Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “encapsulation and manufacturing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Uniform Mechanical Loading Can Test for Nonuniform Loading Durability

In this work, we present a method to evaluate the equivalency between any module mechanical loading conditions. The method is developed to address the specific failure mode of glass fracture and is based on Weibull analysis and weakest link theory. It considers the varying stress profile across the module to calculate the probability of glass fracture, which is used as the metric of equivalency. An idealized nonuniform loading scheme is employed to demonstrate the method and introduce the concept of the equivalent uniform load factor: a factor applied to the maximum pressure of the nonuniform load to obtain the equivalent uniform load value. It is demonstrated that this factor is less than unity for all nonuniform load cases considered, including snow and various characters of wind loading. These significant results suggest that uniform loading may be reliably, and practically, employed to evaluate photovoltaic module glass for nonuniform loading durability.

14 SOLAR ENERGY↗
DOE OSTI2026

Surface Stress Characterization and Trends in Thermally Strengthened Photovoltaic Module Glass

Simultaneous changes in photovoltaic (PV) module architecture-such as increased area, replacing the polymeric backsheet with a glass backsheet, and reducing glass thickness from 3.2 to 2.0 mm-have resulted in a novel failure called spontaneous glass breakage. Spontaneous glass breakage results in front and/or rear glass failure without any obvious cause. The resulting low-energy fracture patterns have raised concerns about the thermal strengthening in 2.0-mm glass. We present validation of a nondestructive method for measuring the glass surface stress in PV modules. We use a scattered light polariscope to examine the glass properties of 11 modules from 6 solar fields, with and without spontaneous glass breakage. Based on a Mann-Whitney test p-value of 1.4 x 10-6, we conclude that there is a correlation between lower surface stress and susceptibility to spontaneous breakage. A Kendall's Tau test p-value of 2.0 x 10-4 indicates a correlation between increased module area and lower surface stress. We find that 2.0-mm glass can be, and often is, fully tempered (surface stress ≥69 MPa), but inspecting the fracture pattern is not a reliable way to assess the amount of thermal strengthening. A combination of factors, not just surface stress, influences glass breakage.

14 SOLAR ENERGY↗
DOE OSTI2026

Review on Perovskite Solar Cells: From Single‐Junction Devices to Tandem Deployment in Space

Perovskite solar cells (PSCs) have emerged as a transformative photovoltaic technology, offering high power conversion efficiency (PCE) and the potential for cost-effective manufacturing. However, stability and large-scale manufacturing remain critical challenges that must be addressed for widespread adoption. This review provides a roadmap from single-junction perovskite solar cells to tandem deployment in space. First, material-level innovations are discussed, including mixed-cation and low-dimensional perovskites, transport materials, and additives that improve thermal and structural stability while enhancing efficiency. Then, we examine both established industrial standards and emerging scientific protocols aimed at stabilizing PSCs under operational conditions, including tandem cell integration strategies and encapsulation techniques to mitigate performance degradation. Manufacturing scalability is a focal point, where deposition methods and green solvents are explored to improve large-area film uniformity and reduce environmental impact. Additionally, the increasing viability of PSCs in extraterrestrial environments is assessed, with emphasis on their performance in space applications, radiation resistance, and flexible lamination methods for deployment in extreme conditions. Progress across materials innovation, device architectures, stability testing protocols, and both terrestrial and extraterrestrial applications collectively drives perovskite photovoltaics toward higher efficiency, stability, and cost-effectiveness.

flexible PSCs↗
DOE OSTI2025

What Is a Polyolefin? A Critical Overview of Ethylene Copolymers Used as Solar Photovoltaic Module Encapsulants

In recent years, photovoltaic (PV) encapsulant films marketed as polyolefins (POs), more specifically as PO elastomers (POEs) and thermoplastic POs (TPOs), have gained significant market share and are projected to become the dominant encapsulation films by 2030. Relative to other industries, there are significant misconceptions about the term PO in the PV industry. Both in the scientific literature as well as in sales and advertising, the terms PO, POE, and TPO are often misused to describe the same type of material with comparable properties, while in reality these may each consist of separate material classes. This paper provides a comprehensive literature and market review, to showcase a broad range of PO and other ethylene copolymer encapsulants from recent studies, and discusses the materials' properties to clarify what constitutes a “polyolefin.” In addition, to promote a clearer comparison of encapsulant properties, we propose a two‐dimensional taxonomy to categorize polymers used in module manufacturing, including POs. In terms of improving the reliability of solar PV modules, PO‐based encapsulants have several advantages (including lower water uptake and ion diffusion), but might come with disadvantages too, such as a more complex processing and a higher sensitivity to the storage conditions and shelf life. All this might prospectively impact adhesion properties of the encapsulant to other materials' interfaces (glass, cells etc.) and end‐product quality. Because the track record of field‐deployed PV modules containing PO encapsulants is also limited, we hope to contribute to better material understanding and precision in communication in PV to secure quality.

14 SOLAR ENERGY↗
DOE OSTI2024

Manufacturing of Continuous Core–Shell Hydrated Salt Fibers for Room Temperature Thermal Energy Storage

The encapsulation of salt hydrate phase change materials (PCMs) in uniform microscale bodies has yet been reported in research due in part to the delicate relationship between thermal performance and water-to-salt ratios which are easily altered during manufacturing. Herein, core–shell composite fibers comprised of a salt hydrate PCM core and a poly(acrylonitrile) (PAN) shell are wet spun in a continuous process using a syringe pump and coaxial die. The PCM phase comprises calcium chloride hexahydrate (CaCl 2 ·6H 2 O) with strontium chloride hexahydrate(SrCl 2 ·6H 2 O) (3 wt%) and fumed silica(SiO 2 ) (2 wt%) as additive, a composition that is prepared from homogenous melt at 40 °C. 15 wt% PAN in dimethylsulfoxide solvent is used to prepare the shell-forming polymer gel. PCM and polymer gel injection rates of 10–40 mL h –1 are used to spin coaxial fibers through a coagulation bath, yielding continuous microtubules with diameters in the range of 850–1500 μm. Cyclic testing shows that after 1000 cycles, melting enthalpies incurred only a 3.5% decline from 131.46 to 126.9 J g –1 . In conclusion, success here overcomes several coincidental drawbacks of PCM fiber performance and manufacturing and delivers the first example of scalable roll-to-roll PCM fiber produced by wet spinning for building material applications.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Encapsulation Materials Tailored to Perovskite Photovoltaics

The work combines NREL as the world leader in perovskite and polymeric materials, and teams them up with The Dow Chemical Company, the world leader in commercial production of PV encapsulation materials. The team will design and evaluate encapsulation materials that are tailored to perovskite photovoltaics. Demonstration of polyolefin-based encapsulants for perovskite PV will be impactful for a number of reasons: 1) There is no clear-cut choice for encapsulation for perovskite PV to date. 2) There is high synthetic control of the material properties for future perovskite module designs. 3) Among the candidate materials, they have the highest barrier properties, 4) Polyolefins are the most prevalent (>20 million metric tons consumed in the US alone) and inexpensive (<1.5 $USD/kg) polymers used worldwide. 5) They are recyclable and may play a role in future of circular PV materials. 6) They are manufactured domestically. The work also highlights careful design of perovskite transport layer materials for surviving vacuum encapsulation.

14 SOLAR ENERGY↗
DOE OSTI2024

Developments for Novel Module Architecture for Lower CapEx and Improved Recyclability for c-Si PV Modules

Photovoltaic (PV) energy production is currently increasing at a significant rate. A novel module architecture has been demonstrated that has potential for reducing manufacturing cost while improving module reliability and recycling for c-Si PV which utilizes an edge-seal. Referred to as Edge Sealed Module (ESM), this architecture eliminates the vacuum lamination process and cross-linked encapsulants on the interior of the module. Functioning prototypes of c-Si have been fabricated for stress testing in collaboration with National Renewable Energy Laboratories (NREL). These modules are being tested and compared to traditionally manufactured modules. Based on preliminary results, this module architecture is a potentially viable solution for improving the manufacturing cost and recyclability of PV modules while enhancing module performance.

costs↗
DOE OSTI2026

HYBRID COMPOSITES VIA CO-EXTRUSION ADDITIVE MANUFACTURING-COMPRESSION MOLDING FOR PERFORMANCE OPTIMIZATION

The growing demand for hybrid polymer composites with multifunctional properties has led to the development of various hybridization techniques, such as multi-material compounding and controlled laminate stacking sequence. In this study, a novel hybrid manufacturing approach was used by integrating a multiplexing extrusion system (MExS) based on additive manufacturing with subsequent compression molding process. This technique enabled the co-extrusion of different materials during the additive manufacturing process to fabricate composites with tailored performance. The developed hybrid composite featured a skin layer of glass fiberreinforced polycarbonate (PC/GF) encapsulating a carbon fiber-reinforced acrylonitrile butadiene styrene (CF/ABS) core. The structure was engineered to promote improved thermal and impact resistance at the surface, supported by a stiff core for enhanced overall mechanical integrity. Mechanical, thermal and morphological properties of the hybrid composites were investigated to understand trade-offs in performance compared to a single-material system. The results demonstrate that this approach enables the production of multifunctional composites suitable for applications such as automotive body panels and protective housings, where a balance of weight, mechanical strength, and thermal performance is essential.

Wasti, Sanjita [ORNL]↗
DOE OSTI2025

Preventing native oxide formation in niobium thin films through platinum encapsulation

Superconducting transmon qubits are a key technology in quantum computing, with niobium (Nb) widely used due to its favorable superconducting properties and compatibility with scalable fabrication. However, the performance of Nb-based qubits is hindered by two-level systems (TLS), which arise predominantly from native oxide layers at surfaces and interfaces. These oxides and suboxides form rapidly in air and contribute significantly to decoherence by introducing dielectric losses. While various mitigation strategies, including thermal-annealing, chemical-etching, and nitrogen plasma treatment, have been explored, many are challenging to integrate into large-scale manufacturing due to complexity and instability in ambient conditions. In this study, we investigate the structural, chemical, and superconducting properties of room-temperature sputtered Nb thin films grown on sapphire substrates. We focus on a surface protection strategy using noble metal encapsulation with platinum (Pt) to suppress oxides and reduce TLS-related losses. Structural and chemical characterization were performed using X-ray diffraction, X-ray photoelectron spectroscopy, and transmission electron microscopy. Superconducting properties were measured using a physical property measurement system. Results demonstrate that Pt encapsulation effectively suppresses surface oxidation and mitigates its detrimental impact on superconducting performance. In conclusion, this approach offers a promising path toward enhancing the coherence of Nb-based qubits while remaining compatible with scalable-fabrication processes.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Investigation of cosmic ray impact on transmon qubits with different materials through fast decay detection at Fermilab’s SQMS laboratory

Noise sources affecting superconducting qubits, such as cosmic rays and ambient gamma radiation, have garnered attention for their potential impact. These radiations deposit energy in the qubit's substrate, generating high-energy phonons that break Cooper pairs, leading to the formation of quasi-particles. When these quasi-particles tunnel across Josephson junctions, they induce qubit de-excitation, causing relaxation errors. In this study, we employ a fast feedback mechanism for performing qubit reset to detect decay events with high time resolution. This capability along with frequency multiplexed readout allows us to explore error correlations across time and space. Transmon qubits, manufactured within the Superconducting Quantum Materials and Systems (SQMS) center [1], are investigated at the above-ground lab. We study the impact of cosmic rays on qubits with different encapsulations, geometries, and locations on the same or different chips. We present preliminary findings and discuss the implications for the performance of contemporary quantum hardware.

Roy, Tanay↗
DOE OSTI2025

Experimental Characterization of High-Surface Area Thermal Energy Storage

There is growing interest in energy storage technologies due to the expansion of renewable energy sources that are inherently intermittent and the increasing frequency of extreme weather events that disturb the power grid. Power consumption in buildings makes up approximately 76% of all electricity usage on the grid and is primarily used for thermal applications such as space conditioning, hot water, and cooking. This makes thermal energy storage (TES) an ideal solution for many of these applications. Many TES technologies rely on latent energy storage, which utilizes the melting/solidification of phase change materials (PCM) to store energy. Typically, TES designs suffer from low power density due to their low inherent thermal conductivity. This limitation makes the deployment of TES in active applications difficult as the ease of access to energy is essential for effective use. Common routes for improving power density include high thermal conductivity additives or extended features such as fins that increase cost. This study presents an alternative approach to improving performance through increasing the overall surface area to volume ratio of the device, to increase the available area for convection to occur between the working fluid and PCM. In the study a commercial PCM was selected with a transition temperature ideal for space heating applications. The heat exchanger design utilizes a unique application of triply periodic minimal surfaces (TPMS) for macro-encapsulation of the PCM. The use of TPMS for heat exchangers has been growing in interest due to their high-surface area to volume ratios, which were previously unmanufacturable until the development of additive manufacturing. A modular system was designed and manufactured with a stereolithography resin printing system that is then backfilled with PCM. An experiment test set-up is designed to test the charge and discharge performance of the thermal storage using a conditioned air stream. The pressure drop of the design is tested across a variety of flow rates. When compared to existing experimental data within literature, there is excellent agreement based on the Reynolds number at similar hydraulic diameters. Several inlet temperatures are tested at consistent temperature differences from the phase change temperature for both charging and discharging. Additionally, the volumetric flow rate is varied for each temperature set point. It was found that increasing flow rate had diminishing returns in reducing the overall charge time of the TES. The temperature delta from the melting temperature was the primary contributor to the change in average heat flux with limited variation in average heat transfer rate between charging and discharging at similar inlet temperatures and flow rates. The TPMS heat exchanger design has a high air-side pressure drop but it provides high heat transfer rates. This helps maintain a high outlet temperature during discharge, which is important to thermal comfort applications. The design, manufacturing, and experimental characterization of the TES device will be presented as part of this study.

25 ENERGY STORAGE↗
DOE OSTI2025

Influence of Process Parameter and Build Rate Variations on Defect Formation in Laser Powder Bed Fusion SS316L

Laser powder bed fusion (LPBF) is an additive manufacturing process that has gained interest for its material fabrication due to multiple advantages, such as the ability to print parts with small feature sizes, good mechanical properties, reduced material waste, etc. However, variations in the key process parameters in LPBF may result in the instantiation of porosity defects and variation in build rate. Particularly, volumetric energy density (VED) is a variable that encapsulates a number of those parameters and represents the amount of energy input from the laser source to the feedstock. VED has been traditionally used to inform the quality of the printed part but different values of VED are presented as optimal values for certain material systems. An optimal VED value can be maintained by changing the key process parameters so that various combinations yield a constant value. In this study, an optimal constant VED value is maintained while printing SS316L with variable key processing parameters. Porosity analysis is performed using optical microscopy, as well as X-ray computed tomography, to reveal the volume density and distribution of those pores. Two primary defect categories are identified, namely lack of fusion and porosity induced by balling defects. The findings indicate that, even at optimal VED, variations in process parameters can significantly influence defect type, underscoring the sensitivity of defect formation to the variation of these parameters. Furthermore, a minor change in the build rate, driven by adjustments in process parameters, was found to influence defect categories. These findings emphasize that fine tuning the process parameters and build rate is essential to minimize defects. Finally, fiducial marks have been identified as a source of unintentional porosity defects. These results enable the refinement of process parameters, ultimately optimizing LPBF to achieve enhanced material density and expedite the printing.

36 MATERIALS SCIENCE↗
DOE OSTI2026

Lessons from the IEC Durability of Adhesion Accelerated Test Sequence

The IEC 62788-1-1 and IEC 63209-2 standards use aging sequences for durability of adhesion in photovoltaic (PV) modules, which may be evaluated using the single cantilever beam (SCB) test. Because the encapsulant forms critical interfaces with the front glass and solar cells, degradation at those interfaces under ultraviolet (UV) exposure, elevated temperature, and humidity can lead to interfacial delamination - compromising the long-term reliability. In this work, adhesion durability of UV-transmitting poly(ethylene-co-vinyl acetate) (EVA) encapsulant to glass and to silicon solar cells is evaluated after sequenced UV and damp heat aging (85C/85%RH). Laminates were prepared using StarPhire solar front glass with thin glass or PERC cells, and two EVA formulations with different concentrations of siloxane coupling agent. Adhesion was quantified by measuring critical debond energy using the SCB method. Both formulations exhibit similar qualitative trends, while different adhesion is observed at the periphery despite the use of low-shrink manufacturing. The results show that while glass/EVA adhesion remains stable or increases after UV exposure and shows only moderate changes after damp heat, the EVA/cell interface exhibits an irreversible loss of adhesion following UV and then damp heat exposure. Although glass/EVA interfaces generally exhibit lower debond energies, the EVA/cell interface is significantly more vulnerable to UV-driven degradation, identifying it as the dominant reliability risk location through early- and intermediate-module life. These results demonstrate that accelerated aging sequences can expose large, interface-specific losses in adhesion durability and underscore the importance of interface engineering for long-term PV module reliability.

14 SOLAR ENERGY↗
DOE OSTI2026

Ultrafast (1‐5 sec) Lamination of Perovskite Solar Cells With Self‐Encapsulation Using Rapid Joule Heating

Perovskite solar cells (PSCs) are traditionally fabricated using sequential layer‐by‐layer deposition, in which each layer of the device is processed on top of the preceding layer. This constrains the processing techniques and selection of transport layer materials that can be used in the solar cell. To overcome these challenges, two half‐cells can be processed independently and then diffusion‐bonded through a lamination process. However, current lamination processes for perovskite solar cells suffer from relatively long process times, which can limit throughput when moving toward high‐volume manufacturing. In this study, a custom platform was designed for rapid‐joule heating of perovskite materials and devices. This enabled more than a 99% reduction in lamination time from 26 min to 1 s. Perovskite samples that were laminated in 1 s exhibited comparable values of percent bonded area, interfacial toughness, grain domain size, and X‐ray diffraction spectra to those laminated in greater than 10 min. As a proof‐of‐concept, 18.3% efficient devices were successfully laminated in 5 s. A transient heat transfer model was developed to describe the relationship between the perovskite temperature and the electrical power supplied to the heaters, establishing a baseline for predicting processing conditions in large‐scale manufacturing systems. Ultra‐fast lamination provides a pathway toward scalable roll‐to‐roll or sheet‐to‐sheet manufacturing of PSCs.

heat transfer↗
DOE OSTI2024

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2025

In‐Scribe Silane Bonding for Mechanical Reinforcement of Perovskite Photovoltaic Modules

Despite the extraordinary rise in power conversion efficiency over the last decade, metal halide perovskite (MHP) photovoltaics remain more mechanically fragile than other PV technologies. In this work, the scribe area, created by the monolithic interconnection of thin-film solar cells, is used to extrinsically reinforce the mechanical robustness of packaged MHP solar modules. In contrast to the epoxy-based chemistries often leveraged in the MHP literature, silane-grafted polyolefin encapsulants are designed to form strong covalent bonds to oxide surfaces, specifically to glass and the transparent conductive oxide at the base of the scribe line. Pseudo-modules encapsulated with silane-grafted polyolefin are measured with more than an order-of-magnitude enhancement infracture energy from 0.27 ± 0.01 J·m −2 (no scribes) to 5.97 ± 0.42 J·m −2 (scribes perpendicular to delamination directioncovering ≈2.2% of the module area). The silane-grafted polyolefin retains strong adhesion even after undergoing an accelerated IEC 61215 thermal cycling test consisting of 250 cycles. We find that the in-scribe bonding allows perovskite modules to have adhesion strength comparable to commercial c-Si and CdTe technologies with only 5% reduction in the active module area. This manufacturing-compatible approach offers a practical solution to address the mechanical integrity challenges in MHP solar modules, regardless of cell architecture.

14 SOLAR ENERGY↗
DOE OSTI2025

Coaxial Direct Ink Writing of Cholesteric Liquid Crystal Elastomers in 3D Architectures

Abstract Cholesteric liquid crystal elastomers (CLCEs) hold great promise for mechanochromic applications in anti‐counterfeiting, smart textiles, and soft robotics, thanks to the structural color and elasticity. While CLCEs are printed via direct ink writing (DIW) to fabricate free‐standing films, complex 3D structures are not fabricated due to the opposing rheological properties necessary for cholesteric alignment and multilayer stacking. Here, 3D CLCE structures are realized by utilizing coaxial DIW to print a CLC ink within a silicone ink. By tailoring the ink compositions, and thus, the rheological properties, the cholesteric phase rapidly forms without an annealing step, while the silicone shell provides encapsulation and support to the CLCE core, allowing for layer‐by‐layer printing of self‐supported 3D structures. As a demonstration, free‐standing bistable thin‐shell domes are printed. Color changes due to compressive and tensile stresses can be witnessed from the top and bottom of the inverted domes, respectively. When the domes are arranged in an array and inverted, they can snap back to their base state by uniaxial stretching, thereby functioning as mechanical sensors with memory. The additive manufacturing platform enables the rapid fabrication of 3D mechanochromic sensors thereby expanding the realm of potential applications for CLCEs.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Peening Techniques for Mitigating Chlorine-Induced Stress Corrosion Cracking of Dry Storage Canisters for Nuclear Applications

Fusion-welded austenitic stainless steel (ASS) was predominantly employed to manufacture dry storage canisters (DSCs) for the storage applications of spent nuclear fuel (SNF). However, the ASS weld joints are prone to chloride-induced stress corrosion cracking (CISCC), a critical safety issue in the nuclear industry. DSCs were exposed to a chloride-rich environment during storage, creating CISCC precursors. The CISCC failure leads to nuclear radiation leakage. Therefore, there is a critical need to enhance the CISCC resistance of DSC weld joints using promising repair techniques. This review article encapsulates the current state-of-the-art of peening techniques for mitigating the CISCC in DSCs. More specifically, conventional shot peening (CSP), ultrasonic impact peening (UIP), and laser shock peening (LSP) were elucidated with a focus on CISCC mitigation. The underlying mechanism of CISCC mitigation in each process was summarized. Finally, this review provides recent advances in surface modification techniques, repair techniques, and developments in welding techniques for CISCC mitigation in DSCs.

Chemistry↗