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At least 19 records

Joining of materials with engineered interlayers

A reliable method to join a variety of different materials is developed which uses engineered coatings to produce strong bonds by solid-state techniques at low temperatures (300-400 C). The strong bonds are capable of accommodating the strains created between Si and most substrates due to differences in thermal expansion coefficients. The approach encompasses two phases: noble metal compliant interlayers and functionally gradient interlayer bonding. Preliminary results are presented and the Ag interlayer bonds are microstructurally characterized confirming that the planar magnetron sputtered coatings/bonds are fully dense and metallurgically sound.

Challenger, Kenneth D.

Thermal-stress-free fasteners for joining orthotropic materials

Hot structures fabricated from orthotropic materials are an attractive design option for future high speed vehicles. Joining subassemblies of these materials with standard cylindrical fasteners can lead to loose joints or highly stressed joints due to thermal stress. A method has been developed to eliminate thermal stresses and maintain a tight joint by shaping the fastener and mating hole. This method allows both materials (fastener and structure), with different coefficients of thermal expansion (CTEs) in each of the three material directions, to expand freely with temperature yet remain in contact. For the assumptions made in the analysis, the joint will remain snug, yet free of thermal stress at any temperature. Finite element analysis was used to verify several thermal-stress-free fasteners and to show that conical fasteners, which are thermal-stress-free for isotropic materials, can reduce thermal stresses for transversely isotropic materials compared to a cylindrical fastener. Equations for thermal-stress-free shapes are presented and typical fastener shapes are shown.

Blosser, M. L.

Thermal-stress-free fasteners for joining orthotropic materials

Hot structures fabricated from orthotropic materials are an attractive design option for future high speed vehicles. Joining subassemblies of these materials with standard cylindrical fasteners can lead to loose joints or highly stressed joints due to thermal stress. A method has been developed to eliminate thermal stress and maintain a tight joint by shaping the fastener and mating hole. This method allows both materials (fastener and structure), with different coefficients of thermal expansion (CTE's) in each of the three principal material directions, to expand freely with temperature yet remain in contact. For the assumptions made in the analysis, the joint will remain snug, yet free of thermal stress at any temperature. Finite element analysis was used to verify several thermal-stress-free fasteners and to show that conical fasteners, which are thermal-stress-free for isotropic materials, can reduce thermal stresses for transversely isotropic materials compared to a cylindrical fastener. Equations for thermal-stress-free shapes are presented and typical fastener shapes are shown.

Blosser, Max L.

Lack of Penetration in Friction Stir Welds: Effects on Mechanical Properties and NDE Feasibility

This presentation reviews the issue of lack of penetration (LOP) in Friction Stir Welding and the feasibility of using non-destructive tests to detect . Friction Stir Welding takes place in the solid phase below the melting point of the materials to be joined. It thus gives the ability to join materials which are difficult to fusion weld, for example 2000 and 7000 aluminium alloys. This process though can result in a lack of penetration, due to an incomplete penetration of the DXZ. This is frequently referred to as a "kissing bond", which requires micro examination to detect. The presentation then discusses the surface crack tension tests. It then reviews the simulated service test and results. It then discusses the feasibility of using non-destructive examination to detect LOP, the forms of test which can be used, and the results the tests.

Kinchen, David G.

Reusable captive blind fastener

A one piece reusable fastener capable of joining materials together from one side (blind backside) comprises a screw driven pin ending in a wedge-shaped expander cone. The cone cooperates within a slotted collar end which has a number of tangs on a cylindrical body. The fastener is set by inserting it through aligned holes in the workpieces to be joined. Turning the pin in one direction draws the cone into the collar, deforming the tangs radially outward to mate with tapered back-tapered hold in the workpiece, thus fastening the two pieces together. Reversing the direction of the pin withdraws the cone from the collar, and allows the tangs to resume their contracted configuration without withdrawing the fastener from the insertion hole. The fastener is capable of joining materials together from only one side with substantial strength in tension and shear over many resue attachment cycles, with no special operations on the main assembly parts other than the tapering of the back end of the insertion hole.

Peterson, S. A.

Plasma-assisted microwave processing of materials

A microwave plasma assisted method and system for heating and joining materials. The invention uses a microwave induced plasma to controllably preheat workpiece materials that are poorly microwave absorbing. The plasma preheats the workpiece to a temperature that improves the materials' ability to absorb microwave energy. The plasma is extinguished and microwave energy is able to volumetrically heat the workpiece. Localized heating of good microwave absorbing materials is done by shielding certain parts of the workpiece and igniting the plasma in the areas not shielded. Microwave induced plasma is also used to induce self-propagating high temperature synthesis (SHS) process for the joining of materials. Preferably, a microwave induced plasma preheats the material and then microwave energy ignites the center of the material, thereby causing a high temperature spherical wave front from the center outward.

Barmatz, Martin

Derivation and test of elevated temperature thermal-stress-free fastener concept

Future aerospace vehicles must withstand high temperatures and be able to function over a wide temperature range. New composite materials are being developed for use in designing high-temperature lightweight structures. Due to the difference between coefficients of thermal expansion for the new composite materials and conventional high-temperature metallic fasteners, innovative joining techniques are needed to produce tight joints at all temperatures without excessive thermal stresses. A thermal-stress-free fastening technique is presented that can be used to provide structurally tight joints at all temperatures even when the fastener and joined materials have different coefficients of thermal expansion. The derivation of thermal-stress-free fasteners and joint shapes is presented for a wide variety of fastener materials and materials being joined together. Approximations to the thermal-stress-free shapes that result in joints with low-thermal-stresses and that simplify the fastener/joint shape are discussed. The low-thermal-stress fastener concept is verified by thermal and shear tests in joints using oxide-dispersion-strengthened alloy fasteners in carbon-carbon material. The test results show no evidence of thermal stress damage for temperatures up to 2000 F and the resulting joints carried shear loads at room temperature typical of those for conventional joints.

Sawyer, J. W.

High-Flow Asymmetric Reverse-Osmosis Membranes

Water-soluble polymer membrane insolubilized by transition-metal salt. Thin layer of lower permeability material joined with thicker layer of highpermeability material. Two layers chemically identical or chemically distinct. They differ in density, compactness or other respects. Used to purify or desalinate seawater, brackish water, or industrial or domestic wastewater.

Katz, M. C.

Intern Designed Modules for Conducting Potential Microgravity Solidification Experiments Aboard the International Space Station

MMaJIC (Microgravity Materials Joining Investigation Chamber) is a modular experiment chamber for performing materials science investigations. MMaJIC was initially designed to provide a controlled and sealed test environment to accommodate a wide variety of soldering and brazing experiments. However, its modular cartridge design is well suited to easily conduct any number and variety of science experiments. SoLIDD (Solid Liquid Interface Directional Device) is an apparatus for conducting directional solidification experiments with low melting temperature alloys. It has capability for varying the sample’s temperature gradient and growth velocity thus ensuring microstructural development under controlled conditions. ICED-T (Interface Control Experiment with Directional Translation) is an apparatus that conducts directional solidification experiments of transparent materials such that direct observation/recording of the advancing solid/liquid interface can be made. Currently, it is a functional breadboard that consists of the components mounted to a surface that allows the sample to be placed in an upright position. Orientation of the experiment (solid on the bottom, liquid on top) is important during testing ground samples to maintain stability. Ultimately, the goal of MMaJIC, SoLIDD and ICED-T is to conduct successful ground tests and then be re-configured for eventual use by aboard the ISS.

McElderry, Justin

Development and Characterization of the Bonding and Integration Technologies Needed for Fabricating Silicon Carbide Based Injector Components

Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding technology, titanium interlayers (coatings and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness, and processing time were investigated. Electron microprobe analysis was used to identify the reaction formed phases. In the diffusion bonds, an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner interlayers of pure titanium and/or longer processing times resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Nondestructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

Halbig,Michael C.

Bonding and Integration Technologies for Silicon Carbide Based Injector Components

Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding, titanium interlayers (PVD and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness (10, 20, and 50 microns), processing time and temperature, and cooling rates were investigated. Microprobe analysis was used to identify the phases in the bonded region. For bonds that were not fully reacted an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner titanium interlayers and/or longer processing times resulted in stable and compatible phases that did not contribute to microcracking and resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Non-destructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

Halbig, Michael C.

Preliminary SP-100/Stirling heat exchanger designs

Analytic modeling of several heat exchanger concepts to couple the SP-100 nuclear reactor primary lithium loop and the Space Stirling Power Convertor (SSPC) was performed. Four 25 kWe SSPC's are used to produce the required 100 kW of electrical power. This design work focused on the interface between a single SSPC and the primary lithium loop. Manifolding to separate and collect the four channel flow was not modeled. This work modeled two separate types of heat exchanger interfaces (conductive coupling and radiative coupling) to explore their relative advantages and disadvantages. The minimum mass design of the conductively coupled concepts was 18 kg or 0.73 kg/kWe for a single 25 kWe convertor. The minimum mass radiatively coupled concept was 41 kg or 1.64 kg/kWe. The direct conduction heat exchanger provides a lighter weight system because of its ability to operate the Stirling convertor evaporator at higher heat fluxes than those attainable by the radiatively coupled systems. Additionally the conductively coupled concepts had relatively small volumes and provide potentially simpler assembly. Their disadvantages were the tight tolerances and material joining problems associated with this refractory to superalloy interface. The advantages of the radiatively coupled designs were the minimal material interface problems.

Schmitz, Paul