An Innovative Additive Manufacturing Technology for High Density Interconnects
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3D printing↗
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Results for “copper bumps”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Fabrication of a Hybrid Transition Edge Sensor Array for Lynx
Lynx is a proposed NASA X-Ray telescope flight mission aimed at achieving state-of-the-art angular and energy resolution with a 100 kilopixel array to probe the hot energetic young universe in unprecedented detail. To achieve these goals, our team plans on leveraging our current work in development of the focal plane for the Athena X-Ray Integral Field Unit (X-IFU) while advancing the state-of-the-art in transition edge sensor (TES) X-ray detector technology. The TES is an optimal technology for achieving both high energy and fine angular resolution at the same time because pixel features can be made extremely small and the absorber which dominates the heat capacity can be tuned to meet resolution requirements. Specifically, the proposed mission concept calls for a hybrid detector of three different arrays fabricated in the same planar process in one focal plane and optimized for different science goals. The main arrays consist of 5x5 hydras, 25 pixels of 4 micron thick Au absorbers each with a different thermal link to one common TES. The outer array has absorbers on a 50-micron pitch for most of the 5 arc-minute field-of-view, and the inner array has 25-micron absorbers for the central 1 arc-minute region. A high resolution array consisting of single pixel 1 micron thick Au absorbers on 50-micron pitch will lie off to the side. Reading out an array of this magnitude will likely require improvements in indium bump bonding to superconducting flexible wiring. Fabrication of absorbers of two different sizes requires electroplating through a photoresist mold by careful tuning of the current density to achieve uniform flat absorbers on a fine pitch scale, followed by ion milling to yield narrow streets separating the pixels while preserving high quantum efficiency. We report on progress made at fabricating the hybrid array with different absorber sizes and thicknesses. Further, we also report on ongoing work to adequately heat sink the pixels with backside wire bonding and copper coating. We also report on work to improve detector pixel yield and top side indium bump bonding to flexible wiring.
Focal plane array↗
Optimization of Geometric Perturbations on a Rod Moving Through a High Explosive Target
After completing a study to ensure the simulation results were converged, several high resolution 3D Smoothed Particle Hydrodynamic (SPH) simulations of copper rods impacting a high explosive (LX14) target were performed. This was then formulated into an optimization problem: I wanted to find the optimum shape and location of a perturbation on the rod that would maximize its erosion after it left the target. The shape of the perturbation was modeled as a 2D Gaussian bump and parameterized by its location along the rod axis (z 0 ) and amplitude (A). The final mass of the coherent part of the rod as it leaves the target was used as a metric to represent the erosion of the rod, and the optimization was formulated to maximize this metric with respect to the aforementioned design variables. Due to the expensive nature of the high-fidelity 3D SPH simulations, a surrogate model needed to be chosen so that many function calls to the optimizer would be feasible. Thus, a strategic full factorial sampling plan was chosen to build a dataset, which consisted of 24 high-fidelity simulations. Two surrogate models, a third order polynomial regression model and a Gaussian Process Model, were analyzed using a 14%/86% test/train holdout technique. The root mean square and R2 score of the test set was used to determine the best model, and the third order polynomial regression model was chosen as the surrogate model. Finally, the Nelder-Mead Simplex and Basin-hopping optimization algorithms were implemented, and it was found that the two algorithms gave slightly different optimum values. Nelder-Mead gave an optimum point of [z* 0 ;A*] = [9:9;0:4] and Basin-Hopping gave an optimum value of x* = [z* 0 ;A*] = [9:2;0:1].
45 MILITARY TECHNOLOGY, WEAPONRY, AND NATIONAL DEF↗
Friction Stir Welding of GR-Cop 84 for Combustion Chamber Liners
GRCop-84 is a copper-chromium-niobium alloy developed by the Glenn Research Center for liquid rocket engine combustion chamber liners. GRCop-84 exhibits superior properties over conventional copper-base alloys in a liquid hydrogen-oxygen operating environment. The Next Generation Launch Technology program has funded a program to demonstrate scale-up production capabilities of GR-Cop 84 to levels suitable for main combustion chamber production for the prototype rocket engine. This paper describes a novel method of manufacturing the main combustion chamber liner. The process consists of several steps: extrude the GR-Cop 84 powder into billets, roll the billets into plates, bump form the plates into cylinder halves and friction stir weld the halves into a cylinder. The cylinder is then metal spun formed to near net liner dimensions followed by finish machining to the final configuration. This paper describes the friction stir weld process development including tooling and non-destructive inspection techniques, culminating in the successful production of a liner preform completed through spin forming.
Russell, Carolyn K.↗
Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies
Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly in applications of the 2.5 and 3D integration, Cu is utilized in through-silicon-vias (TSVs) and flip chip interconnects between microelectronic chips for providing miniaturization, lower power and higher performance than current 2D packaging approaches. Furthermore, SnAg capped Cu pillars are a common high-density interconnect technology for flip chip bonding. For these interconnects, specific properties of the Cu surface, such as roughness and cleanliness, are an important factor in the process to ensure quality solder bumps. During electroplating, tight processing parameters must be met so that defects are avoided, and high bump uniformity is achieved. An understanding of the interactions at the solder and Cu pillar interface is needed, based on the electroplating parameters, to determine the best method for populating solder on the wafer surface. In this study, surface treatment techniques such as oxygen plasma cleaning were performed on the Cu surfaces and the SnAg plating chemistry for depositing the solder were evaluated through hull cell testing to qualitatively determine the range of current densities to investigate. It was observed that current density while plating played a large role in solder bump deposition morphology. At the higher current densities greater than 60 mA/cm 2 , bump height non-uniformity and dendritic growth are observed and at lower current densities, less than or equal to 60 mA/cm 2 , uniform, continuous bump height occurred.
36 MATERIALS SCIENCE↗