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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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Lunar TLP's and the Tectonic Processes of the Earth and the Moon

We study the transient lunar phenomena (TLP) as an indicator of lunar tectonic. Seismic phenomena can be used as a direct indicator of some tectonic activities of the planets The Moon-Earth gravitational interaction has been studied extensively as a triggering mechanism to geodynamics. In this work, we study the reverse interaction Earth-Moon in relation to the TLP activities. The lunar outgassing potentially is the leading cause for TLP activities resulting from the lunar interior's dynamic mechanism. We have studied Earth venting and earthquakes processes and have found that radon was frequently activated before significant seismic events due to Moon-Sun interaction with Earth (Ouzounov et al., 2018). Earthquake lights, an associated phenomenon reported before some major earthquakes, are analog to TLP activities on the moon. In 1972, N. Kozyrev suggested a possible moon response to the significant seismic events on Earth. To understand whether TLP's activities have any possible connection with Earth geodynamics, we perform a statistical check between the significant seismic activities from the NEIC catalog and lunar TLPs for 1907-1977 for four lunar areas :Aristarchus, Plato, Gassendi, and Alphonsus. We use TLP compiled catalog based on Middlehurst et al. (1968), Cameron (2006a,b), and Crotts (2008) catalogs. Our results revealed a causal relationship between significant earthquakes and TLP events. However, this relation varies from the location and depth of the seismic events. Deformation triggers the degassing process, and TLPs are indicators for those underlying activities. Our work can provide new information about the origin of TLP and the existence of a possible relationship between the tectonic processes of Earth and the Moon.

D Ouzonov↗

Evaluation of the Transient Liquid Phase (TLP) Bonding Process for Ti3Al-Based Honeycomb Core Sandwich Structure

The suitability of using transient liquid phase (TLP) bonding to fabricate honeycomb core sandwich panels with Ti-14Al-21Nb (wt%) titanium aluminide (T3Al) face sheets for high-temperature hypersonic vehicle applications was evaluated. Three titanium alloy honeycomb cores and one Ti3Al alloy honeycomb core were investigated. Edgewise compression (EWC) and flatwise tension (FWT) tests on honeycomb core sandwich specimens and tensile tests of the face sheet material were conducted at temperatures ranging from room temperature to 1500 F. EWC tests indicated that the honeycomb cores and diffusion bonded joints were able to stabilize the face sheets up to and beyond the face sheet compressive yield strength for all temperatures investigated. The specimens with the T3Al honeycomb core produced the highest FWT strengths at temperatures above 1000 F. Tensile tests indicated that TLP processing conditions resulted in decreases in ductility of the Ti-14Al-21Nb face sheets. Microstructural examination showed that the side of the face sheets to which the filler metals had been applied was transformed from equiaxed alpha2 grains to coarse plates of alpha2 with intergranular Beta. Fractographic examination of the tensile specimens showed that this transformed region was dominated by brittle fracture.

Bird, R. Keith↗

Embedded ESD Protection Proof of Concept

The purpose of this project is to characterize and correlate Electrostatic Discharge (ESD) sensitivity levels of an Integrated Circuit (IC) package using Transmission Line Pulse (TLP) and Human Body Model (HBM) methods. This characterization will be used as a baseline ESD sensitivity level to demonstrate improvement to the ESD sensitivity of the IC package through the use of EPI-FLO(Trade Mark) Polymer Voltage Suppression (PVS) protection devices developed and manufactured by Electronic Polymers, Inc. (EPI).

Human Body Model (HBM) methods↗

A Compact, Broadband Antenna for Planetary Surface-to-Surface Wireless Communications

The Compact Microstrip Monopole Antenna (CMMA) is a novel antenna design that combines a microstrip patch antenna with a three-dimensional structure to attain a highly directive, broadband, compact antenna. A Tri-Lobed Patch (TLP) was designed to minimize the patch's area while reducing the antenna's operating frequency. A Grounding Wall (GW) connects the patch to the ground plane and a Vertical Enclosure Wall (VEW) extends up away from portions of the patch's perimeter. This VEW supplies the antenna with a higher directivity in the radial direction as well as reduces the operating frequency. The CMMA was designed to operate at 2.23 GHz, but experimental results have shown this antenna resonates at 2.05 GHz which is on the order of approximately Lambda(sub o)/11.6 with respect to the antenna's largest dimension, with a directivity and bandwidth of 6.0 dBi, and 130 MHz (6.3 percent), respectively. This miniature, radially emitting antenna makes the CMMA attractive for planetary-based surface-to-surface communications.

Barr, Philip↗

Effect of Electrostatic Discharge on Electrical Characteristics of Discrete Electronic Components

This article reports on preliminary results of a study conducted to examine how temporary electrical overstress seed fault conditions in discrete power electronic components that cannot be detected with reliability tests but impact longevity of the device. These defects do not result in formal parametric failures per datasheet specifications, but result in substantial change in the electrical characteristics when compared with pristine device parameters. Tests were carried out on commercially available 600V IGBT devices using transmission line pulse (TLP) and system level ESD stress. It was hypothesized that the ESD causes local damage during the ESD discharge which may greatly accelerate degradation mechanisms and thus reduce the life of the components. This hypothesis was explored in simulation studies where different types of damage were imposed to different parts of the device. Experimental results agree qualitatively with the simulation for a number of tests which will motivate more in-depth modeling of the damage.

Wysocki, Phil↗

High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

Elmes, John↗