated with FBGs embedded. Stress tensile, bending, and dynamic strain tests were performed. The experimental work proved that the FBG sensors have a good level of accuracy in measuring the static response of the tested composite coupons (down to submicrostrain levels), the capability to detect and monitor dynamic loads, and the ability to detect defects in composites by a variety of methods including monitoring the decay time under different dynamic loading conditions. In addition to quasi-static and dynamic load monitoring, the system can capture acoustic emission events that can be a prelude to structural failure, as well as piezoactuator-induced ultrasonic Lamb-waves-based techniques as a basis for damage detection.

Moslehi, Behzad↗
NASA NTRS2012

Process for Patterning Indium for Bump Bonding

An innovation was created for the Cosmology Large Angular Scale Surveyor for integration of low-temperature detector chips with a silicon backshort and a silicon photonic choke through flipchip bonding. Indium bumps are typically patterned using liftoff processes, which require thick resist. In some applications, it is necessary to locate the bumps close to high-aspect-ratio structures such as wafer through-holes. In those cases, liftoff processes are challenging, and require complicated and time-consuming spray coating technology if the high-aspect-ratio structures are delineated prior to the indium bump process. Alternatively, processing the indium bumps first is limited by compatibility of the indium with subsequent processing. The present invention allows for locating bumps arbitrarily close to multiple-level high-aspect-ratio structures, and for indium bumps to be formed without liftoff resist. The process uses the poor step coverage of indium deposited on a silicon wafer that has been previously etched to delineate the location of the indium bumps. The silicon pattern can be processed through standard lithography prior to adding the high-aspect-ratio structures. Typically, high-aspectratio structures require a thick resist layer so this layer can easily cover the silicon topography. For multiple levels of topography, the silicon can be easily conformally coated through standard processes. A blanket layer of indium is then deposited onto the full wafer; bump bonding only occurs at the high points of the topography.

Denis, Kevin↗
NASA NTRS1969

An integrated circuit switch

Multi-chip integrated circuit switch consists of a GaAs photon-emitting diode in close proximity with S1 phototransistor. A high current gain is obtained when the transistor has a high forward common-emitter current gain.

Bonin, E. L.↗
NASA NTRS1999

MEMS Using SOI Substrate

At NASA, the focus for smaller, less costly missions has given impetus for the development of microspacecraft. MicroElectroMechanical System (MEMS) technology advances in the area of sensor, propulsion systems, and instruments, make the notion of a specialized microspacecraft feasible in the immediate future. Similar to the micro-electronics revolution,the emerging MEMS technology offers the integration of recent advances in micromachining and nanofabrication techniques with microelectronics in a mass-producible format,is viewed as the next step in device and instrument miniaturization. MEMS technology offers the potential of enabling or enhancing NASA missions in a variety of ways. This new technology allows the miniaturization of components and systems, where the primary benefit is a reduction in size, mass and power. MEMS technology also provides new capabilities and enhanced performance, where the most significant impact is in performance, regardless of system size. Finally,with the availability of mass-produced, miniature MEMS instrumentation comes the opportunity to rethink our fundamental measurement paradigms. It is now possible to expand our horizons from a single instrument perspective to one involving multi-node distributed systems. In the distributed systems and missions, a new system in which the functionality is enabled through a multiplicity of elements. Further in the future, the integration of electronics, photonics, and micromechanical functionalities into "instruments-on-a-chip" will provide the ultimate size, cost, function, and performance advantage. In this presentation, I will discuss recent development, requirement, and applications of various MEMS technologies and devices for space applications.

Tang, Tony K.↗
NASA NTRS1994

Flexible manufacturing for photonics device assembly

The assembly of photonics devices such as laser diodes, optical modulators, and opto-electronics multi-chip modules (OEMCM), usually requires the placement of micron size devices such as laser diodes, and sub-micron precision attachment between optical fibers and diodes or waveguide modulators (usually referred to as pigtailing). This is a very labor intensive process. Studies done by the opto-electronics (OE) industry have shown that 95 percent of the cost of a pigtailed photonic device is due to the use of manual alignment and bonding techniques, which is the current practice in industry. At Lawrence Livermore National Laboratory, we are working to reduce the cost of packaging OE devices through the use of automation. Our efforts are concentrated on several areas that are directly related to an automated process. This paper will focus on our progress in two of those areas, in particular, an automated fiber pigtailing machine and silicon micro-technology compatible with an automated process.

Lu, Shin-Yee↗
NASA NTRS1989

High resolution decoding techniques and single-chip decoders for multi-anode microchannel arrays

While the pixel size in a standard multianode microchannel array (MAMA) photon-counting detector is determined by the spacing of the anode array, the factor most fundamentally limiting pixel resolution is the spacing of the channels in the microchannel plate. Detector resolution can be improved by means of digitization followed by a centroiding procedure. The decoding hardware and the techniques for enhanced pixel resolution are presently discussed with a view to the factors of speed and complexity. A single-chip CMOS gate-array implementation of the decoder is devised and compared with existing multichip decoders' performance.

Kasle, David B.↗
NASA NTRS2023

2023 Astrophotonics Roadmap: Pathways to Realizing Multi-Functional Integrated Astrophotonic Instruments

Photonic technologies offer numerous functionalities that can be used to realize astrophotonic instruments. The most spectacular example to date is the ESO Gravity instrument at the Very Large Telescope in Chile that combines the light-gathering power of four 8 m telescopes through a complex photonic interferometer. Fully integrated astrophotonic devices stand to offer critical advantages for instrument development, including extreme miniaturization when operating at the diffraction-limit, as well as integration, superior thermal and mechanical stabilization owing to the small footprint, and high replicability offering significant cost savings. Numerous astrophotonic technologies have been developed to address shortcomings of conventional instruments to date, including for example the development of photonic lanterns to convert from multimode inputs to single mode outputs, complex aperiodic fiber Bragg gratings to filter OH emission from the atmosphere, complex beam combiners to enable long baseline interferometry with for example, ESO Gravity, and laser frequency combs for high precision spectral calibration of spectrometers. Despite these successes, the facility implementation of photonic solutions in astronomical instrumentation is currently limited because of (1) low throughputs from coupling to fibers, coupling fibers to chips, propagation and bend losses, device losses, etc, (2) difficulties with scaling to large channel count devices needed for large bandwidths and high resolutions, and (3) efficient integration of photonics with detectors, to name a few. In this roadmap, we identify 24 key areas that need further development. We outline the challenges and advances needed across those areas covering design tools, simulation capabilities, fabrication processes, the need for entirely new components, integration and hybridization and the characterization of devices. To realize these advances the astrophotonics community will have to work cooperatively with industrial partners who have more advanced manufacturing capabilities. With the advances described herein, multi-functional integrated instruments will be realized leading to novel observing capabilities for both ground and space based platforms, enabling new scientific studies and discoveries.

astrophotonics↗