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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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The development of encapsulation processing and a manufacturing productivity analysis for photovoltaic cells are discussed. The goals were: (1) to understand the relationships between both formulation variables and process variables; (2) to define conditions required for optimum performance; (3) to predict manufacturing yield; and (4) to provide documentation to industry.
The Photovoltaic Conversion Program was established to find methods of economically generating enough electrical power to meet future requirements. Activities and progress in the following areas are discussed: silicon-refinement processes; silicon-sheet-growth techniques; encapsulants; manufacturing of off-the-shelf solar arrays; and procurement of semistandardized solar arrays.
Evaluation of the ethyl vinyl acetate (EVA) encapsulation system is presented. This work is part of the materials baseline needed to demonstrate a 30 year module lifetime capability. Process and compound variables are both being studied along with various module materials. Results have shown that EVA should be stored rolled up, and enclosed in a plastic bag to retard loss of peroxide curing agents. The TBEC curing agent has superior shelf life and processing than the earlier Lupersol-101 curing agent. Analytical methods were developed to test for peroxide content, and experimental methodologies were formalized.
Manufacturing sequence for silicon solar cells using Czochralsky crystal growing techniques in order to produce at a rate of 20 MW per year on a 24-hour per day basis is discussed. Cost analysis of the manufacturing is presented and consideration is given to the following processing decision categories of the manufacturing of an unencapsulated solar cell from a silicon wafer: (1) treatment of the optical surface; (2) formation of the junction(s); and (3) metallization of electrical collectors. The manufacturing of encapsulated solar modules from solar cells, using two glass plates, a low iron front surface, and a standard float glass back plate, is described. Totaling the three major activities of wafer making, cell manufacturing, and module fabrication, the resulting contribution to module price will be 1.945 $/watt.
Several innovative concepts were introduced for the Block IV contract. Semicrystalline silicon manufactured by SEMIX Inc. is the basic cell material. A front metallization pattern combined with a wraparound-style interconnect and in-plane stress relief combine to provide a new method to reliably accomplish series-paralleling. Laminated modules using Ethylene Vinyl Acetate (EVA) as the encapsulant were manufactured for the first time.
Clemson University has been engaged for the past five years in a program to determine the reliability attributes of solar cells by means of accelerated test procedures. The cells are electrically measured and visually inspected and then subjected for a period of time to stress in excess of that normally encountered in use, and then they are reinspected. Changes are noted and the process repeated. This testing has thus far involved 23 different unencapsulated cell types from 12 different manufacturers, and 10 different encapsulated cell types from 9 different manufacturers. Reliability attributes of metallization systems can be classified as major or minor, depending on the severity of the effects observed. As a result of the accelerated testing conducted under the Clemson program, major effects have been observed related to contact resistance and to mechanical adherence and solderability. This paper does not attempt a generalized survey of accelerated test results, but rather concentrates on one particular attribute of metallization that has been observed to cause electrical degradation - increased contact resistance due to Schottky barrier formation. In this example basic semiconductor theory was able to provide an understanding of the electrical effects observed during accelerated stress testing.
It is reported by some users and has been demonstrated by others via testing and qualification that the quality and reliability of plastic-encapsulated microcircuits (PEMs) manufactured today are excellent in commercial applications and closely equivalent, and in some cases superior to their hemetic counterparts.
Prototype equipment was developed which allows for totally automated assembly in the three major areas of module manufacture: cell stringing, encapsulant layup and cure and edge sealing. The equipment is designed to be used in conjunction with a standard Unimate 2000B industrial robot although the design is adaptable to other transport systems.
Composite skin/stringer flange debond specimens manufactured from composite prepreg containing interleaf layers with a polymer based healing agent encapsulated in thin walled spheres were tested. As a crack develops and grows in the base polymer, the spheres fracture releasing the healing agent. The agent reacts with catalyst and polymerizes healing the crack. In addition, through-thickness reinforcement, in the form of pultruded carbon z-pins were included near the flange tips to improve the resistance to debonding. Specimens were manufactured with 14 plies in the skin and 10 plies in the stiffener flange. Three-point bend tests were performed to measure the skin/stiffener debonding strength and the recovered strength after healing. The first three tests performed indicated no healing following unloading and reloading. Micrographs showed that delaminations could migrate to the top of the interleaf layer due to the asymmetric loading, and hence, bypass most of the embedded capsules. For two subsequent tests, specimens were clamped in reverse bending before reloading. In one case, healing was observed as evidenced by healing agent that leaked to the specimen edge forming a visible "scar". The residual strength measured upon reloading was 96% of the original strength indicating healing had occurred. Hence, self-healing is possible in fiber reinforced composite material under controlled conditions, i.e., given enough time and contact with pressure on the crack surfaces. The micro-encapsulation technique may prove more robust when capsule sizes can be produced that are small enough to be embedded in the matrix resin without the need for using an interleaf layer. However, in either configuration, the amount of healing that can occur may be limited to the volume of healing agent available relative to the crack volume that must be filled.
Results of an ongoing research program into the reliability of terrestrial solar cells are presented. Laboratory accelerated testing procedures are used to identify failure/degradation modes which are then related to basic physical, chemical, and metallurgical phenomena. In the most recent tests, ten different types of production cells, both with and without encapsulation, from eight different manufacturers were subjected to a variety of accelerated tests. Results indicated the presence of a number of hitherto undetected failure mechanisms, including Schottky barrier formation at back contacts and loss of adhesion of grid metallization. The mechanism of Schottky barrier formation is explained by hydrogen, formed by the dissociation of water molecules at the contact surface, diffusing to the metal semiconductor interface. This same mechanism accounts for the surprising increase in sensitivity to accelerated stress conditions that was observed in some cells when encapsulated.
Survey and questionnaire techniques were used to gather data from users and manufacturers on the failure rates in the field of plastic encapsulated semiconductors. It was found that such solid state devices are being successfully used by commercial companies which impose certain screening and qualification procedures. The reliability of these semiconductors is now adequate to support their consideration in NASA systems, particularly in low cost systems. The cost of performing necessary screening for NASA applications was assessed.
As NASA develops more planetary protection missions that are Category III and in the Class D/rideshare mission platform, there is an increasing reliance on estimation of prelaunch bioburden to understand needs for burn up and breakup analyses or other methods to meet pre-launch bioburden levels. Current levels estimated for the encapsulated bioburden of semiconductor parts cited by NASA have been based on estimates of semiconductor manufacturing approaches from the 1970s that do not incorporate over fifty years of evolving cleanliness of semiconductor manufacturing processes and facilities. This investigation will focus on direct sampling of semiconductor parts for encapsulated bioburden values, drawing upon Goddard’s strength in EEE parts, supply chain management, destructive parts analysis and existing local planetary protection lab facilities to prepare and measure encapsulated bioburden at a statistically significant level for standard electronics parts common to known Class D/rideshare platforms.
As NASA develops more planetary protection missions that are Category III and in the Class D/rideshare mission platform, there is an increasing reliance on estimation of prelaunch bioburden to understand needs for burn up and breakup analyses or other methods to meet pre-launch bioburden levels. Current levels estimated for the encapsulated bioburden of semiconductor parts cited by NASA have been based on estimates of semiconductor manufacturing approaches from the 1970s that do not incorporate the evolving cleanliness of semiconductor manufacturing since that time. This investigation will focus on direct sampling of semiconductor parts for encapsulated bioburden values, drawing upon Goddard’s strength in EEE parts, supply chain management, destructive parts analysis and existing local planetary protection lab facilities to prepare and measure encapsulated bioburden at a statistically significant level for standard electronics parts common to known Class D/rideshare platforms.
Glass capillary tube technique measures interfacial tension between two immiscible liquids. Yields useful data over fairly wide range of interfacial tensions, both for pairs of liquids having equal densities and pairs of liquids having unequal densities. Data on interfacial tensions important in diverse industrial chemical applications, including enhanced extraction of oil; printing; processing foods; and manufacture of paper, emulsions, foams, aerosols, detergents, gel encapsulants, coating materials, fertilizers, pesticides, and cosmetics.
Recently, the promise of self-healing materials for enhanced autonomous durability has been introduced using a micro-encapsulation technique where a polymer based healing agent is encapsulated in thin walled spheres and embedded into a base polymer along with a catalyst phase. For this study, composite skin-stiffener flange debonding specimens were manufactured from composite prepreg containing interleaf layers with a polymer based healing agent encapsulated in thin-walled spheres. Constant amplitude fatigue tests in three-point bending showed the effect of self-healing on the fatigue response of the skin-stiffener flange coupons. After the cycling that created debonding, fatigue tests were held at the mean load for 24 hours. For roughly half the specimens tested, when the cyclic loading was resumed a decrease in compliance (increase in stiffness) was observed, indicating that some healing had occurred. However, with continued cycling, the specimen compliance eventually increased to the original level before the hold, indicating that the damage had returned to its original state. As was noted in a prevoius study conducted with specimens tested under monotonically increasing loads to failure, healing achieved via the micro-encapsulation technique may be limited to the volume of healing agent available relative to the crack volume.
Internal embedment stress measurements were performed, using tiny ferrite core transformers, whose voltage output was calibrated versus pressure by the manufacturer. Comparative internal strain measurements were made by attaching conventional strain gages to the same type of resistors and encapsulating these in various potting compounds. Both types of determinations were carried out while temperature cycling from 77 C to -50 C.
Progress made by the Low-Cost Silicon Solar Array Project during the period January through March 1978 is reported. It includes task reports on silicon material processing, large-area silicon sheet development, encapsulation materials testing and development, project engineering and operations, and manufacturing techniques, plus the steps taken to integrate these efforts.
Epoxy encapsulated microcircuits were subjected to various thermal, vibration, thermal cycling, and reduced barometric pressure stress tests to obtain electrical, environmental, and failure data. Analyses of the data were employed to derive information on environmental and operating design limits to determine the capability of encapsulated microcircuits to perform in space applications and environments. Seven different part types (four TTL, two CMOS, one linear) from five different manufacturers were subjected to single, multiple, and combinational environmental stress levels to determine: (1) what failure mechanisms are unique to encapsulated microcircuits; (2) how believable are suppliers claims of improved reliability, (3) what stress tests and screens can be used to identify potential early failure, and (4) what stress tests and screens should be avoided to prevent unwanted life degradation.