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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Scale error correction technique for structural impact modeling using dissimilar materials, involving permanent deformation of spherical caps impacted into liquids
The contour integral method is extended to general boundary value problems involving imperfect bonding of dissimilar materials. The loading and restraints are shown to have a significant effect on the stress intensity. Example problems are presented to illustrate the results.
Annular reentrant cavity filled with low melting point alloy for sealing and joining dissimilar materials - cryogenic applications
Structural joint developed for attachment of hypersonic control surface to aircraft wing structure. Transmits large torque loads from composite control surface and torque tube to wing structure through metallic attachment lug and collar. Torque load transmitted from tube to collar by series of radially oriented cleats. Bearing surfaces of cleats plane passing through center-line of torque tube. Such joints accommodate differential thermal growth between parts of dissimilar materials. Potential for application to high-temperature structural joints associated with hypervelocity vehicles.
The spectral overlay method is applied to examine the stress distribution along the interface between the two different materials. The essential feature of the spectral overlay method is that the high resolution of localized steep gradients can be achieved by overlaying a spectral interpolant on a standard finite element mesh. In order to evaluate this method and compare it with conventional finite element method, a test problem with high gradients in Poisson equation has been devised. The results show that this method is very powerful in capturing the shape of the gradient field and its peak value. Solutions for two problems with interfaces between dissimilar materials are then given to illustrate the effectiveness of this method.
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The plane elastostatic problem for bonded materials containing a flat inclusion is considered. It is assumed that the inclusion is located parallel to or on the interface and may be rigid or elastic with negligible bending rigidity. The integral equations for various cases are derived and their solutions are described. The stress state around the singular points are investigated and a pair of stress intensity factors similar to that for crack problems are defined. A series of numerical examples for two bonded half planes and for a half plane is worked out. The stress intensity factors are presented as functions of the ratio of the distance from the interface to the length of the inclusion.
Additional information was added to a growing data base from which estimates of finite element model complexities can be made with respect to thermal stress analysis. The manner in which temperatures were smeared to the finite element grid points was examined from the point of view of the impact on thermal stress calculations. The general comparison of calculated and measured thermal stresses is guite good and there is little doubt that the finite element approach provided by NASTRAN results in correct thermal stress calculations. Discrepancies did exist between measured and calculated values in the skin and the skin/frame junctures. The problems with predicting skin thermal stress were attributed to inadequate temperature inputs to the structural model rather than modeling insufficiencies. The discrepancies occurring at the skin/frame juncture were most likely due to insufficient modeling elements rather than temperature problems.
The present study was undertaken in order to develop test methods and procedures for measuring the variation of the stress intensity factor through the thickness in bimaterial specimens containing cracks within and parallel to the bond line using the frozen stress photoelastic method. Since stress freezing materials are incompressible above critical temperature, and since thick plates are to be employed which tend to produce a state of plane strain near the crack tip, the interface near tip fracture equations reduce to the classic form for homogeneous materials. Moreover, zero thickness interfaces do not exist when materials are bonded together. It was decided early on that it would be important to insure a uniform straight and accurate crack tip region through the thickness of the body to reduce scatter in the SIF distribution through the thickness. It was also observed that rubberlike materials which were desired to be modeled exhibited significant tip blunting prior to crack extension and that some blunting of the tip would provide a more realistic model. It should be noted that, in normal stress freezing photoelastic work, it is considered good practice to avoid utilizing data near bond lines in photoelastic models due to the bond line stresses which inevitably develop when two parts are bonded together. Thus, the present study involves certain exploratory aspects in deviating from standard practice in stress freezing work. With the above ideas in mind, several different test methods were investigated and are described in the following sections and appendices. The geometry selected for the program was a thick, edge cracked specimen containing a bond line.
Adhesively bonded lap joints involve dissimilar material junctions and sharp changes in geometry, possibly leading to premature failure. Although the finite element method is well suited to model the bonded lap joints, traditional finite elements are incapable of correctly resolving the stress state at junctions of dissimilar materials because of the unbounded nature of the stresses. In order to facilitate the use of bonded lap joints in future structures, this study presents a finite element technique utilizing a global (special) element coupled with traditional elements. The global element includes the singular behavior at the junction of dissimilar materials with or without traction-free surfaces.
Friction coefficients and wear characteristics for X-15 aircraft skid landing gear
Non-metallic solutions for Lunar bases are appealing due to their light weight and ability to block many forms of radiation. Composite materials made from different combinations of these non-metallic materials enable effective mating of dissimilar materials for strong structures such as pressurized habitats. Inserting and manufacturing composite structural materials on the Moon presents several challenges, however: the oxygen levels inside pressurized habitats will be relatively high, radiation that is blocked causes damage and the lack of atmosphere results in a high-magnitude negative pressure environment. In the past two years, the Materials and Processes Lab (EM01) invested in two internal research and development (IRAD) proposals for testing and procurement of composite materials. One proposal endeavors to determine flammability and radiation damage of various composite materials with a focus on carbon fiber and ultra-high molecular weight polyethylene (UHWMPE). The other proposal enables procurement of chopped fiber spray equipment materials which will be used to develop a novel technique for chopped UHMWPE fiber layup, similar to the chopped fiberglass layups used for making large structures such a boat hulls and hot tubs.
Nanolaminate manufacturing (NLM) is a new way of developing materials whose properties can far exceed those of homogeneous materials. Traditional alloys, composites and bulk laminates tend to average the properties of the materials from which they were made. With nanostructured materials, the high density of interfaces between dissimilar materials results in novel material properties. For example, materials made -from alternating nanoscale layers of metals and oxides have exhibited thermal conductivities far below those of the oxides themselves. Also, metallic nanolaminates can have peak strengths 100 times lager than the bulk constituent metals. Recent work at MSFC has focused on the development of nickel/aluminum oxide (Ni/Al2O3)) nanolaminates. Ni/Al2O3 nanolaminates are expected to have better strength, creep and fatigue resistance, oxygen compatibility, and corrosion resistance than the traditional metal-matrix composites of this material, which has been used in a variety of aerospace applications. A chemical vapor deposition (CW) system has been developed and optimized for the deposition of nanolaminates. Nanolaminates with layer thicknesses between 10 and 300 nm have been successfully grown and characterization has included scanning electron microscopy (SEM) and atomic force microscopy (AFM) Nanolaminates have a large variety of potential applications. They can be tailored to have both very small and anisotropic thermal conductivities and are promising as thermal coatings for both rock$ engine components and aerobraking structures. They also have the potential to be used in aerospace applications where strength at high temperatures, corrosion resistance or resistance to hydrogen embrittlement is important. Both CVD and magnetron sputtering facilities are available for the deposition of nanolayered materials. Characterization equipment includes SEM, AFM, X-ray diffraction, transmission electron microscopy, optical profilometry, and mechanical tensile pull testing.
Oxygen system components fabricated by Laser Engineered Net Shaping (TradeMark) (LENS(TradeMark)) could result in improved safety and performance. LENS(TradeMark) is a near-net shape manufacturing process fusing powdered materials injected into a laser beam. Parts can be fabricated with a variety of elemental metals, alloys, and nonmetallic materials without the use of a mold. The LENS(TradeMark) process allows the injected materials to be varied throughout a single workpiece. Hence, surfaces exposed to oxygen could be constructed of an oxygen-compatible material while the remainder of the part could be one chosen for strength or reduced weight. Unlike conventional coating applications, a compositional gradient would exist between the two materials, so no abrupt material boundary exists. Without an interface between dissimilar materials, there is less tendency for chipping or cracking associated with thermal-expansion mismatches.
Materials compatibility for space requirements, discussing shape retention, ductility, tensile strength, dissimilar materials stability, etc
An ever increasing number of applications require robust joining technologies of dissimilar materials. In this study, three types of ceramic composites (C-C, C-SiC, and SiC-SiC) were vacuum brazed to commercially pure Ti using the Cusil-ABA (63 Ag - 35.5 Cu - 1.75 Ti) active metal braze alloy. The study also compared composite specimens as-fabricated and after surface grinding/polishing. A butt-strap tensile shear strength test was used to evaluate the joined structures at room temperature, 270 and 500 C. The elevated temperatures represent possible use temperatures for some heat rejection type applications. Joint strength will be discussed in light of braze wetting and spreading properties, composite properties, and test temperature.
The development of more efficient thermoelectric couple technology capable of operating with high-grade heat sources up to 1,275 K is key to improving the performance of radioisotope thermoelectric generators. Lanthanum telluride La3-xTe4 and 14-1-11 Zintls (Yb14MnSb11) have been identified as very promising materials. The fabrication of advanced high-temperature thermoelectric couples requires the joining of several dissimilar materials, typically including a number of diffusion bonding and brazing steps, to achieve a device capable of operating at elevated temperatures across a large temperature differential (up to 900 K). A thermoelectric couple typically comprises a heat collector/ exchanger, metallic interconnects on both hot and cold sides, n-type and ptype conductivity thermoelectric elements, and cold-side hardware to connect to the cold-side heat rejection and provide electrical connections. Differences in the physical, mechanical, and chemical properties of the materials that make up the thermoelectric couple, especially differences in the coefficients of thermal expansion (CTE), result in undesirable interfacial stresses that can lead to mechanical failure of the device. The problem is further complicated by the fact that the thermoelectric materials under consideration have large CTE values, are brittle, and cracks can propagate through them with minimal resistance. The inherent challenge of bonding brittle, high-thermal-expansion thermoelectric materials to a hot shoe material that is thick enough to carry the requisite electrical current was overcome. A critical advantage over prior art is that this device was constructed using all diffusion bonds and a minimum number of assembly steps. The fabrication process and the materials used are described in the following steps: (1) Applying a thin refractory metal foil to both sides of lanthanum telluride. To fabricate the n-type leg of the advanced thermoelectric couple, the pre-synthesized lanthanum telluride coupon was diffusion bonded to the metal foil using a thin adhesion layer. (2) Repeating a similar process for the 14-1-11 Zintl p-type leg of the advanced thermoelectric couple. (3) Bonding thick CTE-matched metal plates on the metallized lanthanum telluride and Yb14MnSb11 to form the hot and cold sides of the thermoelectric couple. The calculated conversion efficiency of such an advanced couple would be about 10.5 percent, about 35 percent better than heritage radioisotope thermoelectric technology that relies on Si-Ge alloys. In addition, unlike Si-Ge alloys, these materials can be combined with many other thermoelectric materials optimized for operation at lower temperatures to achieve conversion efficiency in excess of 15 percent (a factor of 2 increase over heritage technology).
The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.