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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1967

Thermal contact resistance in vacuum.

Similar or dissimilar materials thermal contact resistance in vacuum with negligible film effect, obtaining constriction resistance

THERMAL CONDUCTOR↗
DOE OSTI2021

Cross-Code verification and sensitivity analysis to effectively model the electrothermal instability

This manuscript presents verification cases that are developed to study the electrothermal instability (ETI). Specific verification cases are included to ensure that the unit physics components necessary to model the ETI are accurate, providing a path for fluid-based codes to effectively simulate ETI in the linear and nonlinear growth regimes. Two software frameworks with different algorithmic approaches are compared for accuracy in their ability to simulate diffusion of a magnetic field, linear growth of the ETI, and a fully nonlinear ETI evolution. The nonlinear ETI simulations show early time agreement, with some differences emerging, as noted in the wavenumber spectrum, late into the nonlinear development of ETI. Here, a sensitivity study explores the role of equation-of-state (EOS), vacuum density, and vacuum resistivity. EOS and vacuum resistivity are found to be the most critical factors in the modeling of nonlinear ETI development.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2021

The Impact of Anomalous Resistivity in Vacuum Contaminant Plasmas on the Electrothermal Instability

This manuscript presents an assessment of the electrothermal instability (ETI) in the presence of anomalous resistivity (AR) in vacuum contaminant plasmas (VCP) when applied to a magnetized liner inertial fusion (MagLIF)-like load.Pulsed-power driven dielectrically coated metallic liners, like in MagLIF, experience the current-driven electrothermal instability which occurs when a material’s resistivity changes with temperature and is subject to ohmic heating. Large scale pulsed-power facilities that use magnetically insulated transmission lines (MITL) have been shown to generate low-density plasma which enters the target chamber and coalesces around the load. The low-density high-temperature vacuum contaminant plasmas (VCP) can parasitically divert current from the load through causing a short in the anode-cathode gap inside the target chamber. Resistive magnetohydrodynamic (MHD) simulations of these VCP experience unphysical runaway ohmic heating due to under predicting the resistivity by using a purely collisional resistivity model.AR provides a physics-based way to address this runaway heating through increasing the resistivity in a proportional way with the drift speed. In this work, 1D simulations probe the effect that AR in VCP has on the magnetic diffusion rate, and 2D simulations show how this effect manifests in the nonlinear striation form of the ETI for a MagLIF-like load. Beryllium and aluminum dielectrically coated liners are used for the 1D and 2D simulations in this work. The1D simulations show that a VCP causes a delay in the current delivery to the load by upwards of 8 ns at 60 ns into atypical current pulse for an 1 × 10 7 A scale pulsed-power accelerator. The 2D simulations show the delay observed in the 1D simulations is reduced substantially (4 ns) by 2D turbulence that disrupts the VCP layer early in time. Here, the 2Dsimulated ETI growth varies across AR models, more so for the beryllium liner than the aluminum liner because the beryllium liner shows an enhanced rate of penetration for the magnetic diffusion wave in comparison to the aluminum liner. The 2D simulations show the bulk dielectric thickness varies across AR models with the Davidson AR model beingthe largest and the Buneman AR model being the smallest, and in connection with the thickness the Rayleigh-Taylor bubble-spike distances varies correspondingly.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
NASA NTRS2005

Space Environmentally Durable Polyimides and Copolyimides

Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transition (T(sub g)) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides The polyimide materials can be processed into various material forms such as thin films, fibers, foams, threads, adhesive film, coatings, dry powders, and fiber coated prepreg, and uses include thin film membranes on antennas, second-surface mirrors, thermal optical coatings, and multilayer thermal insulation (MLI) blanket materials.

John W Connell↗
NASA NTRS2006

Space Environmentally Durable Polyimides and Copolyimides

Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transition (T(sub g)) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic &anhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides. The polyimide materials can be processed into various material forms such as thin films, fibers, foams, threads, adhesive film, coatings, dry powders, and fiber coated prepreg, and uses include thin film membranes on antennas, second-surface mirrors, thermal optical coatings, and multilayer thermal insulation (MLI) blanket materials.

Connell, John W.↗
NASA NTRSDate not supplied

Gaseous By-Product of Thermal Vacuum Processing of Lunar Highland Simulant

Scientists at Kennedy Space Center are advancing technologies to achieve oxygen extraction on the Lunar surface. One such technology is Molten Regolith Electrolysis (MRE) in which regolith simulant is melted under high temperatures to perform oxygen extraction through electrolysis of the melt pool. A study was conducted to understand the molten formation and proper-ties of Lunar Highlands Simulants (LHS-1) under high vacuum environments ranging between 10-6 Torr. These studies include investigating the regolith melt behavior and by-product gas analysis systems to prepare for pilot plant development and operations. The off-gassing rates and pressure build-up, gaseous compounds, and material compatibility may be a risk to MRE systems. The KSC findings are reported here for inclusion into future mis-sion architecture and operational planning. The four stages of the experiment were vacuum, resistive heating, regolith melt and gas detection. The regolith mass of 70 g was melted in a 40 cm tall x 50 cm diameter vacuum chamber at temperature increase rate 47 ℃ /min and ramp rate of 1 ampere/3 min up to an 18-amp maximum. The test is conducted for about 60 minutes and the constituent gases produced during heating of regolith is monitored with a re-sidual gas analyzer. During the molten formation, primary off-gassing volatiles included water vapor (18 amu), a peak at 44 amu (FeO2 – expected), and atomic oxygen (16 amu), among a series of other compounds that could create compatibility issues such as magnesium, chlorine, and silicon oxide. These results add to the knowledge required for successful oxygen extraction on the moon.

Molten Regolith Electrolysis↗
DOE OSTI2021

Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Stabach, Jennifer↗
NASA NTRS1987

Breakdown-Resistant RF Connectors for Vacuum

Resilient inserts compensate for insulation shrinkage. Coaxial-cable connector for radio-frequency (RF) energy resists electrical breakdown in vacuum. Used on RF equipment in vacuum chambers as well as in spaceborne radar and communication gear.

Caro, Edward R.↗