Reliable Bonding of Composite Laminates Using Reflowable Epoxy Resins
Epoxy matrix composites assembled with adhesives maximize the performance of aerospace structures, but the possibility of forming weak bonds requires the installation of redundant fasteners, which add weight and manufacturing cost. Co-cured joints (e.g. unitized composite structures) are immune to weak bonds because the uncured resin undergoes diffusion and mixing through the joint. A means of co-curing complex structures may reduce the need for redundant fasteners in bondlines. To this end, NASA started the AERoBOND project to develop novel joining materials to enable a “secondary-co-cure” assembly process. Aerospace epoxy resin systems reformulated with offset stoichiometry prevented the resin from advancing beyond the gel point during a conventional autoclave cure cycle up to 180 °C. The offset resins were applied to the joining surfaces of laminate preforms as prepreg. Two surfaces with complimentary offset resins were joined using conventional secondary bonding techniques. Preliminary efforts have indicated that the resulting joint has no discernable interface and appears as a conventional co-cured laminate under optical magnification. This report will discuss the initial work performed regarding formulation of the epoxy resin system using calorimetry, rheology, and mechanical testing.