Sheet‐Based Fluidic Diodes for Embedded Fluidic Circuitry in Soft Devices
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Vi T. Vo↗
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Microstrip Antenna Arrays on Multilayer LCP Substrates
A research and development effort now underway is directed toward satisfying requirements for a new type of relatively inexpensive, lightweight, microwave antenna array and associated circuitry packaged in a thin, flexible sheet that can readily be mounted on a curved or flat rigid or semi-rigid surface. A representative package of this type consists of microwave antenna circuitry embedded in and/or on a multilayer liquid- crystal polymer (LCP) substrate. The circuitry typically includes an array of printed metal microstrip patch antenna elements and their feedlines on one or more of the LCP layer(s). The circuitry can also include such components as electrostatically actuated microelectromechanical systems (MEMS) switches for connecting and disconnecting antenna elements and feedlines. In addition, the circuitry can include switchable phase shifters described below. LCPs were chosen over other flexible substrate materials because they have properties that are especially attractive for high-performance microwave applications. These properties include low permittivity, low loss tangent, low water-absorption coefficient, and low cost. By means of heat treatments, their coefficients of thermal expansion can be tailored to make them more amenable to integration into packages that include other materials. The nature of the flexibility of LCPs is such that large LCP sheets containing antenna arrays can be rolled up, then later easily unrolled and deployed. Figure 1 depicts a prototype three- LCP-layer package containing two four-element, dual-polarization microstrip-patch arrays: one for a frequency of 14 GHz, the other for a frequency of 35 GHz. The 35-GHz patches are embedded on top surface of the middle [15-mil (approx.0.13-mm)-thick] LCP layer; the 14- GHz patches are placed on the top surface of the upper [9-mil (approx. 0.23-mm)-thick] LCP layer. The particular choice of LCP layer thicknesses was made on the basis of extensive analysis of the effects of the thicknesses on cross-polarization levels, bandwidth, and efficiency at each frequency.
Thompson, Dane↗
Design and Assembly Process Implementation for Embedding Passive and Active Components Introduction to IPC-7092
"This presentation describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and be made from organic, inorganic (ceramic) or both types of material."
embedded circuitry↗
Circuit for Communication Over Power Lines
Many distributed systems share common sensors and instruments along with a common power line supplying current to the system. A communication technique and circuit has been developed that allows for the simple inclusion of an instrument, sensor, or actuator node within any system containing a common power bus. Wherever power is available, a node can be added, which can then draw power for itself, its associated sensors, and actuators from the power bus all while communicating with other nodes on the power bus. The technique modulates a DC power bus through capacitive coupling using on-off keying (OOK), and receives and demodulates the signal from the DC power bus through the same capacitive coupling. The circuit acts as serial modem for the physical power line communication. The circuit and technique can be made of commercially available components or included in an application specific integrated circuit (ASIC) design, which allows for the circuit to be included in current designs with additional circuitry or embedded into new designs. This device and technique moves computational, sensing, and actuation abilities closer to the source, and allows for the networking of multiple similar nodes to each other and to a central processor. This technique also allows for reconfigurable systems by adding or removing nodes at any time. It can do so using nothing more than the in situ power wiring of the system.
Krasowski, Michael J.↗
Using Neural Networks in Decision Making for a Reconfigurable Electro Mechanical Actuator (EMA)
The objectives of this project were to demonstrate applicability and advantages of a neural network approach for evaluating the performance of an electro-mechanical actuator (EMA). The EMA in question was intended for the X-37 Advanced Technology Vehicle. It will have redundant components for safety and reliability. The neural networks for this application are to monitor the operation of the redundant electronics that control the actuator in real time and decide on the operating configuration. The system we proposed consists of the actuator, sensors, control circuitry and dedicated (embedded) processors. The main purpose of the study was to develop suitable hardware and neural network capable of allowing real time reconfiguration decisions to be made. This approach was to be compared to other methods such as fuzzy logic and knowledge based systems considered for the same application. Over the course of the project a more general objective was the identification of the other neural network applications and the education of interested NASA personnel on the topic of Neural Networks.
Latino, Carl D.↗
Monitoring Digital Closed-Loop Feedback Systems
A technique of monitoring digital closed-loop feedback systems has been conceived. The basic idea is to obtain information on the performances of closed-loop feedback circuits in such systems to aid in the determination of the functionality and integrity of the circuits and of performance margins. The need for this technique arises as follows: Some modern digital systems include feedback circuits that enable other circuits to perform with precision and are tolerant of changes in environment and the device s parameters. For example, in a precision timing circuit, it is desirable to make the circuit insensitive to variability as a result of the manufacture of circuit components and to the effects of temperature, voltage, radiation, and aging. However, such a design can also result in masking the indications of damaged and/or deteriorating components. The present technique incorporates test circuitry and associated engineering-telemetry circuitry into an embedded system to monitor the closed-loop feedback circuits, using spare gates that are often available in field programmable gate arrays (FPGAs). This technique enables a test engineer to determine the amount of performance margin in the system, detect out of family circuit performance, and determine one or more trend(s) in the performance of the system. In one system to which the technique has been applied, an ultra-stable oscillator is used as a reference for internal adjustment of 12 time-to-digital converters (TDCs). The feedback circuit produces a pulse-width-modulated signal that is fed as a control input into an amplifier, which controls the circuit s operating voltage. If the circuit s gates are determined to be operating too slowly or rapidly when their timing is compared with that of the reference signal, then the pulse width increases or decreases, respectively, thereby commanding the amplifier to increase or reduce, respectively, its output level, and "adjust" the speed of the circuits. The nominal frequency of the TDC s pulse width modulated outputs is approximately 40 kHz. In this system, the technique is implemented by means of a monitoring circuit that includes a 20-MHz sampling circuit and a 24-bit accumulator with a gate time of 10 ms. The monitoring circuit measures the duty cycle of each of the 12 TDCs at a repetition rate of 28 Hz. The accumulator content is reset to all zeroes at the beginning of each measurement period and is then incremented or decremented based of the value of the state of the pulse width modulated signal. Positive or negative values in the accumulator correspond to duty cycles greater or less, respectively, than 50 percent.
Katz, Richard↗
A Multifunctional Bistable Ultrathin Composite Boom for In-Space Monitoring of Deployment Dynamics
A novel concept of a multifunctional deployable ultrathin composite boom with flexible electronics and circuits integrated in a highly compact configuration, which can monitor its deployment dynamics in space, is presented in this paper. This concept is particularly suitable for CubeSats with extremely limited payload volume. The multifunctional deployable boom will be flight hardware installed in a 3U CubeSat that is scheduled to be launched to the International Space Station (ISS) in 2023 as an in-space technology demonstration. The multifunctional boom consists of a bistable self-deployable ultrathin composite boom, flexible electronics and circuitry for dynamics monitoring, and embedded flexible thin wires for power delivery and data transmission. The design, materials, and fabrication methods for the multifunctional boom are presented. Tests in simulated space environments showed the survivability and stability of the flexible electronics within a temperature range of 7 °C to 50 °C and under a high vacuum level of approximately 1 × 10−6 Torr. Ground-based vibration and deployment tests demonstrated the overall design of the multifunctional boom, data acquisition system, and deployment mechanism. Analyses of the data obtained from the integrated flexible electronics successfully captured the deployment dynamics and identified the natural frequencies of the boom in the range of 0–100 Hz. These results demonstrate that the concept is a promising approach to future multifunctional ultrathin deployable space structures.
Yao Yao↗
A Multifunctional Bistable Ultrathin Composite Boom for In-Space Monitoring of Deployment Dynamics
A novel concept of a multifunctional deployable ultrathin composite boom with flexible electronics and circuits integrated in a highly compact configuration, which can monitor its deployment dynamics in space, is presented in this paper. This concept is particularly suitable for CubeSats with extremely limited payload volume. The multifunctional deployable boom will be flight hardware installed in a 3U CubeSat that is scheduled to be launched to the International Space Station (ISS) in 2023 as an in-space technology demonstration. The multifunctional boom consists of a bistable self-deployable ultrathin composite boom, flexible electronics and circuitry for dynamics monitoring, and embedded flexible thin wires for power delivery and data transmission. The design, materials, and fabrication methods for the multifunctional boom are presented. Tests in simulated space environments showed the survivability and stability of the flexible electronics within a temperature range of 7 °C to 50 °C and under a high vacuum level of approximately 1 × 10−6 Torr. Ground-based vibration and deployment tests demonstrated the overall design of the multifunctional boom, data acquisition system, and deployment mechanism. Analyses of the data obtained from the integrated flexible electronics successfully captured the deployment dynamics and identified the natural frequencies of the boom in the range of 0–100 Hz. These results demonstrate that the concept is a promising approach to future multifunctional ultrathin deployable space structures.
Yao Yao↗
Flexible Cryogenic Temperature and Liquid-Level Probes
Lightweight, flexible probes have been developed for measuring temperatures at multiple locations in tanks that contain possibly pressurized cryogenic fluids. If the fluid in a given tank is subcritical (that is, if it consists of a liquid and its vapor), then in one of two modes of operation, the temperature measurements made by a probe of this type can be used to deduce the approximate level of the liquid. The temperature sensors are silicon diodes located at intervals along a probe. If the probe is to be used to measure a temperature gradient along a given axis in the tank, then the probe must be mounted along that axis. In the non-liquid-level-sensing temperature-measurement mode, a constant small electric current is applied to each diode and the voltage across the diode . a known function of the current and temperature . is measured as an indication of its temperature. For the purpose of this measurement, "small electric current" signifies a current that is not large enough to cause a significant increase in the measured temperature. More specifically, the probe design calls for a current of 10 A, which, in the cryogenic temperature range of interest, generates heat at a rate of only about 0.01 mW per diode. In the liquid-level-sensing mode, one applies a larger current (30 mA) to each diode so as to heat each diode appreciably (with a power of about 36 mW in the temperature range of interest). Because the liquid cools the diode faster than does the vapor, the temperature of the diode is less when diode is immersed in the liquid than when it is above the surface of the liquid. Thus, the temperature (voltage) reading from each diode can be used to determine whether the liquid level is above or below the diode, and one can deduce that the liquid level lies between two adjacent diodes, the lower one of which reads a significantly lower temperature. The aforementioned techniques for measuring temperature and deducing liquid level are not new. What is new here are the designs of the probes and of associated external electronic circuitry. In each probe, the diodes and the lead wires are embedded in a strong, lightweight, flexible polyimide strip. Each probe is constructed as an integral unit that includes a multipin input/output plug or socket for solderless connection of the lead wires to the external circuitry. The polyimide strip includes mounting tabs with holes that can accommodate rivets, screws, or other fasteners. Alternatively, a probe can be mounted by use of an epoxy. A probe can be manufactured to almost any length or width, and the diodes can be embedded at almost any desired locations along and across the polyimide strip. In designing a probe for a specific application, one seeks a compromise between (1) minimizing the number of diodes in order to minimize the complexity of input/output connections and external electronic circuitry while (2) using enough diodes to obtain the required precision. Optionally, to minimize spurious heating of the cryogenic fluid, the external circuitry can be designed to apply power to the probe only during brief measurement intervals. Assuming that the external circuitry is maintained at a steady temperature, a power-on interval of only a few seconds is sufficient to obtain accurate data on temperatures and/or the height of the liquid/vapor interface.
Haberbusch, Mark↗
Flexible Cryogenic Temperature and Liquid-Level Probes
Lightweight, flexible probes have been developed for measuring temperatures at multiple locations in tanks that contain possibly pressurized cryogenic fluids. If the fluid in a given tank is subcritical (that is, if it consists of a liquid and its vapor), then in one of two modes of operation, the temperature measurements made by a probe of this type can be used to deduce the approximate level of the liquid. The temperature sensors are silicon diodes located at intervals along a probe. If the probe is to be used to measure a temperature gradient along a given axis in the tank, then the probe must be mounted along that axis. In the temperature-measurement mode, a constant small electric current is applied to each diode and the voltage across the diode a known function of the current and temperature is measured as an indication of its temperature. For the purpose of this measurement, small electric current signifies a current that is not large enough to cause a significant increase in the measured temperature. More specifically, the probe design calls for a current of 10 A, which, in the cryogenic temperature range of interest, generates heat at a rate of only about 0.01 mW per diode. In the liquid-level-sensing mode, one applies a larger current (30 mA) to each diode so as to heat each diode appreciably (with a power of about 36 mW in the temperature range of interest). Because the liquid cools the diode faster than does the vapor, the temperature of the diode is less when the diode is immersed in the liquid than when it is above the surface of the liquid. Thus, the temperature (voltage) reading from each diode can be used to determine whether the liquid level is above or below the diode, and one can deduce that the liquid level lies between two adjacent diodes, the lower one of which reads a significantly lower temperature. The aforementioned techniques for measuring temperature and deducing liquid level are not new. What is new here are the designs of the probes and of associated external electronic circuitry. In each probe, the diodes and the lead wires are embedded in a strong, lightweight, flexible polyimide strip. Each probe is constructed as an integral unit that includes a multipin input/output plug or socket for solderless connection of the lead wires to the external circuitry. The polyimide strip includes mounting tabs with holes that can accommodate rivets, screws, or other fasteners. Alternatively, a probe can be mounted by use of an epoxy. A probe can be manufactured to almost any length or width, and the diodes can be embedded at almost any desired location along and across the polyimide strip. In designing a probe for a specific application, one seeks a compromise between (1) minimizing the number of diodes in order to minimize the complexity of input/output connections and external electronic circuitry while (2) using enough diodes to obtain the required precision. Optionally, to minimize spurious heating of the cryogenic fluid, the external circuitry can be designed to apply power to the probe only during brief measurement intervals. Assuming that the external circuitry is maintained at a steady temperature, a power-on interval of only a few seconds is sufficient to obtain accurate data on temperatures and/or the height of the liquid/vapor interface.
Haberbusch, Mark↗
Conductive Liquid Metal Vitrimer Composites for Reconfigurable and Recyclable Flexible Electronics
Liquid metal (LM) elastomer composites exhibit excellent functionality for stretchable electronics and wearables, but limited recycling and reuse pathways constrain their sustainable use. Here, to address these challenges amid growing concerns over electronic waste, a conductive LM–vitrimer composite is presented that enables recyclable and reconfigurable electronics. This soft and stretchable composite features uniformly distributed LM inclusions that enhance thermal conductivity by 6.53× and enable the formation of conductive traces with electrical self-healing, while the vitrimer provides structural restoration. The dynamic covalent bonds of the vitrimer matrix are leveraged for both reprocessing the composite and chemically recovering 94% of the LM. This liquid-state filler slightly reduces the vitrimer's stiffness to 2.63 MPa (≈20% lower), while maintaining its high stretchability (>135% strain) and thermal stability. It is further examined how ultrasonicated LM inclusions interact with the vitrimer matrix and demonstrate the composite's self-healing and recyclability through two distinct approaches: 1) thermomechanical reprocessing, which restores fragmented composites under heat and compression for circuit reconfiguration; and 2) chemical recycling, which recovers the embedded LM for reuse in fabricating new composites and redesigned circuitry. With the integration of recyclability and diverse functional capabilities, LM–vitrimer composites emerge as a promising material platform for sustainable, flexible electronics.
Han, Youngshang [Univ. of Washington, Seattle, WA ↗
Development of Flexible Multilayer Circuits and Cables
A continuing program addresses the development of flexible multilayer electronic circuits and associated flexible cables. This development is undertaken to help satisfy aerospace-system-engineering requirements for efficient, lightweight electrical and electronic subsystems that can fit within confined spaces, adhere to complexly shaped surfaces, and can be embedded within composite materials. Heretofore, substrate layers for commercial flexible circuitry have been made from sheets of Kapton (or equivalent) polyimide and have been bonded to copper conductors and to other substrate layers by means of adhesives. The substrates for the present developmental flexible circuitry are made from thin films of a polyimide known as LaRC(TM)-SI. This polyimide is thermoplastic and, therefore, offers the potential to eliminate delamination and the need for adhesives. The development work undertaken thus far includes experiments in the use of several techniques of design and fabrication (including computer-aided design and fabrication) of representative flexible circuits. Anticipated future efforts would focus on multilayer bonding, fabrication of prototypes, and overcoming limitations.
Barnes, Kevin N.↗
Command Interface ASIC - Analog Interface ASIC Chip Set
A command interface application-specific integrated circuit (ASIC) and an analog interface ASIC have been developed as a chip set for remote actuation and monitoring of a collection of switches, which can be used to control generic loads, pyrotechnic devices, and valves in a high-radiation environment. The command interface ASIC (CIA) can be used alone or in combination with the analog interface ASIC (AIA). Designed primarily for incorporation into spacecraft control systems, they are also suitable for use in high-radiation terrestrial environments (e.g., in nuclear power plants and facilities that process radioactive materials). The primary role of the CIA within a spacecraft or other power system is to provide a reconfigurable means of regulating the power bus, actuating all valves, firing all pyrotechnic devices, and controlling the switching of power to all switchable loads. The CIA is a mixed-signal (analog and digital) ASIC that includes an embedded microcontroller with supporting fault-tolerant switch control and monitoring circuitry that is capable of connecting to a redundant set of interintegrated circuit (I(sup 2)C) buses. Commands and telemetry requests are communicated to the CIA. Adherence to the I(sup 2)C bus standard helps to reduce development costs by facilitating the use of previously developed, commercially available components. The AIA is a mixed-signal ASIC that includes the analog circuitry needed to connect the CIA to a custom higher powered version of the I(sup 2)C bus. The higher-powered version is designed to enable operation with bus cables longer than those contemplated in the I(sup 2)C standard. If there are multiple higher-power I(sup 2)C-like buses, then there must an AIA between the CIA and each such bus. The AIA includes two identical interface blocks: one for the side-A I(sup 2)C clock and data buses and the other for the side B buses. All the AIAs on each side are powered from a common power converter module (PCM). Sides A and B of the I(sup 2)C buses are electrically isolated from each other (see figure). They are also isolated from the CIA by use of transformer coupling of signals between the AIA blocks and the CIA.
Ruiz, Baldes↗
Modular Composite Damage Detection System (MCDDS)
The 2020 CIF funded Modular Composite Damage Detection System (MCDDS) aims to advance the technology of damage detection in composites in the areas of thin, flexible damage detection panel construction, encapsulation techniques in composite matrixes, innovative integration and interfacing techniques with flexible embedded sensory panels, repair methods of composite materials, and improved packaging of the MCDDS. Custom thin, flexible polyimide printed circuit boards (PCBs) were designed and procured for fabrication of test specimens. A custom interface PCB was designed and fabricated to monitor the newly developed damage detection test specimens. Test specimens were fabricated using the novel flexible circuitry that were either fully or partially encapsulated. The fully encapsulated specimens were used to demonstrate embedded damage detection concepts and the partially encapsulated specimens were used to demonstrate surface-mounted (laminate) damage detection concepts. The new composite damage detection test specimens were tested and evaluated to determine if the novel damage detection sensory panels could withstand low-cycle threshold fatigue loading per a modified version of American Society for Testing and Materials (ASTM) D 7264 for up to 50 cycles without void formation. The data for multiple sensory panels indicates that the newly fabricated sensory panels are robust and do indeed withstand three-point bend flexural loading for more than 50 cycles. Additionally, testing was performed to determine if damage could be detected in damage detection test specimens subjected to failure using a 3-point bend test per a modified version of ASTM D 7264. Again, multiple sensory panels (both fully and partially encapsulated) showed the ability to detect damage to specimens subjected to failure per a modified version of ASTM D 7264. Additionally, a novel concept for tracking and monitoring of cracking (and potentially delamination) in composites was designed and developed that utilizes painted-on conductors.
Christopher Forney↗
NASA Tech Briefs, September 2009
opics covered include: Filtering Water by Use of Ultrasonically Vibrated Nanotubes; Computer Code for Nanostructure Simulation; Functionalizing CNTs for Making Epoxy/CNT Composites; Improvements in Production of Single-Walled Carbon Nanotubes; Progress Toward Sequestering Carbon Nanotubes in PmPV; Two-Stage Variable Sample-Rate Conversion System; Estimating Transmitted-Signal Phase Variations for Uplink Array Antennas; Board Saver for Use with Developmental FPGAs; Circuit for Driving Piezoelectric Transducers; Digital Synchronizer without Metastability; Compact, Low-Overhead, MIL-STD-1553B Controller; Parallel-Processing CMOS Circuitry for M-QAM and 8PSK TCM; Differential InP HEMT MMIC Amplifiers Embedded in Waveguides; Improved Aerogel Vacuum Thermal Insulation; Fluoroester Co-Solvents for Low-Temperature Li+ Cells; Using Volcanic Ash to Remove Dissolved Uranium and Lead; High-Efficiency Artificial Photosynthesis Using a Novel Alkaline Membrane Cell; Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays; Micro-Horn Arrays for Ultrasonic Impedance Matching; Improved Controller for a Three-Axis Piezoelectric Stage; Nano-Pervaporation Membrane with Heat Exchanger Generates Medical-Grade Water; Micro-Organ Devices; Nonlinear Thermal Compensators for WGM Resonators; Dynamic Self-Locking of an OEO Containing a VCSEL; Internal Water Vapor Photoacoustic Calibration; Mid-Infrared Reflectance Imaging of Thermal-Barrier Coatings; Improving the Visible and Infrared Contrast Ratio of Microshutter Arrays; Improved Scanners for Microscopic Hyperspectral Imaging; Rate-Compatible LDPC Codes with Linear Minimum Distance; PrimeSupplier Cross-Program Impact Analysis and Supplier Stability Indicator Simulation Model; Integrated Planning for Telepresence With Time Delays; Minimizing Input-to-Output Latency in Virtual Environment; Battery Cell Voltage Sensing and Balancing Using Addressable Transformers; Gaussian and Lognormal Models of Hurricane Gust Factors; Simulation of Attitude and Trajectory Dynamics and Control of Multiple Spacecraft; Integrated Modeling of Spacecraft Touch-and-Go Sampling; Spacecraft Station-Keeping Trajectory and Mission Design Tools; Efficient Model-Based Diagnosis Engine; and DSN Simulator.
Source record↗
Flexible Architecture for FPGAs in Embedded Systems
Commonly, field-programmable gate arrays (FPGAs) being developed in cPCI embedded systems include the bus interface in the FPGA. This complicates the development because the interface is complicated and requires a lot of development time and FPGA resources. In addition, flight qualification requires a substantial amount of time be devoted to just this interface. Another complication of putting the cPCI interface into the FPGA being developed is that configuration information loaded into the device by the cPCI microprocessor is lost when a new bit file is loaded, requiring cumbersome operations to return the system to an operational state. Finally, SRAM-based FPGAs are typically programmed via specialized cables and software, with programming files being loaded either directly into the FPGA, or into PROM devices. This can be cumbersome when doing FPGA development in an embedded environment, and does not have an easy path to flight. Currently, FPGAs used in space applications are usually programmed via multiple space-qualified PROM devices that are physically large and require extra circuitry (typically including a separate one-time programmable FPGA) to enable them to be used for this application. This technology adds a cPCI interface device with a simple, flexible, high-performance backend interface supporting multiple backend FPGAs. It includes a mechanism for programming the FPGAs directly via the microprocessor in the embedded system, eliminating specialized hardware, software, and PROM devices and their associated circuitry. It has a direct path to flight, and no extra hardware and minimal software are required to support reprogramming in flight. The device added is currently a small FPGA, but an advantage of this technology is that the design of the device does not change, regardless of the application in which it is being used. This means that it needs to be qualified for flight only once, and is suitable for one-time programmable devices or an application specific integrated circuit (ASIC). An application programming interface (API) further reduces the development time needed to use the interface device in a system.
Clark, Duane I.↗
An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduced Board Size for Space Based Electronics
This paper presents our work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuit (ASIC) applications. FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry. Our Interposer focuses on the needs of Micro Semi’s RTG4 FPGA. We developed the interposer using COTS embedded foil capacitors. The Interposer is customized to the capacitance requirements for each of the FPGA banks. We evaluated three foil manufactures Oak Mitsui, 3M and TDK. The three different designs were evaluated, but we will focus on the Oak-Mitsui based Interposer that we constructed and tested. Through simulations, we validate the horizontal and vertical interconnect inductances, that FPGA decoupling requirements are met. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.
Hunter, Don J↗
Hermetic Packages For Millimeter-Wave Circuits
Advanced hermetic packages developed to house electronic circuits operating at frequencies from 1 to 100 gigahertz and beyond. Signals coupled into and out of packages electromagnetically. Provides circuit packages small, lightweight, rugged, and inexpensive in mass production. Packages embedded in planar microstrip and coplanar waveguide circuits, in waveguide-to-planar and planar-to-waveguide circuitry, in waveguide-to-waveguide circuitry, between radiating (antenna) elements, and between planar transmission lines and radiating elements. Other applications in automotive, communication, radar, remote sensing, and biomedical electronic systems foreseen.
Herman, Martin I.↗