Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “interface resistance”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2009

Integrity of the Plasma Magnetic Nozzle

This report examines the physics governing certain aspects of plasma propellant flow through a magnetic nozzle, specifically the integrity of the interface between the plasma and the nozzle s magnetic field. The injection of 100s of eV plasma into a magnetic flux nozzle that converts thermal energy into directed thrust is fundamental to enabling 10 000s of seconds specific impulse and 10s of kW/kg specific power piloted interplanetary propulsion. An expression for the initial thickness of the interface is derived and found to be approx.10(exp -2) m. An algorithm is reviewed and applied to compare classical resistivity to gradient-driven microturbulent (anomalous) resistivity, in terms of the spatial rate and time integral of resistive interface broadening, which can then be related to the geometry of the nozzle. An algorithm characterizing plasma temperature, density, and velocity dependencies is derived and found to be comparable to classical resistivity at local plasma temperatures of approx. 200 eV. Macroscopic flute-mode instabilities in regions of "adverse magnetic curvature" are discussed; a growth rate formula is derived and found to be one to two e-foldings of the most unstable Rayleigh-Taylor (RT) mode. After establishing the necessity of incorporating the Hall effect into Ohm s law (allowing full Hall current to flow and concomitant plasma rotation), a critical nozzle length expression is derived in which the interface thickness is limited to about 1 ion gyroradius.

Gerwin, Richard A.↗
NASA NTRS1981

Study program for encapsulation materials interface for low-cost solar array

The service integrity of the bonded interface in solar cell modules used in solar arrays is addressed. The development of AC impedance as a nondestructive evaluation (NDE) methodology for solar arrays is reported along with development of corrosion models and materials selection criteria for corrosion resistant interfaces.

Kaelble, D. H.↗
NASA NTRS1993

The roles of fluid motion and other transport phenomena in the morphology of materials

Two crystallization problems were studied: the growth of protein crystals, in particular the influence of colloidal forces and convection, and the influence of interface resistance on the growth of dendritic crystals. The protein study involved both experimental and theoretical work; the work of dendrites was entirely theoretical. In the study of protein crystallization, experiments were carried out where crystals were grown in the presence and absence of natural convection. No evidence was found that convection retards crystal growth. The theoretical study focused on the influence of colloidal forces (electrostatic and London-van der Waals) on the interaction between a protein molecule and a flat crystal surface. It was shown that the interaction is extremely sensitive to colloidal forces and that electrostatic interactions play a strong role in deciding whether or not a molecule will find a favorable site for adsorption. In the study of dendritic growth, the role of an interfacial resistance on the selection processes was examined. Using a computational scheme, it was found that the selected velocity is strongly dependent on the magnitude of the interfacial resistance to heat transfer. This is a possible explanation for discrepancies between the theoretical and experimental results on succinonitrile.

Saville, D. A.↗
NASA NTRS2026

Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials

Thermal Interface Materials (TIMs) are critical components in spacecraft thermal management systems, where thermal performance is strongly influenced by vacuum conditions, interface contact resistance, and layered metallic joint behavior. However, manufacturer-reported thermal conductivity values are often derived under idealized conditions and may not accurately represent performance within operational aerospace applications. To address this limitation, the Testbed for Advanced Interface Materials in Vacuum (TAIMV) was developed as a modular vacuum-compatible thermal conductivity characterization platform capable of evaluating aerospace-relevant TIM configurations under both ambient and high-vacuum environments. The testbed was derived from the ASTM C1044-16 guarded hot plate methodology and incorporates interchangeable layers of stainless steel coupon geometries, independently controlled main and guard heaters, embedded resistance temperature detectors (RTDs), thermocouples, multi-layer insulation (MLI), and a temperature-controlled cold plate to characterize through-thickness thermal gradients across layered interfaces. In the current configuration, interface compression is limited to the nominal contact pressure generated by the experimental stack assembly. Initial experimental campaigns were conducted at ambient pressure and below 1×10-5 torr for vacuum cases using multiple interface materials including Braycote 601EF and Krytox-based greases across a range of thermal operating conditions. In parallel, a coupled numerical Python thermal model was developed to predict temperature distribution throughout the stack while accounting for conduction, radiation, and parasitic heat transfer pathways and effective interface resistance effects. Experimental measurements and numerical predictions showed consistent thermal trends across multiple operating conditions and environmental states. Results also revealed measurable differences between ambient and vacuum thermal behavior, demonstrating the importance of interface resistance, parasitic heat transfer mechanisms, and stack geometry in determining effective thermal performance within layered thermal interfaces. The presented work establishes a foundation for future thermal model correlation efforts and expanded characterization of aerospace thermal interface materials under representative environmental conditions. Future work will focus on the integration of a load cell system to enable controlled pressure-dependent characterization of thermal interface materials under compressive loading. This capability will allow investigation of the influence of contact pressure on effective thermal conductivity, interface resistance, and thermal performance within layered aerospace thermal interfaces under representative operational conditions.

Thermal Development Testing↗
NASA NTRS2014

Microstructure and Oxidation of a MAX Phase/Superalloy Hybrid Interface

Corrosion resistant, strain tolerant MAX phase coatings are of interest for turbine applications. Thin Cr2AlC MAX phase wafers were vacuum diffusion bonded to an advanced turbine disk alloy, LSHR, at 1100 C. The interface, examined by optical and scanning electron microscopy, revealed a primary diffusion zone consisting of ~ 10 micrometers of beta-Ni(Co)Al, decorated with various NiCoCrAl, MC and M3B2 precipitates. On the Cr2AlC side, an additional ~40 micrometers Al-depletion zone of Cr7C3 formed in an interconnected network with the beta-Ni(Co)Al. Oxidation of an exposed edge at 800 C for 100 h produced a fine-grained lenticular alumina scale over Cr2AlC and beta-Ni(Co)Al, with coarser chromia granules over the Cr7C3 regions. Subsequent growth of the diffusion layers was only ~ 5 micrometers in total. A residual stress of ~ 500 MPa was estimated for the MAX phase layer, but no interfacial damage was observed. Subsequent tests for 1000 h reveal similar results.

heat resistant alloys↗
NASA NTRS2004

Multilayer Fiber Interfaces for Improved Environmental Resistance and Slip in Carbon Fiber Reinforced Composites

Ultraviolet-enhanced chemical vapor deposition (UVCVD) has been developed to lower the required substrate temperature thereby allowing for the application of metal oxide-based coatings to carbon and ceramic fibers without causing significant fiber damage. An effort to expand this capability to other ceramic phases chosen to maximize oxidation protection in the likely event of matrix cracking and minimize possible reaction between the coating and fiber during long-term high temperature use will be presented along with studies aimed at the demonstration of these and other benefits for the next-generation interface coating systems being developed herein.

Babcock, Jason R.↗
NASA NTRS2016

Evaluation of a Conductive Elastomer Seal for Spacecraft

An electrically conductive elastomer was evaluated as a material candidate for a spacecraft seal. The elastomer used electrically conductive constituents as a means to reduce the resistance between mating interfaces of a sealed joint to meet spacecraft electrical bonding requirements. The compound's outgassing levels were compared against published NASA requirements. The compound was formed into a hollow O-ring seal and its compression set was measured. The O-ring seal was placed into an interface and the electrical resistance and leak rate were quantified. The amount of force required to fully compress the test article in the sealing interface and the force needed to separate the joint were also measured. The outgassing and resistance measurements were below the maximum allowable levels. The room temperature compression set and leak rates were fairly high when compared against other typical spacecraft seal materials, but were not excessive. The compression and adhesion forces were desirably low. Overall, the performance of the elastomer compound was sufficient to be considered for future spacecraft seal applications.

elastomer↗
NASA NTRS2016

Evaluation of a Conductive Elastomer Seal for Spacecraft

An electrically conductive elastomer was evaluated as a material candidate for a spacecraft seal. The elastomer used electrically conductive constituents as a means to reduce the resistance between mating interfaces of a sealed joint to meet spacecraft electrical bonding requirements. The compound's outgassing levels were compared against published NASA requirements. The compound was formed into a hollow O-ring seal and its compression set was measured. The O-ring seal was placed into an interface and the electrical resistance and leak rate were quantified. The amount of force required to fully compress the test article in the sealing interface and the force needed to separate the joint were also measured. The outgassing and resistance measurements were below the maximum allowable levels. The room temperature compression set and leak rates were fairly high when compared against other typical spacecraft seal materials, but were not excessive. The compression and adhesion forces were desirably low. Overall, the performance of the elastomer compound was sufficient to be considered for future spacecraft seal applications.

Daniels, Christopher C.↗
NASA NTRS1973

Thermal contact resistance in a non-ideal joint

Analysis has been conducted to determine thermal contact resistance at interface of two heat conductors and effect of roughness of mating surfaces on pressure distribution. Investigation reveals how heat transfer resistance may be decreased or increased by changing surface properties of particular interface being considered.

Roca, R. T.↗
NASA NTRS1991

The Influence of Interstitial Ga and Interfacial Au (sub 2)P (sub 3) on the Electrical and Metallurgical Behavior of Au-Contacted III-V Semiconductors

The introduction of a very small amount of Ga into Au contact metallization on InP is shown to have a significant effect on both the metallurgical and electrical behavior of that contact system. Ga atoms in the interstices of the Au lattice are shown to be effective in preventing the solid state reactions that normally take place between Au and InP during contact sintering. In addition to suppressing the metallurgical interaction, the presence of small amounts of Ga is shown to cause an order of magnitude reduction in the specific contact resistivity. Evidence is presented that the reactions of GaP and GaAs with Au contacts are also drastically affected by the presence of Ga. The sintering behavior of the Au-GaP and the Au-GaAs systems (as contrasted with that of the Au-InP system) is explained as due to the presence of interstitial Ga in the contact metallization. Finally the large, two-to-three order of magnitude drop in the contact resistance that occurs in the Au-InP system upon sintering at 400 degrees Centigrade is shown to be a result of the formation of an Au (sub 2) P (sub 3) layer at the metal-semiconductor interface. Contact resistivities in the 10 (sup -6) ohm square centimeter range are obtained for as-deposited Au on InP when a thin (20 Angstrom) layer of Au (sub 2) P (sub 3) is introduced between the InP and the Au contacts.

Weizer, Victor G.↗
NASA NTRS1973

Silicon switching transistor with high power and low saturation voltage

Assembly of two individually encapsulated silicon-chip transistors produces silicon power-transistor that has low electrical resistance and low thermal impedance. Electrical resistance and thermal impedance are low because of short lead lengths, and external contact surfaces are plated to reduce resistance at interfaces.

Stonebraker, E.↗