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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗

NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗

NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Kessel, Kurt↗

NASA NTRS2003

Integrated Electrode Arrays for Neuro-Prosthetic Implants

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

Brandon, Erik↗

NASA NTRS2011

NASA TEERM Hexavalent Chrome Alternatives Projects

The overall objective of the Hex Chrome Free Coatings for Electronics project is to evaluate and test pretreatment coating systems not containing hexavalent chrome in avionics and electronics housing applications. This objective will be accomplished by testing strong performing coating systems from prior NASA and DoD testing or new coating systems as determined by the stakeholders. The technical stakeholders have agreed that this protocol will focus specifically on Class 3 coatings. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or circuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reliability

Kessel, Kurt R.↗

NASA NTRS2011

NASA-DoD Lead-Free Electronics Project

Original Equipment Manufacturers (OEMs). depots. and support contractors have to be prepared to deal with an electronics supply chain thaI increasingly provides parts with lead-free finishes. some labeled no differently and intenningled with their SnPb counterparts. Allowance oflead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free lenninations, tennination finishes, or circuit boards presents a host of concerns to customers. suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers; 2. Incompatibility oflead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system; and 3. Unknown material properties and incompatibilities that could reduce solder joint re liability.

Kessel, Kurt↗

NASA NTRS2003

Lead-free solders: issues of toxicity, availability and impacts of extraction

This project set out to evaluate the critical issues of toxicity and public health effects, material availability, and the environmental impacts of raw material extraction and metal finishing, with the goal of using environmental impact as a factor in selecting feasible lead-free alloys.

toxicity lead-free solder packaging↗

NASA NTRS2012

Lead-Free Experiment in a Space Environment

This Technical Memorandum addresses the Lead-Free Technology Experiment in Space Environment that flew as part of the seventh Materials International Space Station Experiment outside the International Space Station for approximately 18 months. Its intent was to provide data on the performance of lead-free electronics in an actual space environment. Its postflight condition is compared to the preflight condition as well as to the condition of an identical package operating in parallel in the laboratory. Some tin whisker growth was seen on a flight board but the whiskers were few and short. There were no solder joint failures, no tin pest formation, and no significant intermetallic compound formation or growth on either the flight or ground units.

Blanche, J. F.↗

NASA NTRS2010

NASA-DoD Lead-Free Electronics Project

Original Equipment Manufacturers (OEMs), depots, and support contract ors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the r eliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or cir cuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-f ree processes and parameters (including higher melting points of lead -free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reli ability As the transition to lead-free becomes a certain reality for military and aerospace applications, it will be critical to fully un derstand the implications of reworking lead-free assemblies.

Kessel, Kurt↗

NASA NTRS2010

QuEST: Qualifying Environmentally Sustainable Technologies, Volume 5

This edition of the QuEST newsletter contains brief articles that discuss the NASA Technology Evaluation for Environmental Risk Mitigation (TEERM) program, and the importance of collaboration, efforts in materials management and substitution for coatings for launch structures, Low volatile organic compound (VOC) Coatings Field Testing, Non-Chrome Coating Systems, Life Cycle Corrosion Testing, Lead-Free Electronics Testing and Corn Based Depainting and efforts in Pollution Control in the area of Hypergolic Propellant Destruction Evaluation, efforts in development of alternative energy in particular Hydrogen Sensors, Energy and Water Management, and efforts in remediation in the removal of Polychlorinated Biphenyl (PCB) contamination

Lewis, Pattie↗

NASA NTRS2010

Environmental Regulations as Drivers of Materials Obsolescence

This slide presentation reviews the operations of the Principal Center for Regulatory Risk Analysis and Communication (RRAC-PC) and the impact of environmental regulations in making some materials obsolete. The center is NASA's resource for identifying and managing risks associated with changing environmental regulations. To this end the center acts as an regulatory early warning system, to review track and analyze emerging regulations, collaborate with the technical community on regulatory risk analysis and interpretation and to represent NASA's interests to the regulatory agencies. Regulations frequently result in making some materials unavailable forcing a change to another material. Processes may also be changed due to environmental regulations. For example some items that were sprayed with a chemical may now have to be painted or dipped with the chemical. Sometimes a regulation changes the use of a certain product, which does not affect the usage on Earth, but has significant implications in space. An example of this is the use of lead-free solders of basically tin, which don't appear to have any problem on Earth, but in space applications tin whiskers have resulted in several confirmed satellite failures.

Scroggins, Sharon↗

NASA NTRS2000

Lead-Free Propellant for Propellant Actuated Devices

Naval Surface Warfare Center, Indian Head Division's CAD/PAD Department has been working to remove toxic compounds from our products for about a decade. In 1992, we embarked on an effort to develop a lead-free double base propellant to replace that of a foreign sole source. At the time there were availability concerns. In 1995, the department developed a strategic proposal to include a wider range of products. Efforts included such efforts as removing lead sheathing from linear explosives and replacing lead azide and lead styphnate compounds. This paper will discuss efforts specifically related to developing non-leaded double base propellant for use in various Propellant Actuated Devices (PADs) for aircrew escape systems. The propellants can replace their leaded counterparts, mitigating lead handling, processing, or toxic exposure to the environment and personnel. This work eliminates the use of leaded compounds, replacing them with a more environmentally benign metal-organic salt. Historically double-base propellants have held an advantage over other families of energetic materials through their relative insensitivity of the burning rate to changes in temperature and pressure. This desirable ballistic effect has been obtained with the use of a lead-organic salt alone or in a physical mixture with a copper-organic salt, or more recently with a lead-copper complex. These ballistic modifiers are typically added to the double-base 'paste' prior to gelatinization on heated calendars or one type or another. The effect of constant burning rate over a pressure range is called a 'plateau' while an even more beneficial effect of decreasing burning rate with increasing pressure is termed a 'mesa.' The latter effect results in very low temperature sensitivity of the propellant burning rate. Propellants with such effects are ideal tactical rocket motor propellants. The use of lead compounds poses a concern for the environment and personnel safety due to the metal's toxic nature when introduced into the atmosphere by propellant manufacturing, rocket firings, and disposal. Two separate programs are underway at Indian Head to replace the leaded ballistic modifiers in NOSIH-AA-2 and KU propellants. Although the system requirements were very different, the programs gained valuable information from one another throughout their course.

Goodwin, John L.↗

NASA NTRS2011

QuEST: Qualifying Environmentally Sustainable Technologies

QuEST is a publication of the NASA Technology Evaluation for Environmental Risk Mitigation Principal Center (TEERM). This issue contains brief articles on: Risk Identification and Mitigation, Material Management and Substitution Efforts--Hexavalent Chrome-free Coatings and Low volatile organic compounds (VOCs) Coatings, Lead-Free Electronics, Corn-Based Depainting Media; Alternative Energy Efforts Hydrogen Sensors and Solar Air Conditioning. Other TEERM Efforts include: Energy and Water Management and Remediation Technology Collaboration.

Lewis, Pattie↗

NASA NTRS2011

Reliability of Solder Materials (Sn-Pb and Pb-Free) for Deep Space Missions

The purpose of this study is to assess the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead (Sn-Pb) and lead-free (Pb-Free) solder alloys under extreme temperature deep space environments.

extreme temperatures↗