Design and operational characteristics of the Langley 20-megawatt plasma accelerator facility
Langley 20 megawatt plasma accelerator design and operation, describing arc heater modifications, exit parameters, electrical properties, etc
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Langley 20 megawatt plasma accelerator design and operation, describing arc heater modifications, exit parameters, electrical properties, etc
Thermal property analysis of connector contacts to find basic electric parameters, and to determine norms for contact and transitional resistance valve
This document presents in viewgraph format information on bipolar battery development at Johnson Controls, Incorporated. The organization structure, goals, progress to date, future plans, and battery parameters and electrical properties are given.
Ionospheric parameters measured in the presence of auroral arcs by the incoherent scatter Chatanika radar are used to define properties of the arcs. The radar broadcasts at 3-5 MW with a range resolution of 4.5 km along the radar line-of-sight, and has yielded auroral measurements on the variation of electron density, Hall and Pederson conductivity, horizontal electric fields, electrojet currents, precipitating electron energy flux, and the Joule heating rate. Elevation-scan techniques have been utilized to study the latitude and altitude variation of the ionospheric plasma parameters, and fixed-position scans allow determination of ionization conditions, including the electric fields and the acceleration of precipitating auroral electrons. Arcs in the diffuse aurora have been found to be local conductivity enhancements, while discrete arcs correspond to the boundary plasma sheet and have an asymmetric electric field pattern reduced on the northward side.
Evaluating spacecraft charging behavior of a vehicle in the space environment requires knowledge of the material properties relevant to the charging process. Implementing surface and internal charging models requires a user to specify a number of material electrical properties including electrical resistivity parameters (dark and radiation induced), dielectric constant, secondary electron yields, photoemission yields, and breakdown strength in order to correctly evaluate the electric discharge threat posed by the increasing electric fields generated by the accumulating charge density. In addition, bulk material mass density and/or chemical composition must be known in order to analyze radiation shielding properties when evaluating internal charging. We will first describe the physics of spacecraft charging and show how uncertainties in material properties propagate through spacecraft charging algorithms to impact the results obtained from charging models. We then provide examples using spacecraft charging codes to demonstrate their sensitivity to material properties. The goal of this presentation is to emphasize the importance in having good information on relevant material properties in order to best characterize on orbit charging threats.
Rocket payloads designed to measure small scale electron density irregularities and ion properties in the middle atmosphere were flown with each of the three main salvos of the MAC/Epsilon campaign conducted at the Andoya Rocket Range, Norway, during October to November 1987. Fixed bias, hemispheric nose tip probes measured small scale electron density irregularities, indicative of neutral air turbulence, during the rocket's ascent; and subsequently, parachute-borne Gerdien condensers measured the region's polar electrical conductivity, ion mobility and density. One rocket was launched during daylight (October 15, 1052:20 UT), and the other two launches occurred at night (October 21, 2134 UT: November 12, 0021:40 UT) under moderately disturbed conditions which enhanced the detection and measurement of turbulence structures. A preliminary analysis of the real time data displays indicates the presence of small scale electron density irregularities in the altitude range of 60 to 90 km. Ongoing data reduction will determine turbulence parameters and also the region's electrical properties below 90 km.
The return to the Moon has ignited the need to characterize the lunar regolith using fast, reliable in-situ methods. Characterizing the physical properties of the rocks and soils can be very difficult because of the many complex parameters that influence the measurements. In particular, soil electrical property measurements are influenced by temperature, mineral type, grain size, porosity, and soil conductivity. Determining the dielectric constant of lunar materials may be very important in providing quick characterization of surface deposits, especially for the Moon. A close examination of the lunar regolith samples collected by the Apollo astronauts indicates that the rocks and soils on the Moon are dominated by silicates and oxides. In this presentation, we will show that determining the dielectric constant measurements can provide a simple, quick detection method for minerals that contain titanium, iron, and water. Their presence is manifest by an unusually large imaginary permittivity.
We present an alternative interpretation of the high-resolution solar flare spectra obtained in 1981 by Lin et al. In our interpretation electron heating and acceleration are simultaneous and physically linked, rather than heating being a secondary effect of particle acceleration. We show that the observed properties of solar flare X-ray emission can in general be explained through the Joule heating and electric field acceleration of runaway electrons in current channels. We have fitted a hybrid thermal/nonthermal electron distribution, consisting of hot isothermal electrons with a nonthermal tail of runaway electrons, to representative spectra obtained by Lin et al. The hybrid model relaxes the electron number and energy flux requirements for the hard X-ray emission over those of a purely nonthermal model. The low-energy 'cutoff' to the nonthermal part of the X-ray spectrum is determined by the critical velocity in the electron distribution above which runaway acceleration occurs. We relate the fit parameters to the physical properties (such as the electric field strength in the current channels) of the acceleration region.
Thin films of titanium, zirconium, and hafnium nitride are prepared by DC magnetron reactive sputtering at room temperature on fused silica, optical glass, and silicon substrates. Deposition parameters are investigated in order to obtain stoichiometric films. The optical and electrical properties of the films as a function of nitrogen partial pressure are determined. The results show that an inverse correlation exists between the optical reflectance and the electrical resistivity of the films. Ellipsometer data for all three films show that their refractive index in the visible spectrum is decreased by increasing the film thickness while the extinction coefficient is unchanged. Thin films of TiN have the lowest room temperature resistivity relative to ZrN and HfN thin films.
The electrical properties of the gas are the primary limiting factor to MHD generator performance; the most relevant electrical properties are the conductivity and the Hall parameter. The maximum allowable pressure at several given levels of power extration vs. temperature is represented graphically.
The postulated concept of low-temperature all-metal thick film electrodes is discussed. It is noted that the mechanical and metallurgical properties of the electrodes are excellent, but electrical parameters remain to be optimized.
Data gathered on key design parameters. Report discusses study of electrical and mechanical properties of irradiated polymer dielectric materials. Data compiled for use by designers of high-energy-density capacitors that operate in presence of ionizing radiation. Study focused on polycarbonates, polyetheretherketones, polymethylpentenes, polyimides (including polyetherimide), polyolefins, polysulfones (including polyethersulfone and polyphenylsulfone), and polyvinylidene fluorides.
The objective of this test is to examine the mechanical and electrical properties of PFPI insulation. Some of the parameters considered during the test are: AC corona (400 Hz), wire fusing time, abrasion resistance, dynamic cut through, notch propagation, and weight loss (outgassing). In addition the degradation of the samples caused by the immature manufacturing status of the PFPI materials for wiring is considered.
Electrical and mechanical properties data on dielectrics to estimate parameters of cryogenic capacitors
We show that the observed properties of solar flare X-ray and microwave emission can be explained through the Joule heating and electric field acceleration of runaway electrons in current channels. The global properties of the flaring region required for this are presented. We have fit a hybrid thermal/nonthermal electron distribution, consisting of hot, isothermal electrons with a nonthermal tail of runaway electrons, to high-resolution hard X-ray and microwave spectra and have obtained excellent fits to both. The hybrid model relaxes the electron number and energy flux requirements for the hard X-ray emission over those of a purely nonthermal model. The model also provides explanations for several previously unexplained aspects of the high-resolution microwave spectra. The fit parameters can be related to physical properties (such as the electric field strength in the current channels) of the acceleration region.
Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.
In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.
Thermoelectric energy recovery systems require cost-optimized designs with high thermal and thermoelectric (TE) performance to surmount common commercialization barriers controlling the acceptance of thermoelectric generator (TEG) systems. Recent work has addressed this requirement with new analytic tools and paradigms that allow integrated TEG cost-performance analysis and optimization. New work herein has identified the existence of optimized TE element design (i.e., TE element length) for minimizing TEG cost and provides design guidelines associated with critical thermal and electrical contact resistance effects and TE manufacturing sensitivities. Once optimum hot-side heat flux criteria are satisfied, this work highlights the tradeoffs between interface resistance effects and manufacturing cost effects in determining optimum-cost TE element lengths, and then quantifies the increase in optimum-cost TE lengths as manufacturing costs become more sensitive to TE element lengths. Optimized TE element design criteria and key non-dimensional design parameters (i.e., [𝐶′′′LTE/𝐶′′], [TE/con], [con/(TE,aveLTE)]) driving the design are presented and explained showing the interdependencies between manufacturing cost parameters and thermal and electrical interface impacts on integrated TE cost-performance analysis and design. Comprehensive TEG system cost-performance relationships clearly demonstrate the two parameters that most greatly impact the TEG system cost are heat exchanger costs ($/(W/K)) and TE hot side heat flux. Reducing heat exhanger cost from $1/(W/K) to $0.5/(W/K) can decrease TEG system cost by $2/W to $4/W depending on TE hot side heat fluxes from 4-10 W/cm2. The impact of TE hot side heat flux on TEG system cost is larger; reducing TE system cost by factors of 2-4 as TE hot side heat flux increases from 4 W/cm2 to high levels around 18 W/cm2. The levels of thermal contact resistance and electrical contact resistance required to even approach the critical TEG system cost level of $1/W are characterized by con = 1.0 x 10-10 -m2 and r = 0.1, respectively. This not only lowers TEG costs, but it also makes the TEG system costs less sensitive to TE manufacturing dependences on TE element length. New design paradigms and relationships create holistic, integrated TE performance-cost models that enhance understanding of crucial interrelationships between component costs, TE design parameters and material properties, heat exchanger design parameters, interfacial heat flux, and now thermal and electrical interface effects in minimizing TEG system costs.