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Results for “Thin-Film Integration”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1976

Linear charge coupled device detector array for imaging light propagating in an integrated thin-film optical waveguide

Device design, fabrication, and operation of a linear charge coupled device (CCD) detector array integrated with a thin film optical waveguide and applications of this structure to integrated optical signal processing and fiber optical communications were discussed. A two phase, overlapping-gate CCD is connected in parallel by means of a series of gates to an array of photodiodes. The photodiode provides an electrode free surface region so that a highly efficient waveguide detector coupling technique can be implemented. A thermally-oxidized layer of SiO2 forms an effective substrate for the optical waveguide.

Chen, C. L.↗
NASA NTRS1971

Integrated thin film cadmium sulfide solar cell module

The design, development, fabrication and tests of flexible integrated thin-film cadmium sulfide solar cells and modules are discussed. The development of low cost and high production rate methods for interconnecting cells into large solar arrays is described. Chromium thin films were applied extensively in the deposited cell structures as a means to: (1) achieve high adherence between the cadmium sulfide films and the vacuum-metallized copper substrates, (2) obtain an ohmic contact to the cadmium sulfide films, and (3) improve the adherence of gold films as grids or contact areas.

Mickelsen, R. A.↗
NASA NTRS1984

Integrated optical signal processing with magnetostatic waves

Magneto-optical devices based on Bragg diffraction of light by magnetostatic waves (MSW's) offer the potential of large time-bandwidth optical signal processing at microwave frequencies of 1 to 20 GHz and higher. A thin-film integrated-optical configuration, with the interacting MSW and guided-optical wave both propagating in a common ferrite layer, is necessary to avoid shape-factor demagnetization effects. The underlying theory of the MSW-optical interaction is outlined, including the development of expressions for optical diffraction efficiency as a function of MSW power and other relevant parameters. Bradd diffraction of guided-optical waves by transversely-propagating magnetostatic waves and collinear TE/TM mode conversion included by MSW's have been demonstrated in yttrium iron garnet (YIG) thin films. Diffraction levels as large as 4% (7 mm interaction length) and a modulation dynamic range of approx 30 dB have been observed. Advantages of these MSW-based devices over the analogous acousto-optical devices include: much greater operating frequencies, tunability of the MSW dispersion relation by varying either the RF frequency or the applied bias magnetic field, simple broad-band MSW transducer structures (e.g., a single stripline), and the potential for very high diffraction efficiencies.

Fisher, A. D.↗
NASA NTRS1970

Energetic particles experiment instrumentation packaging program for IMP-F (Explorer 34) and IMP-G (Explorer 41) NASA Interplanetary Monitoring Platform program

The package design and assembly techniques for the IMP-F and IMP-G space-physics experiments, provided for the NASA Interplanetary Monitoring Platform Program are described. Thin-film, hybrid, integrated circuits used in these instruments to increase component density and reliability, and special procedures and precautions for the fabrication of space hardware are described.

Source record↗
NASA NTRS1986

Overview of advanced components for fiber optic systems

The basic operating principles and potential performance of several state-of-the-art fiber-optic devices are illustrated with diagrams and briefly characterized. Technologies examined include high-birefringence polarization-maintaining fibers and directional couplers, single-mode fiber polarizers and cut-off polarizers, optical-fiber modulators with radially poled piezoactive polymer (PVF2) jackets, and piezoelectric-squeezer polarization modulators. The need for improved manufacturing techniques to make such fiber-optic devices cost-competitive with their thin-film integrated-optics analogs is indicated.

Depaula, Ramon P.↗
NASA NTRS1977

Battery peak-charge voltage monitor

Monitor was designed for use on dual air density satellite, utilizing standard integrated circuit components, thin-film resistors network, plus several passive components. Device measures unit charge and holds data for transmission at later time.

Shull, T. A.↗
NASA NTRS1971

A generalized method of active RC network synthesis.

A completely general active RC network synthesis technique using a grounded gyrator and a summing amplifier is described. The technique overcomes serious limitations of previous RC-gyrator realizations and offers advantages o ver other general active RC synthesis methods. The technique is well suited for construction using thin-film RC networks and integrated circuit operational amplifiers, and provides a configuration which is quite insensitive to element variations.

Leach, D. P.↗
NASA NTRS1975

Battery peak charge voltage monitor for dual air density satellite

A battery peak charge voltage monitor was developed for use on the dual air density satellite (DADS). This device retains a reading of the maximum voltage reached by the spacecraft battery during periods of charging, and makes it available during periods of data transmission. The monitor is connected across the battery and operates solely from the battery; it is powered continuously with quiescent input current of only 3 milliamperes. Standard integrated circuits and a thin-film resistor network are utilized. The monitor occupies approximately 40 square centimeters of a printed-circuit board within a larger electronic package.

Shull, T. A.↗
NASA NTRS1973

Design, development, and fabrication of a electronic analog microminiaturized electronic analog signal to discrete time interval converter

The microminiaturization of an electronic analog signal to discrete time interval converter is presented. Discrete components and integrated circuits comprising the converter were assembled on a thin-film ceramic substrate containing nichrome resistors with gold interconnections. The finished assembly is enclosed in a flat package measuring 3.30 by 4.57 centimeters. The module can be used whenever conversion of analog to digital signals is required, in particular for the purpose of regulation by means of pulse modulation. In conjunction with a precision voltage reference, the module was applied to control the duty cycle of a switching regulator within a temperature range of -55 C to +125 C, and an input voltage range of 10V to 35V. The output-voltage variation was less than + or - 300 parts per million, i.e., less than + or - 3mV for a 10V output.

Schoenfeld, A. D.↗
NASA NTRS1988

Prototype thin-film thermocouple/heat-flux sensor for a ceramic-insulated diesel engine

A platinum versus platinum-13 percent rhodium thin-film thermocouple/heat-flux sensor was devised and tested in the harsh, high-temperature environment of a ceramic-insulated, low-heat-rejection diesel engine. The sensor probe assembly was developed to provide experimental validation of heat transfer and thermal analysis methodologies applicable to the insulated diesel engine concept. The thin-film thermocouple configuration was chosen to approximate an uninterrupted chamber surface and provide a 1-D heat-flux path through the probe body. The engine test was conducted by Purdue University for Integral Technologies, Inc., under a DOE-funded contract managed by NASA Lewis Research Center. The thin-film sensor performed reliably during 6 to 10 hr of repeated engine runs at indicated mean surface temperatures up to 950 K. However, the sensor suffered partial loss of adhesion in the thin-film thermocouple junction area following maximum cyclic temperature excursions to greater than 1150 K.

Kim, Walter S.↗
NASA NTRS1972

In-space fabrication of thin-film structures

A conceptual study of physical vapor-deposition processes for in-space fabrication of thin-film structures is presented. Potential advantages of in-space fabrication are improved structural integrity and surface reflectivity of free-standing ultra-thin films and coatings. Free-standing thin-film structures can find use as photon propulsion devices (solar sails). Other applications of the concept involve free-standing shadow shields, or thermal control coatings of spacecraft surfaces. Use of expendables (such as booster and interstage structures) as source material for the physical vapor deposition process is considered. The practicability of producing thin, textured, aluminum films by physical vapor deposition and subsequent separation from a revolving substrate is demonstrated by laboratory experiments. Heating power requirement for the evaporation process is estimated for a specific mission.

Lippman, M. E.↗
NASA NTRS1969

Dielectric materials for use in thin-film capacitors

Investigation report presents details of dielectric properties of various metals measured at 300 degrees K for thermally evaporated oxides from 300 to 6000 A in thickness. It is relevant to the medium of integrated circuitry.

Carr, H. E.↗
NASA NTRS1972

Low-sensitivity, frequency-selective amplifier circuits for hybrid and bipolar fabrication.

A network is described which is suitable for realizing a low-sensitivity high-Q second-order frequency-selective amplifier for high-frequency operation. Circuits are obtained from this network which are well suited for realizing monolithic integrated circuits and which do not require any process steps more critical than those used for conventional monolithic operational and video amplifiers. A single chip version using compatible thin-film techniques for the frequency determination elements is then feasible. Center frequency and bandwidth can be set independently by trimming two resistors. The frequency selective circuits have a low sensitivity to the process variables, and the sensitivity of the center frequency and bandwidth to changes in temperature is very low.

Pi, C.↗
NASA NTRS1987

Rectenna Technology Program: Ultra light 2.45 GHz rectenna 20 GHz rectenna

The program had two general objectives. The first objective was to develop the two plane rectenna format for space application at 2.45 GHz. The resultant foreplane was a thin-film, etched-circuit format fabricated from a laminate composed of 2 mil Kapton F sandwiched between sheets of 1 oz copper. The thin-film foreplane contains half wave dipoles, filter circuits, rectifying Schottky diode, and dc bussing lead. It weighs 160 grams per square meter. Efficiency and dc power output density were measured at 85% and 1 kw/sq m, respectively. Special testing techniques to measure temperature of circuit and diode without perturbing microwave operation using the fluoroptic thermometer were developed. A second objective was to investigate rectenna technology for use at 20 GHz and higher frequencies. Several fabrication formats including the thin-film scaled from 2.45 GHz, ceramic substrate and silk-screening, and monolithic were investigated, with the conclusion that the monolithic approach was the best. A preliminary design of the monolithic rectenna structure and the integrated Schottky diode were made.

Brown, William C.↗
NASA NTRS1984

Thin-film reliability and engineering overview

The reliability and engineering technology base required for thin film solar energy conversions modules is discussed. The emphasis is on the integration of amorphous silicon cells into power modules. The effort is being coordinated with SERI's thin film cell research activities as part of DOE's Amorphous Silicon Program. Program concentration is on temperature humidity reliability research, glass breaking strength research, point defect system analysis, hot spot heating assessment, and electrical measurements technology.

Ross, R. G., Jr.↗
NASA NTRS1985

Crystalline-silicon reliability lessons for thin-film modules

The reliability of crystalline silicon modules has been brought to a high level with lifetimes approaching 20 years, and excellent industry credibility and user satisfaction. The transition from crystalline modules to thin film modules is comparable to the transition from discrete transistors to integrated circuits. New cell materials and monolithic structures will require new device processing techniques, but the package function and design will evolve to a lesser extent. Although there will be new encapsulants optimized to take advantage of the mechanical flexibility and low temperature processing features of thin films, the reliability and life degradation stresses and mechanisms will remain mostly unchanged. Key reliability technologies in common between crystalline and thin film modules include hot spot heating, galvanic and electrochemical corrosion, hail impact stresses, glass breakage, mechanical fatigue, photothermal degradation of encapsulants, operating temperature, moisture sorption, circuit design strategies, product safety issues, and the process required to achieve a reliable product from a laboratory prototype.

Ross, R. G., Jr.↗