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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Chip Scale Package Issues

Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).

solder↗
NASA NTRS1998

Chip Scale Package Integrity Assessment by Isothermal Aging

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes. These test vehicles use numerous package types. To understand potential failure mechanisms of the packages, particularly solder ball attachment, the grid CSPs were subjected to environmental exposure. Package I/Os ranged from 40 to nearly 300. This paper presents both as assembled, up to 1, 000 hours of isothermal aging shear test results and photo micrographs, and tensile test results before and after 1,500 cycles in the range of -30/100 C for CSPs. Results will be compared to BGAs with the same the same isothermal aging environmental exposures.

Ghaffarian, Reza↗
NASA NTRS1999

Chip Scale Package Integrity Assessment by Isothermal Aging

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.

chipscale↗
NASA NTRS2016

Chip Scale Ultra-Stable Clocks: Miniaturized Phonon Trap Timing Units for PNT of CubeSats

The Chip Scale Ultra-Stable Clocks (CSUSC) project aims to provide a superior alternative to current solutions for low size, weight, and power timing devices. Currently available quartz-based clocks have problems adjusting to the high temperature and extreme acceleration found in space applications, especially when scaled down to match small spacecraft size, weight, and power requirements. The CSUSC project aims to utilize dual-mode resonators on an ovenized platform to achieve the exceptional temperature stability required for these systems. The dual-mode architecture utilizes a temperature sensitive and temperature stable mode simultaneously driven on the same device volume to eliminate ovenization error while maintaining extremely high performance. Using this technology it is possible to achieve parts-per-billion (ppb) levels of temperature stability with multiple orders of magnitude smaller size, weight, and power.

Dual-mode resonators↗
NASA NTRS1998

Chip Scale Package Implementation Challenges

The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100 C and 125 C and thermal cycling test results to 1,700 cycles in the range of -30 to 100 C.

Ghaffarian, Reza↗
NASA NTRS1999

Chip Scale Package Implementation Challenges

The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

chipscale↗
NASA NTRS2018

Low-Power, Chip-Scale, Carbon Dioxide Gas Sensors for Spacesuit Monitoring

N5 Sensors, Inc. through a Small Business Technology Transfer (STTR) contract award has been developing ultra-small, low-power carbon dioxide (CO2) gas sensors, suited for monitoring CO2 levels inside NASA spacesuits. Due to the unique environmental conditions within the spacesuits, such as high humidity, large temperature swings, and operating pressure swings, measurement of key gases relevant to astronaut's safety and health such as(CO2), is quite challenging. Conventional non-dispersive infrared absorption based CO2 sensors present challenges inside the spacesuits due to size, weight, and power constraints, along with the ability to sense CO2 in a high humidity environment. Unique chip-scale, nanoengineered chemiresistive gas-sensing architecture has been developed for this application, which can be operated in a typical space-suite environmental conditions. Unique design combining the selective adsorption properties of the nanophotocatalytic clusters of metal-oxides and metals, provides selective detection of CO2 in high relative humidity conditions. All electronic design provides a compact and low-power solution, which can be implemented for multipoint detection of CO2 inside the spacesuits. This paper will describe the sensor architecture, development of new photocatalytic material for better sensor response, and advanced structure for better sensitivity and shorter response times.

Rani, Asha↗
NASA NTRS2018

Low-Power, Chip-Scale, CO2 Gas Sensors for Spacesuit Monitoring

N5 Sensors, Inc. and NASA through a STTR program are jointly developing ultra-small, low-power carbon dioxide (CO2) gas sensors, suited for monitoring CO2 levels inside the spacesuits. Due to the unique environmental conditions within the spacesuits, such as high humidity, large temperature and operating pressure swings, measurement of key gases relevant to astronaut's safety and health such as carbon dioxide, is quite challenging. Conventional non-dispersive infrared absorption based CO2 sensors cannot be effectively implemented inside the spacesuits due to their sizes, weights, and power constraints. Metal-oxide based sensors have been effectively miniaturized for several applications, however detection of CO2 utilizing metal-oxide based sensors is challenging due to the chemical inertness and high stability of CO2 at room-temperatures. To mitigate these limitations, unique chip-scale, nanoengineered chemiresistive gas-sensing architecture has been developed - to allow the Metal-oxide sensors to operate in space-suite environmental conditions. Unique design combining the selective adsorption properties of the nanophotocatalytic clusters of metal-oxides and metals, provides selective detection of CO2 in high relative humidity conditions. All electronic design provides a compact and low-power solution, which can be implemented for multipoint detection of CO2 inside the spacesuits. This paper will describe a novel approach in refining the sensor architecture, development of new photocatalytic material for better sensor performance.

Thomson, Brian↗
NASA NTRS1999

3D Chip Scale Package (CSP)

Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.

Chip Scale Packaging (CSP) 3D CSP Stack TSOP D2CSP↗
NASA NTRS1997

A Review of Chip Scale Package Assembled Reliability

NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.

Chip Scale Packaging Microspacecraft↗