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At least 19 records

Evidence of Carrier Localization in InAsSb/InSb Digital Alloy nBn Detector

Recently we have demonstrated a novel method of extending the cut-off wavelength of InAsSb nBn detectors, by incorporating a series of monolayers of InSb. Here we study photoluminescence and minority carrier lifetime of this InAsSb/InSb digital alloy. While increasing temperature from 15 K to 40 K we show a 14 meV blue shift of the photoluminescence peak energy and a decrease in lifetime. This deviation from the expected Varshni empirical relation indicates strong carrier localization. We contrast to photoluminescence and lifetime results in bulk InAsSb. We discuss implications of this localization for design of digital alloy InAsSb/InSb nBn detectors.

Pepper, Brian J.

Digital Alloy Absorber for Photodetectors

In order to increase the spectral response range and improve the mobility of the photo-generated carriers (e.g. in an nBn photodetector), a digital alloy absorber may be employed by embedding one (or fraction thereof) to several monolayers of a semiconductor material (insert layers) periodically into a different host semiconductor material of the absorber layer. The semiconductor material of the insert layer and the host semiconductor materials may have lattice constants that are substantially mismatched. For example, this may performed by periodically embedding monolayers of InSb into an InAsSb host as the absorption region to extend the cutoff wavelength of InAsSb photodetectors, such as InAsSb based nBn devices. The described technique allows for simultaneous control of alloy composition and net strain, which are both key parameters for the photodetector operation.

Hill, Cory J.

Extended Cut-Off Wavelength nBn Detector Utilizing InAsSb/InSb Digital Alloy Absorber

We investigated a novel approach to extend a cut -off wavelength of Sb-based nBn detectors. We incorporated a series of single InSb monolayer into InAsSb bulk that allowed to realize a digital alloy absorber with an extended cut-off wavelength of λ = 4.6 μm at T = 200 K. The cut-off wavelength extension to 4.6μm is technologically important for realization of detectors covering CO2 absorption line at 4.26μm

InAsSb/InSb photodiodes

(abstract) Transmission Electron Microscopy of Al(sub x)Ga(sub 1-x)N/SiC Multilayer Structures

The potential of wide-band-gap III-V nitrides as solar-blind ultraviolet sensors and light emitters has prompted an increasing amount of work recently, including the fabrication of the first UV sensors from as-deposited single crystal GaN. We have used high resolution transmission electron microscopy (TEM) to study the microstructure of two novel developments of wide-band-gap III-V nitrides: the growth of ultra-short period GaN/AlN super lattices (digital alloys); and the incorporation of SiC layers into Al(sub x)Ga(sub 1-x)N structures. By varying the relative periods in a GaN/AlN superlattice, it should be possible to tailor the band gap of the composite to lie between the elemental values of 365 nm for GaN and 200 nm for AlN. The group IV semiconductor, SiC, has a close lattice match (< 3%) to Al(sub x)Ga(sub 1-x)N for growth on the basal plane. Demonstration of epitaxial growth for Al(sub x)Ga(sub 1-x)N/SiC multilayers could enable an extension of direct band-gap material towards the visible.

microscopy GaN AlN semiconductor SiC

Using Digital Image Correlation for Material Testing at Cryogenic Temperatures

Recent efforts were made to parametrize an aluminum alloy at cryogenic temperatures to calibrate finite element models simulating material deformation. Digital image correlation (DIC) was used to measure material properties using front/back strains of specimens during tensile tests. Data acquired from DIC was compared to physical extensometer measurements. Two camera pairs (front and back) were mounted via aluminum extrusion to the exterior of an environmental chamber of a hydraulic test stand. Images were taken through single-pane optical glass windows of the environment chamber. Positive pressure bags encased the cameras, attaching to the perimeter of the glass to keep out moisture and prevent windows from frosting. Figure 1 shows the environmental setup and the camera setup during cryogenic testing. Some of the challenges during testing at cryogenic temperatures include the gaseous flow of liquid nitrogen in the optical path of the mounted cameras, frost buildup on the windows as seen in Figure 1b, and frost on the test coupon. The temperature gradient present during the introduction of liquid nitrogen into the chamber can increase the projection error of images captured of the specimen. Figure 2 shows the estimated projection error from DIC as a function of temperature during the cool down process. This presentation addresses some of the concerns and observations when using DIC for testing at cryogenic temperatures using methods of isolated camera system and techniques for maintaining the glass panel clear from frost.

Joseph Cochran

Specific Volumes of the Zr(41.2)Ti(13.8)Cu(12.5)Ni(10.0)Be(22.5) Alloy in the Liquid, Glass, and Crystalline States

The specific volumes of the Zr(41.2)Ti(3.8)Cu(2.5)Ni(10.0)Be(22.5) alloy as a function of temperature, T, are determined by employing an image digitizing technique and numerical calculation methods applied to the electrostatically levitated spherical alloy. The linear fitting of the volumes of the alloy in the liquid, V(sub l), glass, V(sub g) and crystalline V(sub c), states in the temperature ranges shown in parentheses are V(sub l)(T) = 0.1583 + 8.877 x 10(exp -6) T(cu cm/g) (700-1300 K);V(sub g)(T) = 0.1603 + 5.528 x 10(exp -6) T (400-550 K);V(sub c)(T) = 0.1583 + 6.21 x 10(exp -6)T(400-850 K). The average volume thermal expansion coefficients within the temperature ranges are determined to be 5.32, 3.39. and 3.83 x 10(exp -5) (1/K) for the liquid, glass, and crystalline states, respectively.

Ohsaka, K.

Design and Development of CubeSat Solar Array Deployment Mechanisms Using Shape Memory Alloys

The Advanced eLectrical Bus (ALBus) project is a technology demonstration mission of a 3U CubeSat with an advanced, digitally controlled electrical power system capability and the novel use of Shape Memory Alloy (SMA) technology for reliable solar array (SA) deployable mechanisms. The ALBus CubeSat deploys four SAs in addition to the body-mounted arrays on each side of the CubeSat. A goal of the mission is to utilize the SMAs being developed at the NASA Glenn Research Center to deploy these SAs. The use of SMAs allows for the ability to test and reset the flight deployment mechanism prior to flight, which reduces the risk of in orbit deployment failures common to CubeSats. As a result, an SMA-driven Retention and Release (R&R) mechanism and an SMA-driven hinge were designed, developed, and integrated for flight. This paper summarizes the development of these mechanisms, types and functionalities of the SMAs used, as well as the lessons learned throughout the process.

cubesat

Design and Development of CubeSat Solar Array Deployment Mechanisms Using Shape Memory Alloys

The Advanced eLectrical Bus (ALBus) project is a technology demonstration mission of a 3-U CubeSat with an advanced, digitally controlled electrical power system capability and the novel use of Shape Memory Alloy (SMA) technology for reliable solar array deployable mechanisms. The ALBus cubesat has a need to deploy four solar arrays in addition to the body-mounted arrays on each side of the cubesat. A goal of the mission is to utilize the SMAs being developed at the NASA Glenn Research Center to deploy these solar arrays. The use of SMAs allows for the ability to test and reset the flight deployment mechanism prior to flight which reduces the risk of on orbit deployment failures common on cubesats. As a result, an SMA driven Retention and Release mechanism and an SMA driven hinge was designed, developed, and being prepared for flight. This paper summarized the development of these mechanisms, types and functionalities of SMAs used, and lessons learned throughout the process.

solar array deployment

Assessing Flow Formability of Aerospace Aluminum Alloys via DIC Tensile Testing

Over the past decade, NASA Langley Research Center (LaRC) has championed integrally stiffened cylinder (ISC) technology for single-piece, cryogenic tank barrels on launch vehicles. The current investigation aims to extend the hybrid spin/shear/flow forming process to aircraft fuselage structures, a damage tolerance critical application. The WF Maschinenbau VUD-600® vertical spin/flow forming facility recently established at LaRC represents a reasonable sub-scale facsimile of the ISC deformation process for research and development (R&D) purposes. The objective of this study is to explore whether tensile testing with digital image correlation (DIC) is an effective way to rank the formability of candidate aerospace Al alloys and expedite empirical forming trials. Specific tensile data, such as reduction of area, strain hardening exponent, and modulus of resilience, are used as formability metrics for a variety of alloy/temper/product form combinations. Results from high-strength aluminum alloys AA 2139, AA 2050, AA 2043 and AA 2219 are compared with the medium-strength, highly formable AA 6061 benchmark. Rolled, forged and cast preform materials in both the -O temper (fully annealed) and -T4 temper (solution-treated, quenched, and naturally aged) conditions are evaluated. AA 2139 plate in the -T4 temper emerges as the top-ranked material, based on the criteria selected. Starting with preforms in the -T4 temper will result in flow-formed material exhibiting mechanical properties closer to aircraft fuselage requirements. The optimum balance between strength and damage tolerance may also be achieved via post-forming procedures that avoid quenching and stretching.

Aluminum alloys

Empirical Study of the Multiaxial, Thermomechanical Behavior of NiTiHf Shape Memory Alloys

An empirical study was conducted to characterize the multiaxial, thermomechanical responses of new high temperature NiTiHf alloys. The experimentation included loading thin walled tube Ni(sub 50.3)Ti(sub 29.7)Hf(sub 20) alloy samples along both proportional and nonproportional axial-torsion paths at different temperatures while measuring surface strains using stereo digital image correlation. A Ni(sub 50.3)Ti(sub 33.7)Hf(sub 16) alloy was also studied in tension and compression to document the effect of slightly depleting the Hf content on the constitutive responses of NiTiHf alloys. Samples of both alloys were made from nearly texture free polycrystalline material processed by hot extrusion. Analysis of the data shows that very small changes in composition significantly alter NiTiHf alloy properties, as the austenite finish (Af) temperature of the 16-at Hf alloy was found to be approximately 60 C less than the 20-at Hf alloy (approximately 120 C vs. 180 C). In addition, the 16-at Hf alloy exhibited smaller compressive transformation strains (2 vs. 2.5 percent). Multi-axial characterization of the 20-at % Hf alloy showed that while the random polycrystal transformation strains in tension (4 percent) and compression (2.5 percent) are modest in comparison with binary NiTi (6 percent, 4 percent), the torsion performance is superior (7 vs. 4 shear strain width to the pseudoelastic plateau).

tensile deformation

Coupling Damage-Sensing Particles to the Digitial Twin Concept

The research presented herein is a first step toward integrating two emerging structural health management paradigms: digital twin and sensory materials. Digital twin is an emerging life management and certification paradigm whereby models and simulations consist of as-built vehicle state, as-experienced loads and environments, and other vehicle-specific history to enable high-fidelity modeling of individual aerospace vehicles throughout their service lives. The digital twin concept spans many disciplines, and an extensive study on the full domain is out of the scope of this study. Therefore, as it pertains to the digital twin, this research focused on one major concept: modeling specifically the as-manufactured geometry of a component and its microstructure (to the degree possible). The second aspect of this research was to develop the concept of sensory materials such that they can be employed within the digital twin framework. Sensory materials are shape-memory alloys that undergo an audible phase transformation while experiencing sufficient strain. Upon embedding sensory materials with a structural alloy, this audible transformation helps improve the reliability of crack detection especially at the early stages of crack growth. By combining these two early-stage technologies, an automated approach to evidence-based inspection and maintenance of aerospace vehicles is sought.

Hochhalter, Jacob