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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sources NASA NTRS DOE OSTI

DOE OSTI2021

Design and characterization of microstrip patch antennas for high-T c superconducting terahertz emitters

We designed and characterized a microstrip pattern of planar patch antennas compatible with a cuprate high- T c superconducting terahertz emitter. Antenna parameters were optimized using an electromagnetic simulator. We observed repeatable sub-terahertz emissions from each mesa fabricated on identical Bi 2 Sr 2 CaCu 2 O 8+δ base crystals in a continuous frequency range of 0.35–0.85 THz. Although there was no significant output power enhancement, a plateau behavior at a fixed frequency was observed below 40 K, indicating moderate impedance matching attributable to the ambient microstrip pattern. A remarkably anisotropic polarization at an axial ratio of up to 16.9 indicates a mode-locking effect. Our results enable constructing compactly assembled, monolithic, and broadly tunable superconducting terahertz sources.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

DOE OSTI2021

A Novel Miniaturized MIMO Microstrip Patch Antenna Array with EBG- and Slot-Loading

A compact four-element multiple-input multiple-output (MIMO) antenna array based on the miniaturized mi-crostrip patch is presented. The reduction in array form factor is realized by partially populating the ground plane with elec-tromagnetic band gap (EBG) cells constructed from cross slots, in combination with reactively loading each patch with a slot. The resultant 2 × 2 array system demonstrates excellent inter-element isolation and can be easily fabricated using traditional milling and printing techniques, as it exploits a 2D layout that can be conveniently implemented on two sides of a single-layer substrate, without the need for any via structures. The operation of the array near the 2.5 GHz band is verified with full-wave simulations. The size of the new design is approximately 42% of that employing conventional patch elements.

Liao, DaHan↗

DOE OSTI2025

Passive Wireless Sensors for Realtime Temperature and Corrosion Monitoring of Coal Boiler Components Under Flexible Operation (Final Technical Report)

Researchers at West Virginia University (WVU) propose to demonstrate inexpensive wireless, high-temperature sensors for real-time monitoring of the temperature and corrosion of metal components, which are commonly used in coal-fired boilers. This study presents the development of cost-effective wireless high-temperature sensors for real-time temperature and corrosion monitoring in coal-fired boilers' metal components. The focus is on fabricating and evaluating chipless radio-frequency identification (RFID) sensors capable of operating between 25-1300 ºC. Efforts were directed towards designing passive RFID sensor and interrogator antenna with a broad frequency range, optimizing a microstrip patch antenna sensor integrated into a "peel-and-stick" format for efficient application to various metal specimens without altering their geometry. Additionally, this research aimed to assess the sensor responses under accelerated high-temperature conditions, correlating corrosion and cracking mechanisms with sensor data. An investigation of through-wall data acquisition techniques was also planned, facilitating unobtrusive monitoring of sensor responses housed within metal enclosures. Ultimately, this work sought to establish a robust passive wireless sensor system for the continuous health monitoring of metal components in operational settings, thereby contributing to enhanced safety and efficiency in coal-fired power plants.

20 FOSSIL-FUELED POWER PLANTS↗

DOE OSTI2023

Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

This article presents the antenna-integrated glass interposer for D-band 6G wireless applications using dieembedding technology. Here, we implement the die-embedded package on glass substrates and characterize the electrical performance in the D-band. The electrical characterization employs embedded test dies with the 50-Ω ground–signal–ground (GSG) ports and coplanar waveguides. We achieve low-loss die-to-package transitions by using staggered dielectric vias, which are compared with the transitions of wire-bonding and flip-chip assembly. This article provides detailed information on the design, modeling, fabrication, and characterization of the die-to-package interconnects. This article also demonstrates the integration of microstrip patch antenna array and embedded dies in the D-band. The results show superior electrical performance provided by the die-embedded glass interposer. The die-to-package interconnect exhibits good matching (less than —10-dB S11) and low loss (0.2-dB loss) in the D-band. The integrated 1 × 8 patch antenna array shows 11.6-dB broadside gain and good matching with the embedded die. In addition, by using a temporary carrier, the antenna-integrated glass interposer also has great potential for further heterogeneous integration and thermal management.

42 ENGINEERING↗