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At least 19 records

GRAPH — an readout ASIC for large MCP based detectors

We present a programmable 16 channel, mixed signal, low power readout ASIC, having the project historically named Gigasample Recorder of Analog waveforms from a PHotodetector (GRAPH). It is designed to read large aperture single photon imaging detectors using micro channel plates for charge multiplication, and measuring the detector's response on crossed strips anodes to extrapolate the incoming photon position. Each channel consists of a fast, low power and low noise charge sensitive amplifier, which provides a myriad of coarse and fine programmable options for gain and shaping settings. Further, the amplified signal is recorded using, to our knowledge novel, the Hybrid Universal sampLing Architecture (HULA) ADC. A kind of mixed signal double buffer memory, that enables concurrent waveform recording, and selected event digitized data extraction. The sampling frequency is freely adjustable between few kHz up to 125 MHz, while the chip's internal digital memory holds a history 2048 samples for each channel, with a digital headroom of 12 bits. An optimized region of interest sample-read algorithm allows to extract the information just around the event pulse peak, while selecting the next event, thus substantially reducing the operational dead time. The chip is designed in 130 nm TSMC CMOS technology, and its power consumption is around 47 mW per channel.

47 OTHER INSTRUMENTATION↗

Semiselective Optoelectronic Sensors for Monitoring Microbes

Sensor systems are under development for use in real-time detection and quantitation of microbes in water without need for sampling. These systems include arrays of optical sensors; miniature, portable electronic data-acquisition circuits; and optoelectronic interfaces between the sensor arrays and data-acquisition circuits. These systems are intended for original use in long-term, inline monitoring of waterborne micro-organisms in water-reclamation systems aboard future spacecraft. They could also be adapted to similar terrestrial uses with respect to municipal water supplies, stored drinking water, and swimming water; for detecting low-level biological contamination in biotechnological, semiconductor, and pharmaceutical process streams; and in verifying the safety of foods and beverages. In addition, they could be adapted to monitoring of airborne microbes and of surfaces (e.g., to detect and/or quantitate biofilms). The designs of the sensors in these systems are based partly on those of sensors developed previously for monitoring airborne biological materials. The designs exploit molecular- recognition and fluorescence-spectroscopy techniques, such that in the presence of micro-organisms of interest, fluorescence signals change and the changes can be measured. These systems are characterized as semiselective because they respond to classes of micro-organisms and can be used to discriminate among the classes. This semiselectivity is a major aspect of the design: It is important to distinguish between (1) the principle of detection and quantitation of classes of micro-organisms by use of these sensors and (2) the principle of detection and quantitation of individual microbiological species by means of prior immuno-diagnostic and/or molecular-biology techniques. Detection of classes (in contradistinction to species) is particularly valuable when the exact nature of a contaminant is unknown.

Tabacco, Mary Beth↗

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Chen, Liang-Yu↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗

Infrared Imaging System for Studying Brain Function

A proposed special-purpose infrared imaging system would be a compact, portable, less-expensive alternative to functional magnetic resonance imaging (fMRI) systems heretofore used to study brain function. Whereas a typical fMRI system fills a large room, and must be magnetically isolated, this system would fit into a bicycle helmet. The system would include an assembly that would be mounted inside the padding in a modified bicycle helmet or other suitable headgear. The assembly would include newly designed infrared photodetectors and data-acquisition circuits on integrated-circuit chips on low-thermal-conductivity supports in evacuated housings (see figure) arranged in multiple rows and columns that would define image coordinates. Each housing would be spring-loaded against the wearer s head. The chips would be cooled by a small Stirling Engine mounted contiguous to, but thermally isolated from, the portions of the assembly in thermal contact with the wearer s head. Flexible wires or cables for transmitting data from the aforementioned chips would be routed to an integrated, multichannel transmitter and thence through the top of the assembly to a patch antenna on the outside of the helmet. The multiple streams of data from the infrared-detector chips would be sent to a remote site, where they would be processed, by software, into a three-dimensional display of evoked potentials that would represent firing neuronal bundles and thereby indicate locations of neuronal activity associated with mental or physical activity. The 3D images will be analogous to current fMRI images. The data would also be made available, in real-time, for comparison with data in local or internationally accessible relational databases that already exist in universities and research centers. Hence, this system could be used in research on, and for the diagnosis of response from the wearer s brain to physiological, psychological, and environmental changes in real time. The images would also be stored in a relational database for comparison with corresponding responses previously observed in other subjects.

Mintz, Frederick↗

Data Compression in the NEXT-100 Data Acquisition System

NEXT collaboration detectors are based on energy measured by an array of photomultipliers (PMT) and topological event filtering based on an array of silicon photomultipliers (SiPMs). The readout of the PMT sensors for low-frequency noise effects and detector safety issues requires a grounded cathode connection that makes the readout AC-couple with variations in the signal baseline. Strict detector requirements of energy resolution better than 1% FWHM require a precise baseline reconstruction that is performed offline for data analysis and detector performance characterization. Baseline variations make it inefficient to apply traditional lossy data compression techniques, such as zero-suppression, that help to minimize data throughput and, therefore, the dead time of the system. However, for the readout of the SiPM sensors with less demanding requirements in terms of accuracy, a traditional zero-suppression is currently applied with a configuration that allows for a compression ratio of around 71%. The third stage in the NEXT detectors program, the NEXT-100 detector, is a 100 kg detector that instruments approximately five times more PMT sensors and twice the number of SiPM sensors than its predecessor, the NEXT-White detector, putting more pressure in the DAQ throughput, expected to be over 900 MB/s with the current configuration, which will worsen the dead time of the acquisition data system. This paper describes the data compression techniques applied to the sensor data in the NEXT-100 detector, which reduces data throughput and minimizes dead time while maintaining the event rate to the level of its predecessor, around 50 Hz.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Heterojunction bipolar transistor technology for data acquisition and communication

Heterojunction Bipolar Transistor (HBT) technology has emerged as one of the most promising technologies for ultrahigh-speed integrated circuits. HBT circuits for digital and analog applications, data conversion, and power amplification have been realized, with speed performance well above 20 GHz. At Rockwell, a baseline AlGaAs/GaAs HBT technology has been established in a manufacturing facility. This paper describes the HBT technology, transistor characteristics, and HBT circuits for data acquisition and communication.

Wang, C.↗

Wireless Data-Acquisition System for Testing Rocket Engines

A prototype wireless data-acquisition system has been developed as a potential replacement for a wired data-acquisition system heretofore used in testing rocket engines. The traditional use of wires to connect sensors, signal-conditioning circuits, and data acquisition circuitry is time-consuming and prone to error, especially when, as is often the case, many sensors are used in a test. The system includes one master and multiple slave nodes. The master node communicates with a computer via an Ethernet connection. The slave nodes are powered by rechargeable batteries and are packaged in weatherproof enclosures. The master unit and each of the slave units are equipped with a time-modulated ultra-wide-band (TMUWB) radio transceiver, which spreads its RF energy over several gigahertz by transmitting extremely low-power and super-narrow pulses. In this prototype system, each slave node can be connected to as many as six sensors: two sensors can be connected directly to analog-to-digital converters (ADCs) in the slave node and four sensors can be connected indirectly to the ADCs via signal conditioners. The maximum sampling rate for streaming data from any given sensor is about 5 kHz. The bandwidth of one channel of the TM-UWB radio communication system is sufficient to accommodate streaming of data from five slave nodes when they are fully loaded with data collected through all possible sensor connections. TM-UWB radios have a much higher spatial capacity than traditional sinusoidal wave-based radios. Hence, this TM-UWB wireless data-acquisition can be scaled to cover denser sensor setups for rocket engine test stands. Another advantage of TM-UWB radios is that it will not interfere with existing wireless transmission. The maximum radio-communication range between the master node and a slave node for this prototype system is about 50 ft (15 m) when the master and slave transceivers are equipped with small dipole antennas. The range can be increased by changing to larger antennas and/or greater transmission power. The battery life of a slave node ranges from about six hours during operation at full capacity to as long as three days when the system is in a "sleep" mode used to conserve battery charge during times between setup and rocket-engine testing. Batteries can be added to prolong operational lifetimes. The radio transceiver dominates the power consumption.

Lin, Chujen↗

Ampoule Failure System

An ampoule failure system for use in material processing furnaces comprising a containment cartridge and an ampoule failure sensor. The containment cartridge contains an ampoule of toxic material therein and is positioned within a furnace for processing. An ampoule failure probe is positioned in the containment cartridge adjacent the ampoule for detecting a potential harmful release of toxic material therefrom during processing. The failure probe is spaced a predetermined distance from the ampoule and is chemically chosen so as to undergo a timely chemical reaction with the toxic material upon the harmful release thereof. The ampoule failure system further comprises a data acquisition system which is positioned externally of the furnace and is electrically connected to the ampoule failure probe so as to form a communicating electrical circuit. The data acquisition system includes an automatic shutdown device for shutting down the furnace upon the harmful release of toxic material. It also includes a resistance measuring device for measuring the resistance of the failure probe during processing. The chemical reaction causes a step increase in resistance of the failure probe whereupon the automatic shutdown device will responsively shut down the furnace.

Watring, Dale A.↗

Low-cost sensor-based damage localization for large-area monitoring of FRP composites

Abstract In recent years, there has been growing interest in self-sensing structural materials across research and industry sectors. Detecting and locating structural damage typically requires numerous sensors wired to a data acquisition (DAQ) circuit, rendering implementation impractical in real structures. This paper proposes an innovative, cost-effective sensor network for damage detection and localization in fiber-reinforced polymer composites. The innovation encompasses three key elements: (1) utilizing carbon fiber tows within the composite as piezoresistive sensors, eliminating the need for additional foreign sensor devices; (2) introducing a novel sensor layout wherein sensor tow branches with varied resistance values are connected in parallel, reducing the number of connections to the DAQ circuit and cutting manufacturing costs significantly; (3) developing a practical sensor terminal fabrication technique to minimize manufacturing expenses. The proposed design methodology for the branch resistance values is first validated using a demonstration panel. Subsequently, the overall strategy is assessed by conducting impact tests on carbon and glass fiber-reinforced composite specimens. Results validate the sensor’s ability to accurately detect and locate structural damage.

Demo, Luke B. (ORCID:0000000208806522)↗

Prototype hardware design and testing of the global common module for the global trigger subsystem of the ATLAS phase-II upgrade

We report the High-Luminosity Large Hadron Collider (HL-LHC) will deliver more than ten times the integrated luminosity of the previous runs combined. Meeting its stricter throughput requirements poses new challenges to the Trigger and Data Acquisition (TDAQ) systems of the LHC experiments. Introduced in the framework of the ATLAS experiment’s HL upgrade, the Global Trigger (GT) is a new subsystem which will perform offline-like algorithms on full-granularity calorimeter data. The implementation of the GT’s functionality is firmware-focused and is composed of three layers: multiplexing (or data aggregating), global event processing, and demultiplexing interface to the central trigger processor. Each layer will be composed of several, similar nodes, hosted on replicas of identical hardware, the Global Common Module (GCM), an ATCA front board which is designed to be adopted throughout the entire GT subsystem. This article proceeds from the TWEPP 2021 conference and presents the GCM hardware design, performed in 2020, and focuses on some key results of its extensive testing performed in 2021.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

The Majorana Demonstrator readout electronics system

The M AJORANA D EMONSTRATOR comprises two arrays of high-purity germanium detectors constructed to search for neutrinoless double-beta decay in 76 Ge and other physics beyond the Standard Model. Its readout electronics were designed to have low electronic noise, and radioactive backgrounds were minimized by using low-mass components and low-radioactivity materials near the detectors. This paper provides a description of all components of the M AJORANA D EMONSTRATOR readout electronics, spanning the front-end electronics and internal cabling, back-end electronics, digitizer, and power supplies, along with the grounding scheme. The spectroscopic performance achieved with these readout electronics is also demonstrated.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗

The CMS Barrel Calorimeter Processor demonstrator (BCPv1) board evaluation

For the CERN LHC phase 2, the barrel region of the CMS electromagnetic (ECAL EB) and hadronic calorimeters (HCAL HB) require new back-end electronics for their readout. To this purpose, a first version of the ATCA-based blade, the Barrel Calorimeter Processor (BCPv1), has been developed. The performance of the optical links as well as clock distribution are also presented here. Here, the BCPv1 has been tested together with front-end and trigger boards, as well as with the new DAQ and TCDS Hub (DTH) [1], to demonstrate that the BCPv1 meets the required specifications.

47 OTHER INSTRUMENTATION↗

First operation of a multi-channel Q-Pix prototype: measuring transverse electron diffusion in a gas time projection chamber

We report measurements of the transverse diffusion of electrons in P-10 gas (90% Ar, 10% CH 4 ) in a laboratory-scale time projection chamber (TPC) utilizing a novel pixelated signal capture and digitization technique known as Q-Pix. The Q-Pix method incorporates a precision switched integrating transimpedance amplifier whose output is compared to a threshold voltage. Upon reaching the threshold, a comparator sends a 'reset' signal, initiating a discharge of the integrating capacitor. The time difference between successive resets is inversely proportional to the average current at the pixel in that time interval, and the number of resets is directly proportional to the total collected charge. We developed a 16-channel Q-Pix prototype fabricated from commercial off-the-shelf components and coupled them to 16 concentric annular anode electrodes to measure the spatial extent of the electron swarm that reaches the anode after drifting through the uniform field of the TPC. The swarm is produced at a gold photocathode using pulsed UV light. The measured transverse diffusion agrees with simulations in PyBoltz across a range of operating pressures (200–1500 Torr). These results demonstrate that a Q-Pix readout can successfully reconstruct the ionization topology in a TPC.

47 OTHER INSTRUMENTATION↗

Development of a strip-shaped X-ray mapping system for 9-cell superconducting cavities

Electrons emitted via field emission during superconducting (SC) radio-frequency (RF) cavity tests at vertical test stands often collide with the iris region inside the cavity, generating X-rays at these locations. In 1.3 GHz 9-cell SC RF cavities designed for the International Linear Collider (ILC), stiffener rings located outside the iris region between cells can interfere with X-ray detection, complicating the precise identification of field emission sites. Hence, in this study, we developed a high-density strip X-ray mapping systems (sX-map) that can be inserted into the iris region of ILC-type 9-cell SC RF cavities. This sX-map facilitates efficient and accurate detection of X-rays generated near the irises, unaffected by the presence of stiffener rings. The sX-map consisted of 32 sensors per strip, with sensors spaced approximately 10 mm apart. It was deployed in every iris of the 9-cell cavity, using a total of 320 sensors. A multiplexer was employed to facilitate the readout of a large number of detectors using a minimal number of signal lines, connecting the strips inside within the vertical test cryostat. In a vertical test conducted at Jefferson Lab (JLab), we demonstrated the capability of sX-map to detect X-rays despite the presence of a stiffener ring. This paper presents the detailed design of the sX-map and the results from the vertical test at JLab.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Rad-hard readout system for Timepix3 Hybrid Pixel Detectors

The Beam Gas Ionisation (BGI) profile monitor, located in the Proton Synchrotron (PS) and Super Proton Synchrotron (SPS) at CERN, requires a radiation-tolerant readout system to transfer data from the challenging accelerator surroundings to the back-end for processing. The system needs to control and acquire data from four Timepix3 Hybrid Pixel Detectors (HPDs) located directly inside the beam pipe, a highly radioactive environment. It must ensure reliability given limited hardware access and preserve signal integrity for the high-speed data (32 channels at 320 MHz). However, due to the unavailability of a suitable rad-hard Timepix3 readout, the Beam Instrumentation PiXeL (BIPXL) readout system was designed to meet these requirements. This system employs radiation-hardened components such as the GBTx and the FEASTMP, both developed at CERN. It will be compatible with forthcoming hybrid pixel detector initiatives in similarly harsh radiation conditions.

47 OTHER INSTRUMENTATION↗

Low power on-chip data transmission for wafer-scale monolithic active pixel sensors

Here, this paper details the implementation of the digital pulse shaping subsystem within the Backbone Transmission Line Encoding (BTLE) driver, a low-power, long-distance on-chip data transmission solution designed in a 65 nm CMOS process. Digital pulse shaping is critical for minimizing inter-symbol interference (ISI) caused by bandwidth limitations of on-chip interconnects, especially in wafer-scale monolithic active pixel sensors (MAPS). A duobinary encoder coupled with a parallelized polyphase finite impulse response (FIR) filter is used for efficient shaping of the transmitted signal spectrum. This reconfigurable architecture achieves reliable 160 Mb/s data transfer over a 10 cm on-chip link, as validated by simulations demonstrating low power consumption (FoM 37.3 fJ/bit/mm of transmission line length) and effective ISI mitigation.

47 OTHER INSTRUMENTATION↗